Intelligent binning for electrically repairable semiconductor chips
    1.
    发明授权
    Intelligent binning for electrically repairable semiconductor chips 有权
    用于电可修复半导体芯片的智能合并

    公开(公告)号:US06219810B1

    公开(公告)日:2001-04-17

    申请号:US09523579

    申请日:2000-03-10

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    IPC分类号: G06F1100

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable. The semiconductor device may be binned differently depending on the number of identified failures. The decision circuitry may designate the semiconductor device for an additional procedure, if the number of the identified failures is within a first number set. The decision circuitry may designate the semiconductor device for repair, if the number of the identified failures is within a second number set. The decision circuitry designate the semiconductor device for additional tests of the first type, if the number of the identified failures is within a third number set. The tests of a first type may be a hot sort procedure and the additional tests may be a cold final procedure.

    摘要翻译: 本发明涉及用于测试一个或多个半导体器件(例如封装芯片)的系统和方法。 测试设备至少执行半导体器件上的第一类测试,并识别半导体器件中的故障(如果有的话)。 确定了一些故障。 在存在某些故障的情况下,决定电路确定重复测试或修复半导体器件是否更有效,如果它是可修复的。 取决于所识别的故障的数量,半导体器件可以不同地分箱。 如果所识别的故障的数量在第一数量集合内,则决定电路可以指定用于附加过程的半导体器件。 如果所识别的故障的数量在第二数量集合内,则决定电路可以指定用于修复的半导体器件。 如果所识别的故障的数量在第三数量集合内,则决定电路指定用于第一类型的附加测试的半导体器件。 第一种类型的测试可能是热分类程序,附加测试可能是一个冷的最终程序。

    Intelligent binning for electrically repairable semiconductor chips
    3.
    发明授权
    Intelligent binning for electrically repairable semiconductor chips 失效
    用于电可修复半导体芯片的智能合并

    公开(公告)号:US06321353B2

    公开(公告)日:2001-11-20

    申请号:US09758868

    申请日:2001-01-10

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    IPC分类号: H04B1700

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.

    摘要翻译: 本发明涉及用于测试一个或多个半导体器件(例如封装芯片)的系统和方法。 测试设备至少执行半导体器件上的第一类测试,并识别半导体器件中的故障(如果有的话)。 确定了一些故障。 在存在某些故障的情况下,决定电路确定重复测试或修复半导体器件是否更有效,如果它是可修复的。

    Intelligent binning for electrically repairable semiconductor chips

    公开(公告)号:US5764650A

    公开(公告)日:1998-06-09

    申请号:US691335

    申请日:1996-08-02

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g. packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable. The semiconductor device may be binned differently depending on the number of identified failures. The decision circuitry may designate the semiconductor device for an additional procedure, if the number of the identified failures is within a first number set. The decision circuitry may designate the semiconductor device for repair, if the number of the identified failures is within a second number set. The decision circuitry designate the semiconductor device for additional tests of the first type, if the number of the identified failures is within a third number set. The tests of a first type may be a hot sort procedure and the additional tests may be a cold final procedure.

    Intelligent binning for electrically repairable semiconductor chips
    5.
    发明授权
    Intelligent binning for electrically repairable semiconductor chips 失效
    用于电可修复半导体芯片的智能合并

    公开(公告)号:US07237158B2

    公开(公告)日:2007-06-26

    申请号:US10608798

    申请日:2003-06-26

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    IPC分类号: G01R31/28 G06F11/00

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures are determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.

    摘要翻译: 本发明涉及用于测试一个或多个半导体器件(例如封装芯片)的系统和方法。 测试设备至少执行半导体器件上的第一类测试,并识别半导体器件中的故障(如果有的话)。 确定了一些故障。 在存在某些故障的情况下,决定电路确定重复测试或修复半导体器件是否更有效,如果它是可修复的。

    Intelligent binning for electrically repairable semiconductor chips
    6.
    发明授权
    Intelligent binning for electrically repairable semiconductor chips 失效
    用于电可修复半导体芯片的智能合并

    公开(公告)号:US6138256A

    公开(公告)日:2000-10-24

    申请号:US49457

    申请日:1998-03-27

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g. packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable. The semiconductor device may be binned differently depending on the number of identified failures. The decision circuitry may designate the semiconductor device for an additional procedure, if the number of the identified failures is within a first number set. The decision circuitry may designate the semiconductor device for repair, if the number of the identified failures is within a second number set. The decision circuitry designate the semiconductor device for additional tests of the first type, if the number of the identified failures is within a third number set. The tests of a first type may be a hot sort procedure and the additional tests may be a cold final procedure.

    摘要翻译: 本发明涉及用于测试一个或多个半导体器件(例如封装芯片)的系统和方法。 测试设备至少执行半导体器件上的第一类测试,并识别半导体器件中的故障(如果有的话)。 确定了一些故障。 在存在某些故障的情况下,决定电路确定重复测试或修复半导体器件是否更有效,如果它是可修复的。 取决于所识别的故障的数量,半导体器件可以不同地分箱。 如果所识别的故障的数量在第一数量集合内,则决定电路可以指定用于附加过程的半导体器件。 如果所识别的故障的数量在第二数量集合内,则决定电路可以指定用于修复的半导体器件。 如果所识别的故障的数量在第三数量集合内,则决定电路指定用于第一类型的附加测试的半导体器件。 第一种类型的测试可能是热分类程序,附加测试可能是一个冷的最终程序。

    Intelligent binning for electrically repairable semiconductor chips and method
    10.
    发明授权
    Intelligent binning for electrically repairable semiconductor chips and method 失效
    用于电可修复半导体芯片的智能合并和方法

    公开(公告)号:US06523144B2

    公开(公告)日:2003-02-18

    申请号:US09943777

    申请日:2001-08-30

    申请人: Brett M. Debenham

    发明人: Brett M. Debenham

    IPC分类号: H04B1700

    摘要: The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.

    摘要翻译: 本发明涉及用于测试一个或多个半导体器件(例如封装芯片)的系统和方法。 测试设备至少执行半导体器件上的第一类测试,并识别半导体器件中的故障(如果有的话)。 确定了一些故障。 在存在某些故障的情况下,决定电路确定重复测试或修复半导体器件是否更有效,如果它是可修复的。