EMPTY SHELL RECOVERY DEVICE
    1.
    发明申请
    EMPTY SHELL RECOVERY DEVICE 有权
    空壳恢复装置

    公开(公告)号:US20110233870A1

    公开(公告)日:2011-09-29

    申请号:US13130655

    申请日:2009-12-23

    CPC classification number: F41J13/00

    Abstract: The present invention relates to a device for collecting empty shells that have been used at a shooting range and specifically to an empty shell recovery device of low operating cost. To achieve the above, the empty shell recovery device according to an embodiment of the present invention is furnished with absorption panels that are isolated from each other and inserted into sliding grooves of side plates facing each other to enable replacement and absorb the kinetic energy of an empty shell, an empty shell collection part that is inserted into the rear of the side plate and furnished with an escape prevention panel that prevents empty shells from escaping, and an empty shell discharge part that collects empty shells falling from the empty shell collection part downward and discharges them. Thus empty shells used at a shooting range are collected and recycling of empty shells is made possible.

    Abstract translation: 本发明涉及一种用于收集在拍摄范围内使用的空壳的装置,具体涉及低运行成本的空壳回收装置。 为了实现上述目的,根据本发明的实施例的空壳回收装置具有彼此隔离并插入到彼此面对的侧板的滑动槽中的吸收板,以能够更换和吸收 空壳体,插入侧板后部的空壳体收集部件,并配备防止空壳逃逸的防漏板,以及从空壳收集部件向下收集空壳的空壳排出部 并放电。 因此,在拍摄范围内使用的空壳被收集,空壳的回收成为可能。

    Non-volatile memory device and method of fabricating the same
    2.
    发明授权
    Non-volatile memory device and method of fabricating the same 失效
    非易失性存储器件及其制造方法

    公开(公告)号:US07586137B2

    公开(公告)日:2009-09-08

    申请号:US11200491

    申请日:2005-08-09

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.

    Abstract translation: 提供了具有非对称沟道结构的非易失性存储器件。 非易失性存储器件包括形成在半导体衬底中并掺杂有n型杂质的半导体衬底,源极区和漏极区,包括隧穿层的俘获结构,其被布置在 半导体衬底和通过其电荷载流子被隧道化;以及电荷俘获层,其形成在隧穿层上并俘获隧穿电荷载流子;形成在俘获结构和暴露的半导体衬底上的栅极绝缘层,栅极 形成在栅极绝缘层上的电极和形成在源极区域和漏极区域之间的沟道区域,并且包括形成在捕获结构的下部的第一沟道区域和形成在栅极绝缘层的下部的第二沟道区域 所述第一沟道区的阈值电压低于所述第二沟道区的阈值电压。

    NON-VOLATILE MEMORY DEVICE WITH BURIED CONTROL GATE AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    NON-VOLATILE MEMORY DEVICE WITH BURIED CONTROL GATE AND METHOD OF FABRICATING THE SAME 失效
    带有控制门的非易失性存储器件及其制造方法

    公开(公告)号:US20080286927A1

    公开(公告)日:2008-11-20

    申请号:US12183553

    申请日:2008-07-31

    CPC classification number: H01L29/42352 H01L21/28282 H01L29/7923 Y10S438/954

    Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

    Abstract translation: 在具有埋地控制栅极的非易失性存储器件中,增加控制栅极的有效沟道长度以限制穿通,并且增加用于存储电荷的区域以获得有利的大容量。 一种制造存储器件的方法包括:在形成于半导体衬底中的沟槽内形成控制栅极,并以自对准的方式在控制栅极两侧的半导体衬底中形成电荷存储区域,从而允许多级 电池操作。

    Non-volatile memory device with buried control gate and method of fabricating the same
    4.
    发明申请
    Non-volatile memory device with buried control gate and method of fabricating the same 失效
    具有埋地控制栅极的非易失性存储器件及其制造方法

    公开(公告)号:US20060141708A1

    公开(公告)日:2006-06-29

    申请号:US11248691

    申请日:2005-10-12

    CPC classification number: H01L29/42352 H01L21/28282 H01L29/7923 Y10S438/954

    Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

    Abstract translation: 在具有埋地控制栅极的非易失性存储器件中,增加控制栅极的有效沟道长度以限制穿通,并且增加用于存储电荷的区域以获得有利的大容量。 一种制造存储器件的方法包括:在形成于半导体衬底中的沟槽内形成控制栅极,并以自对准的方式在控制栅极两侧的半导体衬底中形成电荷存储区域,从而允许多级 电池操作。

    Spinning apparatus
    5.
    发明申请

    公开(公告)号:US20060081338A1

    公开(公告)日:2006-04-20

    申请号:US11253773

    申请日:2005-10-18

    CPC classification number: C03C15/00 H01L21/6708

    Abstract: In an embodiment, a spinning apparatus includes a spin table on which an object to be etched is placed, a rotation unit rotating the spin table, and a nozzle unit including a center nozzle, disposed on the central portion of the spin table, and at least one side nozzle, disposed on an edge of the spin table. Etching uniformity is improved over the conventional art because an etching chemical is distributed more evenly by the nozzle unit as the object to be etched is rotated. An embodiment may also include an exhaust to remove excess etching chemical.

