摘要:
A fan includes a housing, an impeller and at least one position-limiting mechanism. The housing has an accommodating space for receiving the impeller. The impeller has a hub and a plurality of blades surrounding the hub. The position-limiting mechanism is located between the top of the blade and the inner side of the housing, and disposed on the top of the blade or the inner side of the housing.
摘要:
A fan includes a housing, an impeller and at least one position-limiting mechanism. The housing has an accommodating space for receiving the impeller. The impeller has a hub and a plurality of blades surrounding the hub. The position-limiting mechanism is located between the top of the blade and the inner side of the housing, and disposed on the top of the blade or the inner side of the housing.
摘要:
A voltage-controlled oscillator (VCO) module including a first VCO unit, a second VCO unit, and a matching circuit is provided. The first VCO unit includes a first terminal and a second terminal and generates a first oscillator signal. The second VCO unit is coupled to the first VCO unit and generates a second oscillator signal. The matching circuit is coupled between the first VCO unit and second VCO unit. The matching circuit includes a plurality of inductor modules respectively coupled between the first terminal of the first VCO unit and the second VCO unit, between the first terminal and the second terminal of the first VCO unit, and between the second terminal of the first VCO unit and the second VCO unit. Furthermore, a method for generating oscillator signals is also provided.
摘要:
A frequency doubler receiving an in-phase oscillating signal and an inverse oscillating signal and generating an output signal oscillating at a multiplied frequency, accordingly. The frequency doubler has a first transistor, a second transistor, a first inductor and a second inductor. A first terminal of the first transistor and a first terminal of the second transistor are at a common voltage. The frequency doubler receives the in-phase oscillating signal and the inverse oscillating signal via control terminals of the first and second transistors. The first and second inductors couple a second terminal of the first transistor and a second terminal of the second transistor to an output terminal of the frequency doubler, respectively. The first and second inductors may be separate inductance devices or, in another case, be implemented by a symmetric inductor.
摘要:
A voltage controlled oscillator (VCO) includes a voltage controlled current source (VCCS), a negative resistance circuit (NRC), a first transformer, a second transformer, a first transistor and a second transistor. A current terminal of the VCCS receives a control voltage. First terminals of first and second current paths in the NRC are coupled to a current terminal of the VCCS. Primary sides of the first and the second transformers are respectively coupled to second terminals of the first and the second current paths. Secondary sides of the first and the second transformers are first and second output terminals of the VCO, respectively. First terminals of the first and the second transistor are respectively coupled to the secondary sides of the first and the second transformers. Control terminals of the first and the second transformers are respectively coupled to the primary sides of the first and the second transformers.
摘要:
A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a first deposition step to fill a first dielectric material into the opening using a first deposition method. The first deposition method has a bottom deposition rate substantially greater than a sidewall deposition rate. The method further includes isotropically etching the first dielectric material, wherein at least a bottom portion of the first dielectric material remains after the etching; and performing a second deposition step to fill a remaining portion of the opening with a second dielectric material. The first deposition method may be a high-density plasma chemical vapor deposition. The second deposition method may be a high-aspect ratio process.
摘要:
A flexible display panel device includes a plastic substrate with a display region and a peripheral region, a plurality of ribs disposed in the peripheral region and/or the display region, a discontinuous buffer layer disposed on the plastic substrate, and an active matrix component layer on a pixel disposed on the discontinuous buffer layer. During the fabrication of the flexible panel, a plastic substrate is first disposed on a carrier substrate for performing device fabrication. After the panel is finished, the plastic substrate is departed from the carrier substrate to form a flexible panel. Through the integration design of the ribs and discontinuous buffer layer, the flexible panel has preferred warp resistance and low stress, thereby enhancing the reliability and life time of the panel.
摘要:
A device for monitoring body fluid discharge almost in real time is provided, the device includes a base, a motor, a catheter holder, and a liquid level sensor. The motor is fixed on the base and includes an output shaft. The catheter holder is connected to the output shaft and is rotatable relative to the base by the output shaft. The catheter holder includes a curved holding chamber with two openings containing a catheter. The liquid level sensor is disposed at one of the openings for detecting a liquid level of body fluid in the catheter and such level is recorded when a fully-filled catheter is automatically tipped and emptied into a collecting bag. A method for monitoring body fluid discharge using the device is also provided.
摘要:
A method for producing a SiGe stressor with high Ge concentration is provided. The method includes providing a semiconductor substrate with a source area, a drain area, and a channel in between; depositing the first SiGe film layer on the source area and/or the drain area; performing a low temperature thermal oxidation, e.g., a high water vapor pressure wet oxidation, to form an oxide layer at the top of the first SiGe layer and to form the second SiGe film layer with high Ge percentage at the bottom of the first SiGe film layer without Ge diffusion into the semiconductor substrate; performing a thermal diffusion to form the SiGe stressor from the second SiGe film layer, wherein the SiGe stressor provides uniaxial compressive strain on the channel; and removing the oxide layer. A Si cap layer can be deposited on the first SiGe film layer prior to performing oxidation.
摘要:
An integrated circuit structure includes a substrate and a germanium-containing semiconductor fin over the substrate. The germanium-containing semiconductor fin has an upper portion having a first width, and a neck region under the upper portion and having a second width smaller than the first width.