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公开(公告)号：US20180312782A1
公开(公告)日：2018-11-01
申请号：US15770241
申请日：2016-11-02
Applicant: BASF SE
Inventor： Arend Jouke KINGMA , Diana NEUMANN , Henning URCH
CPC classification number: C11D3/33 , C11D1/345 , C11D3/0073 , C11D3/042 , C11D3/164 , C11D3/2075 , C11D3/3409 , C11D3/362 , C11D3/3723 , C11D7/08 , C11D7/261 , C11D7/263 , C11D7/265 , C11D7/3245 , C11D7/34 , C11D7/36
Abstract: Aqueous formulations comprising (A) at least one organic complexing agent selected from (A1) alkali metal salts of aminopolycarboxylic acids and (A2) polymers bearing at least two —CH2—N(CH2COOH)-units per molecule, partially or fully neutralized with alkali, (B) at least one salt of at least one of the following acids: nitric acid, sulphuric acid, sulphamic acid, methanesulfonic acid, C1-C2-carboxylic acids, C2-C4-hydroxymonocarboxylic acids, C2-C7-dicarboxylic acids, unsubstituted or substituted with hydroxyl, and C4-C6-tricarboxylic acids, each unsubstituted or substituted with hydroxyl, (C) at least one compound selected from (C1) phosphoric acid C2-C10-monoalkyl esters, (C2) a C3-C10-alkynol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, and (C3) a C4-C10-alkynediol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, said aqueous formulations having pH values in the range of from 7.5 to 10.
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2.发明授权Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols 失效加工包含炔属二醇和/或醇的致密流体的基材公开(公告)号：US07211553B2
公开(公告)日：2007-05-01
申请号：US10737203
申请日：2003-12-16
Applicant: Hoshang Subawalla , Gene Everad Parris , Madhukar Bhaskara Rao , Christine Peck Kretz
Inventor： Hoshang Subawalla , Gene Everad Parris , Madhukar Bhaskara Rao , Christine Peck Kretz
IPC: C11D7/32
CPC classification number: C11D3/2031 , C11D1/72 , C11D3/164 , C11D3/2027
Abstract: A dense cleaning fluid for removing contaminants from a substrate and a method comprising same is disclosed herein. In one embodiment of the present invention, the dense cleaning fluid comprises a dense fluid and at least one acetylenic diol or acetylenic alcohol surfactant.
Abstract translation: 用于从基底去除污染物的致密清洁流体及其包含方法在此公开。 在本发明的一个实施方案中，致密清洁流体包含致密流体和至少一种炔属二醇或炔属醇表面活性剂。
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3.发明申请公开(公告)号：US20070006894A1
公开(公告)日：2007-01-11
申请号：US11519476
申请日：2006-09-12
Applicant: Peng Zhang , Brenda Ross
Inventor： Peng Zhang , Brenda Ross
CPC classification number: H01L21/02074 , C11D1/08 , C11D1/40 , C11D1/72 , C11D3/164 , C11D11/0047 , Y10S134/902
Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.
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4.发明申请Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols 审中-公开包含炔属二醇和/或醇的致密流体的半导体衬底的加工公开(公告)号：US20050029492A1
公开(公告)日：2005-02-10
申请号：US10635046
申请日：2003-08-05
Applicant: Hoshang Subawalla , Gene Parris , Christopher Mammarella , Bridget O'Brien , Keith Fabregas , Madhukar Rao , Christine Kretz
Inventor： Hoshang Subawalla , Gene Parris , Christopher Mammarella , Bridget O'Brien , Keith Fabregas , Madhukar Rao , Christine Kretz
CPC classification number: C11D3/2031 , C11D1/72 , C11D3/164 , C11D3/2027
Abstract: A dense cleaning fluid for removing contaminants from an substrate and a method comprising same is disclosed herein. In one embodiment of the present invention, the dense cleaning fluid comprises a dense fluid and at least one acetylenic diol or acetylenic alcohol surfactant.
