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    Semiconductor packages and methods for making the same
    2.
    发明授权
    Semiconductor packages and methods for making the same 失效
    半导体封装及其制造方法

    公开(公告)号：US06833510B2

    公开(公告)日：2004-12-21

    申请号：US09971872

    申请日：2001-10-04

    申请人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    发明人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    IPC分类号： H05K103

    CPC分类号： H01L22/20 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/4913 ,  H01L2224/85 ,  H01L2924/00

    摘要： Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

    摘要翻译： 提供了包括附接到一个或多个废弃模具位置的盖构件的半导体封装支撑元件。 还提供了制造本发明的支撑元件和制造使用其的半导体封装件的方法。 在使用盖构件的封装工艺之前，覆盖支撑元件的有缺陷的基底上的模具位置。 盖构件包括例如压敏或温度活化的带，废模或类似物。 本发明的支撑元件和方法由于存在废弃模具位置而实际上消除了在封装期间的渗出或闪烁。 本发明的支撑元件和方法进一步确保功能性骰子不会被附着到废弃模具位置而牺牲，从而降低制造成本，同时提高功能性半导体封装的产量。

    Internal package heat dissipator
    3.
    发明申请
    Internal package heat dissipator 有权
    内部散热器

    公开(公告)号：US20050269675A1

    公开(公告)日：2005-12-08

    申请号：US11198580

    申请日：2005-08-05

    申请人： Casey Prindiville

    发明人： Casey Prindiville

    IPC分类号： H01L23/31 ,  H01L23/34 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495

    CPC分类号： H01L23/3107 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.

    摘要翻译： 提供了用于从封装内的集成电路散热的技术。 在封装之前，导热条可以与集成电路管芯相邻设置。 封装形成在集成电路和导热条周围，使得导热条的一部分延伸穿过封装。 热量从集成电路通过导热带传导到包装周围的环境。 导热带可以通过粘合剂或其它机械方式安装在封装内。 导热带可以由金属箔或其它导热材料构成。

    Semiconductor packages and methods for making the same
    4.
    发明授权
    Semiconductor packages and methods for making the same 失效
    半导体封装及其制造方法

    公开(公告)号：US06858927B2

    公开(公告)日：2005-02-22

    申请号：US09971952

    申请日：2001-10-04

    申请人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    发明人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    IPC分类号： H01L21/56 ,  H01L21/66 ,  H01L23/48

    CPC分类号： H01L22/20 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/4913 ,  H01L2224/85 ,  H01L2924/00

    摘要： Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

    摘要翻译： 提供了包括附接到一个或多个废弃模具位置的盖构件的半导体封装支撑元件。 还提供了制造本发明的支撑元件和制造使用其的半导体封装件的方法。 在使用盖构件的封装工艺之前，覆盖支撑元件的有缺陷的基底上的模具位置。 盖构件包括例如压敏或温度活化的带，废模或类似物。 本发明的支撑元件和方法由于存在废弃模具位置而实际上消除了在封装期间的渗出或闪烁。 本发明的支撑元件和方法进一步确保功能性骰子不会被附着到废弃模具位置而牺牲，从而降低制造成本，同时提高功能性半导体封装的产量。

    Semiconductor packages and methods for making the same
    9.
    发明授权
    Semiconductor packages and methods for making the same 失效
    半导体封装及其制造方法

    公开(公告)号：US06891108B2

    公开(公告)日：2005-05-10

    申请号：US09971985

    申请日：2001-10-04

    申请人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    发明人： Casey Prindiville ,  Tongbi Jiang ,  Bret Street

    IPC分类号： H01L21/56 ,  H01L21/66 ,  H05K1/03

    CPC分类号： H01L22/20 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/4913 ,  H01L2224/85 ,  H01L2924/00

    摘要： Semiconductor package support elements including cover members attached to one or more reject die sites. Also, methods for making the support elements and for making semiconductor packages using the same. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

    摘要翻译： 半导体封装支撑元件包括附接到一个或多个废弃模具位置的盖构件。 而且，制造支撑元件的方法以及使用该支撑元件制造半导体封装的方法。 在使用盖构件的封装工艺之前，覆盖支撑元件的有缺陷的基底上的模具位置。 盖构件包括例如压敏或温度活化的带，废模或类似物。 本发明的支撑元件和方法由于存在废弃模具位置而实际上消除了在封装期间的渗出或闪烁。 本发明的支撑元件和方法进一步确保功能性骰子不会被附着到废弃模具位置而牺牲，从而降低制造成本，同时提高功能性半导体封装的产量。