    Non-volatile memory device having a charge storage oxide layer and operation thereof
    6.
    发明申请
    Non-volatile memory device having a charge storage oxide layer and operation thereof 失效
    具有电荷存储氧化物层的非易失性存储器件及其操作

    公开(公告)号:US20050184334A1

    公开(公告)日:2005-08-25

    申请号:US11047764

    申请日:2005-02-02

    CPC classification number: H01L29/7923 H01L21/28282 H01L29/66833 H01L29/792

    Abstract: A non-volatile memory device includes a pair of source/drain regions disposed in a semiconductor substrate, having a channel region between them. A charge storage oxide layer is disposed on the channel region and overlaps part of each of the pair of source/drain regions. A gate electrode is disposed on the charge storage oxide layer. At least one halo implantation region is formed in the semiconductor substrate adjacent to one of the pair of source/drain regions, and overlapping the charge storage oxide layer. A program operation is performed by trapping electrons in the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed, and an erase operation is performed by injecting holes into the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed.

    Abstract translation: 非易失性存储器件包括设置在半导体衬底中的一对源极/漏极区域,它们之间具有沟道区域。 电荷存储氧化物层设置在沟道区上,并且与一对源极/漏极区的每一个的一部分重叠。 栅电极设置在电荷存储氧化物层上。 至少一个卤素注入区域形成在与一对源极/漏极区域中的一个相邻的半导体衬底中,并与电荷存储氧化物层重叠。 通过在位于形成有卤素离子注入区域的源极/漏极区附近的电荷存储氧化物层中俘获电子来执行编程操作,并且通过将空穴注入位于源/漏区附近的电荷存储氧化物层中来执行擦除操作, 漏区,其中形成有卤素离子注入区。

    Non-volatile memory device and method of fabricating the same
    7.
    发明授权
    Non-volatile memory device and method of fabricating the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07473961B2

    公开(公告)日:2009-01-06

    申请号:US11183614

    申请日:2005-07-18

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: A non-volatile memory device having improved electrical characteristics and a method of fabricating the non-volatile memory device are provided. The non-volatile memory device includes a gate electrode, which is formed on a semiconductor substrate on which source and drain regions are formed, a trapping structure, which is interposed between the semiconductor substrate and the gate electrode and comprises an electron tunneling layer and a charge trapping layer, and an electron back-tunneling prevention layer, which is interposed between the gate electrode and the charge trapping layer, prevents electrons in the gate electrode from back-tunneling through the charge trapping layer, and is formed of a metal having a higher work function than the gate electrode.

    Abstract translation: 提供了具有改善的电特性的非易失性存储器件以及制造该非易失性存储器件的方法。 非易失性存储器件包括形成在其上形成有源极和漏极区域的半导体衬底上的栅电极,该栅极电极介于半导体衬底和栅电极之间,并且包括电子隧穿层和 电荷捕获层和插入在栅电极和电荷捕获层之间的电子反向穿隧防止层防止栅电极中的电子通过电荷捕获层反向隧穿,并且由具有 工作功能比栅电极高。

    Non-volatile memory device with buried control gate and method of fabricating the same
    8.
    发明授权
    Non-volatile memory device with buried control gate and method of fabricating the same 失效
    具有埋地控制栅极的非易失性存储器件及其制造方法

    公开(公告)号:US07420243B2

    公开(公告)日:2008-09-02

    申请号:US11248691

    申请日:2005-10-12

    CPC classification number: H01L29/42352 H01L21/28282 H01L29/7923 Y10S438/954

    Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

    Abstract translation: 在具有埋地控制栅极的非易失性存储器件中,增加控制栅极的有效沟道长度以限制穿通,并且增加用于存储电荷的区域以获得有利的大容量。 一种制造存储器件的方法包括:在形成于半导体衬底中的沟槽内形成控制栅极,并以自对准的方式在控制栅极两侧的半导体衬底中形成电荷存储区域,从而允许多级 电池操作。

    Non-volatile memory device and method of fabricating the same

    公开(公告)号:US20060027854A1

    公开(公告)日:2006-02-09

    申请号:US11200491

    申请日:2005-08-09

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.

    Non-volatile memory device with buried control gate and method of fabricating the same
    10.
    发明授权
    Non-volatile memory device with buried control gate and method of fabricating the same 失效
    具有埋地控制栅极的非易失性存储器件及其制造方法

    公开(公告)号:US07700437B2

    公开(公告)日:2010-04-20

    申请号:US12183553

    申请日:2008-07-31

    CPC classification number: H01L29/42352 H01L21/28282 H01L29/7923 Y10S438/954

    Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

    Abstract translation: 在具有埋地控制栅极的非易失性存储器件中,增加控制栅极的有效沟道长度以限制穿通,并且增加用于存储电荷的区域以获得有利的大容量。 一种制造存储器件的方法包括:在形成于半导体衬底中的沟槽内形成控制栅极,并以自对准的方式在控制栅极两侧的半导体衬底中形成电荷存储区域,从而允许多级 电池操作。

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