Abstract translation: 本文公开了用于从基底去除污染物的致密清洁流体和包含其的方法。 在本发明的一个实施方案中，致密清洁流体包含致密流体和至少一种炔属二醇或炔属醇表面活性剂。
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公开(公告)号：US06717019B2
公开(公告)日：2004-04-06
申请号：US10060679
申请日：2002-01-30
Applicant: Kevin Rodney Lassila
Inventor： Kevin Rodney Lassila
IPC: C07C4314
CPC classification number: C08L71/02 , C08G65/22 , C08G65/2609 , C08G2650/60 , C09D171/02 , C11D1/72 , C11D1/722 , C11D3/164
Abstract: The present invention pertains to glycidyl ether-capped acetylenic diol ethoxylates having a structure according to the formula: wherein R1 is hydrogen or a linear, branched, or cyclic alkyl group having from 1 to about 6 carbon atoms; R2 is a linear, branched, or cyclic alkyl group having from 1 to about 12 carbon atoms; R3=—CH2OR4; R4 is a linear, branched, or cyclic alkyl, alkenyl, aryl, or aralkyl group having from 2 to about 30 carbon atoms; (n+m) is from 1 to about 100; and (p+q) is from 0.5 to about 5 and its use to reduce equilibrium and dynamic surface tension in water-based compositions containing an organic or inorganic compound, particularly aqueous organic coating, ink, acid gas scrubbing and agricultural compositions.
Abstract translation: 本发明涉及具有下式结构的缩水甘油醚封端炔属二醇乙氧基化物：其中R 1是氢或具有1至约6个碳原子的直链，支链或环状烷基; R 2是具有1至约12个碳原子的直链，支链或环状烷基; R 3 = -CH 2 OR 4; R 4是具有2至约30个碳原子的直链，支链或环状烷基，烯基，芳基或芳烷基; （n + m）为1〜约100; 和（p + q）为0.5至约5，并且其用于减少含有机或无机化合物，特别是水性有机涂料，油墨，酸性气体洗涤剂和农用组合物的水基组合物中的平衡和动态表面张力。
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Patent Agency Ranking
公开(公告)号：US20150322375A1
公开(公告)日：2015-11-12
申请号：US14801767
申请日：2015-07-16
Applicant: FIRMENICH SA
Inventor： Christian CHAPUIS
CPC classification number: C11B9/0007 , C11D3/001 , C11D3/164 , C11D3/184 , C11D3/50
Abstract: A method of use, as a perfuming ingredient, of a compound of formula I in the form of any one of its stereoisomers or a mixture thereof, and wherein each R1 represents a hydrogen atom or a methyl group and at least one of said R1 is a hydrogen atom; R2 represents a linear or branched C3-8 alkyl group or unsaturated groups; and R3 represents a hydrogen atom or a methyl group. These compounds impart odor notes of the violet leaves type optionally together with green odor notes.
Abstract translation: 使用其任何一种立体异构体或其混合物形式的式I化合物作为加香成分的方法，其中每个R 1表示氢原子或甲基，并且所述R 1中的至少一个是 氢原子; R2表示直链或支链C 3-8烷基或不饱和基团; 并且R 3表示氢原子或甲基。 这些化合物赋予紫色叶子类型的气味，同时带有绿色气味。
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公开(公告)号：US20110275548A1
公开(公告)日：2011-11-10
申请号：US13123429
申请日：2009-10-12
Applicant: Werner Handl , Franz Mayr
Inventor： Werner Handl , Franz Mayr
IPC: C10M125/02 , C09K3/00
CPC classification number: C23F11/10 , C09D5/084 , C09K5/10 , C10M173/02 , C10M2201/041 , C10M2201/061 , C10M2201/103 , C10M2201/105 , C10M2207/022 , C10M2207/126 , C10M2209/04 , C10M2209/12 , C10M2227/061 , C10N2220/022 , C10N2220/082 , C10N2230/06 , C10N2230/40 , C10N2230/64 , C11D3/0073 , C11D3/164 , C11D3/166 , C23F11/08 , C23F11/124 , C10N2210/03 , C10N2210/02
Abstract: The invention relates to an anticorrosive agent for metal components. In order to provide an environmentally compatible anticorrosive agent which can be applied to metal components without components having to be freed of the anticorrosive agent before installation, allows good coating even on oily surfaces, has a great anticorrosive effect and is also compatible with aqueous lubricant compositions, it is provided according to the invention that the anticorrosive agent comprises (in percent by weight): a) more than 50% water, b) a surfactant; c) a boric acid derivative; d) a platelet-like or rod-like filler; e) optionally a binder; f) optionally a carboxylic acid salt.
