Abstract:
A fuse part in a semiconductor device has a plurality of fuse lines extended along a first direction with a given width along a second direction. The fuse part includes a first conductive pattern having a space part formed in a fuse line region over a substrate, wherein portions of the first conductive pattern are spaced apart by the space part along the first direction. The fuse part includes a first insulation pattern formed over the space part, the first insulation pattern having a width smaller than a width of the first conductive pattern along the second direction and a thickness greater than a thickness of the first conductive pattern, and a second conductive pattern formed over the first insulation pattern, the second conductive pattern having a width greater than the width of the first insulation pattern along the second direction.
Abstract:
A fuse part in a semiconductor device has a plurality of fuse lines extended along a first direction with a given width along a second direction. The fuse part includes a first conductive pattern having a space part formed in a fuse line region over a substrate, wherein portions of the first conductive pattern are spaced apart by the space part along the first direction. The fuse part includes a first insulation pattern formed over the space part, the first insulation pattern having a width smaller than a width of the first conductive pattern along the second direction and a thickness greater than a thickness of the first conductive pattern, and a second conductive pattern formed over the first insulation pattern, the second conductive pattern having a width greater than the width of the first insulation pattern along the second direction.
Abstract:
A semiconductor device with reduced contact resistance between a substrate and a plug includes a gate electrode disposed over the substrate, the plug formed over the substrate at both sides of the gate electrode and having a sidewall with a positive slope, a capping layer disposed between the gate electrode and the plug, and a gate hard mask layer whose sidewall disposed over the gate electrode is extended to a top surface of the capping layer. By employing the capping layer having a sidewall with a negative slope, the plug having the sidewall with a positive slope can be formed regardless of a shape or profile of the sidewall of the gate electrode. As a result, the contact area between the substrate and the plug is increased.
Abstract:
A semiconductor device with reduced contact resistance between a substrate and a plug includes a gate electrode disposed over the substrate, the plug formed over the substrate at both sides of the gate electrode and having a sidewall with a positive slope, a capping layer disposed between the gate electrode and the plug, and a gate hard mask layer whose sidewall disposed over the gate electrode is extended to a top surface of the capping layer. By employing the capping layer having a sidewall with a negative slope, the plug having the sidewall with a positive slope can be formed regardless of a shape or profile of the sidewall of the gate electrode. As a result, the contact area between the substrate and the plug is increased.
Abstract:
Disclosed herein is a heat generation apparatus using permanent magnets. The heat generation apparatus using permanent magnets includes: a plurality of rotors fixedly mounted on a rotating shaft, and configured such that they are rotatable along with the rotating shaft with permanent magnets disposed thereon at predetermined intervals; a heat generation part configured such that the rotors are contained therein to thus form a predetermined gap between the heat generation part and the rotors, and adapted to generate heat while the permanent magnets are being rotated; a motor configured to serve as a source for the rotation of the rotating shaft; and a power transmission means configured to transfer the rotation force of the motor to the rotating shaft.
Abstract:
Disclosed herein is a heat generation apparatus using permanent magnets. The heat generation apparatus using permanent magnets includes: a plurality of rotors fixedly mounted on a rotating shaft, and configured such that they are rotatable along with the rotating shaft with permanent magnets disposed thereon at predetermined intervals; a heat generation part configured such that the rotors are contained therein to thus form a predetermined gap between the heat generation part and the rotors, and adapted to generate heat while the permanent magnets are being rotated; a motor configured to serve as a source for the rotation of the rotating shaft; and a power transmission means configured to transfer the rotation force of the motor to the rotating shaft.
Abstract:
A semiconductor device with reduced contact resistance between a substrate and a plug includes a gate electrode disposed over the substrate, the plug formed over the substrate at both sides of the gate electrode and having a sidewall with a positive slope, a capping layer disposed between the gate electrode and the plug, and a gate hard mask layer whose sidewall disposed over the gate electrode is extended to a top surface of the capping layer. By employing the capping layer having a sidewall with a negative slope, the plug having the sidewall with a positive slope can be formed regardless of a shape or profile of the sidewall of the gate electrode. As a result, the contact area between the substrate and the plug is increased.
Abstract:
A fuse part in a semiconductor device has a plurality of fuse lines extended along a first direction with a given width along a second direction. The fuse part includes a first conductive pattern having a space part formed in a fuse line region over a substrate, wherein portions of the first conductive pattern are spaced apart by the space part along the first direction. The fuse part includes a first insulation pattern formed over the space part, the first insulation pattern having a width smaller than a width of the first conductive pattern along the second direction and a thickness greater than a thickness of the first conductive pattern, and a second conductive pattern formed over the first insulation pattern, the second conductive pattern having a width greater than the width of the first insulation pattern along the second direction.
Abstract:
A fuse part in a semiconductor device has a plurality of fuse lines extended along a first direction with a given width along a second direction. The fuse part includes a first conductive pattern having a space part formed in a fuse line region over a substrate, wherein portions of the first conductive pattern are spaced apart by the space part along the first direction. The fuse part includes a first insulation pattern formed over the space part, the first insulation pattern having a width smaller than a width of the first conductive pattern along the second direction and a thickness greater than a thickness of the first conductive pattern, and a second conductive pattern formed over the first insulation pattern, the second conductive pattern having a width greater than the width of the first insulation pattern along the second direction.