Abstract translation: 本发明涉及金属组分的防腐剂。 为了提供一种环保相容的防锈剂，其可以应用于金属组分，而不需要在安装之前不含防锈剂的组分，即使在油性表面上也能得到良好的涂层，具有很好的防腐蚀作用，并且还与水性润滑剂组合物相容 根据本发明提供的防腐剂包含（重量百分比）：a）大于50％的水，b）表面活性剂; c）硼酸衍生物; d）片状或棒状填料; e）任选的粘合剂; f）任选的羧酸盐。
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公开(公告)号：US07485611B2
公开(公告)日：2009-02-03
申请号：US10249763
申请日：2003-05-06
Applicant: Jeffrey F. Roeder , Thomas H. Baum , Matthew Healy , Chongying Xu
Inventor： Jeffrey F. Roeder , Thomas H. Baum , Matthew Healy , Chongying Xu
IPC: H01L21/302
CPC classification number: C11D3/28 , C11D1/004 , C11D3/02 , C11D3/164 , C11D3/187 , C11D3/2072 , C11D3/2093 , C11D3/245 , C11D3/43 , C11D7/02 , C11D7/247 , C11D7/261 , C11D7/264 , C11D7/266 , C11D7/28 , C11D7/3281 , C11D7/50 , C11D11/0047 , G03F7/422 , G03F7/427 , H01L2224/16225
Abstract: Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one β-diketone.
Abstract translation: 使用超临界流体（例如超临界二氧化碳）从微电子器件结构和工艺设备中除去不想要的材料的组合物和方法。 这种类型的一种组合物，具有用于去除焊剂和焊料进行表面膜的实用性，包括超临界流体，例如超临界CO 2和有机共溶剂，例如二甲苯。 具有用于从半导体衬底去除金属，金属氧化物，含金属的蚀刻后残余物和CMP颗粒的这种类型的另一种组合物包括超临界流体和至少一种β-二酮。
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9.发明授权Process solutions containing surfactants used as post-chemical mechanical planarization treatment 有权含有表面活性剂的工艺溶液用作后化学机械平面化处理公开(公告)号：US07208049B2
公开(公告)日：2007-04-24
申请号：US10689402
申请日：2003-10-20
Applicant: Peng Zhang , Brenda Faye Ross
Inventor： Peng Zhang , Brenda Faye Ross
IPC: C23G1/00
CPC classification number: H01L21/02074 , C11D1/08 , C11D1/40 , C11D1/72 , C11D3/164 , C11D11/0047 , Y10S134/902
Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.
Abstract translation: 使用包含一种或多种表面活性剂的工艺溶液来减少半导体器件制造中的缺陷数量。 在某些优选的实施方案中，本发明的方法溶液可以在CMP处理过程中或之后用作冲洗溶液时减少缺陷。 还公开了使用本发明的处理溶液来减少多个后CMP处理基板上的缺陷数量的方法。
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公开(公告)号：US3816322A
公开(公告)日：1974-06-11
申请号：US29432772
申请日：1972-10-02
Applicant: DOW CHEMICAL CO
Inventor： GRIFFIN T , DOLLARHIDE F
CPC classification number: C23F11/04 , C11D3/0073 , C11D3/042 , C11D3/164 , C11D3/2079 , C11D3/28 , C11D7/08 , Y10S507/934
Abstract: Iron surfaces are protected against corrosion by aqueous acidic solutions containing a polyhydric compound or derivative thereof by dispersing into the corrosive solution which will contact the metal surface an effective amount of a heterocyclic amine, an acetylenic alcohol and an ionizable iodine containing compound.
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