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公开(公告)号：US07074700B2
公开(公告)日：2006-07-11
申请号：US10943699
申请日：2004-09-17
IPC分类号： H01L21/22
CPC分类号： H01L27/10864 , H01L27/10867 , H01L27/10876
摘要： A method for forming isolation layer in a vertical DRAM. A semiconductor substrate with a plurality of first trenches is provided, with a collar dielectric layer is formed on a sidewall of each, and each filled with a first conducting layer. A patterned mask layer is formed on the semiconductor substrate, and the semiconductor substrate is etched using the patterned mask layer as an etching mask to form a plurality of second trenches. The patterned mask layer is removed. Each second trench is filled with an insulating layer acting as an isolation. Each of first conducting layers is etched to form a plurality of grooves. A doped area acting as a buried strap is formed in the semiconductor substrate beside each groove. A trench top insulating layer is formed in the bottom surface of each trench. Each first trench is filled with a second conducting layer acting as a gate.
摘要翻译： 一种用于在垂直DRAM中形成隔离层的方法。 提供了具有多个第一沟槽的半导体衬底，其中，在每个的侧壁上形成一个环形电介质层，并且各自填充有第一导电层。 在半导体衬底上形成图案化掩模层，并使用图案化掩模层作为蚀刻掩模蚀刻半导体衬底，以形成多个第二沟槽。 去除图案化的掩模层。 每个第二沟槽填充有用作隔离层的绝缘层。 每个第一导电层被蚀刻以形成多个凹槽。 在每个沟槽旁边的半导体衬底中形成用作掩埋带的掺杂区域。 沟槽顶部绝缘层形成在每个沟槽的底表面中。 每个第一沟槽填充有用作栅极的第二导电层。
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公开(公告)号：US20050124111A1
公开(公告)日：2005-06-09
申请号：US10846321
申请日：2004-05-14
IPC分类号： H01L21/02 , H01L21/8242 , H01L21/8238 , H01L21/20 , H01L21/8234 , H01L21/8244
CPC分类号： H01L28/40 , H01L27/10864 , H01L27/10867
摘要： A method for forming a self-aligned buried strap in a vertical memory cell. A semiconductor substrate with a trench is provided. A collar dielectric layer is conformally formed on the trench bottom portion, and the trench is filled with a conducting layer. The collar dielectric layer is etched below the level of the surface of the conducting layer to form a groove between the conducting layer and the trench. The groove is filled with a doped conducting layer. The dopant in the doped conducting layer is diffused to the semiconductor substrate in an ion diffusion area as a buried strap. The conducting layer and the doped conducting layer are etched below the ion diffusion area. A top trench insulating layer is formed on the bottom of the trench, wherein the top trench insulating layer is lower than the ion diffusion area.
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公开(公告)号：US20050020028A1
公开(公告)日：2005-01-27
申请号：US10690859
申请日：2003-10-22
申请人： Chien-Mao Liao , Tzu-En Ho , Chang-Rong Wu , Chih-How Chang , Sheng-Wei Yang , Sheng-Tsung Chen , Chung-Yuan Lee , Wen-Sheng Liao , Chen-Chou Huang
发明人： Chien-Mao Liao , Tzu-En Ho , Chang-Rong Wu , Chih-How Chang , Sheng-Wei Yang , Sheng-Tsung Chen , Chung-Yuan Lee , Wen-Sheng Liao , Chen-Chou Huang
IPC分类号： H01L21/762 , H01L21/76
CPC分类号： H01L21/76229
摘要： A method for forming a trench isolation. A semiconductor substrate with an opening is provided, on which a mask layer is formed. A first insulating layer is conformably formed on the semiconductor substrate and the trench, and the trench is filled with the first insulating layer. The first insulating layer is anisotropically etched to below the semiconductor substrate. A second insulating layer is formed on the semiconductor substrate and the trench. The second insulating layer is planarized to expose the mask layer.
摘要翻译： 一种形成沟槽隔离的方法。 提供具有开口的半导体衬底，其上形成有掩模层。 在半导体衬底和沟槽上顺应地形成第一绝缘层，并且沟槽被第一绝缘层填充。 将第一绝缘层各向异性地蚀刻到半导体衬底的下面。 在半导体衬底和沟槽上形成第二绝缘层。 将第二绝缘层平坦化以露出掩模层。
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公开(公告)号：US20050064643A1
公开(公告)日：2005-03-24
申请号：US10943699
申请日：2004-09-17
IPC分类号： H01L21/8238 , H01L21/8242
CPC分类号： H01L27/10864 , H01L27/10867 , H01L27/10876
摘要： A method for forming isolation layer in a vertical DRAM. A semiconductor substrate with a plurality of first trenches is provided, with a collar dielectric layer is formed on a sidewall of each, and each filled with a first conducting layer. A patterned mask layer is formed on the semiconductor substrate, and the semiconductor substrate is etched using the patterned mask layer as an etching mask to form a plurality of second trenches. The patterned mask layer is removed. Each second trench is filled with an insulating layer acting as an isolation. Each of first conducting layers is etched to form a plurality of grooves. A doped area acting as a buried strap is formed in the semiconductor substrate beside each groove. A trench top insulating layer is formed in the bottom surface of each trench. Each first trench is filled with a second conducting layer acting as a gate.
摘要翻译： 一种用于在垂直DRAM中形成隔离层的方法。 提供了具有多个第一沟槽的半导体衬底，其中，在每个的侧壁上形成一个环形电介质层，并且各自填充有第一导电层。 在半导体衬底上形成图案化掩模层，并使用图案化掩模层作为蚀刻掩模蚀刻半导体衬底，以形成多个第二沟槽。 去除图案化的掩模层。 每个第二沟槽填充有用作隔离层的绝缘层。 每个第一导电层被蚀刻以形成多个凹槽。 在每个沟槽旁边的半导体衬底中形成用作掩埋带的掺杂区域。 沟槽顶部绝缘层形成在每个沟槽的底表面中。 每个第一沟槽填充有用作栅极的第二导电层。
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5.发明授权Method of forming single sided conductor and semiconductor device having the same 有权形成单面导体的方法和具有该单面导体的半导体器件公开(公告)号：US06835641B1
公开(公告)日：2004-12-28
申请号：US10835010
申请日：2004-04-30
IPC分类号： H01L2144
CPC分类号： H01L21/02299 , H01L21/02238 , H01L21/02255 , H01L21/26506 , H01L21/26586 , H01L21/31662 , H01L21/32105 , H01L27/10867
摘要： A method of forming a single sided conductor and a semiconductor device having the same is provided. The method includes providing a substrate having an opening. The opening exposes a sidewall and an opening base surface. A single sided silicon layer adjacent to the sidewall in the opening. The single sided silicon layer exposes a portion of the opening base surface. The single sided silicon layer is implanted with fluorine-containing ions. The substrate and the single sided silicon layer is thermally oxidized to form a thermal oxide layer in the opening.
摘要翻译： 提供了形成单面导体的方法和具有该单面导体的半导体器件。 该方法包括提供具有开口的基底。 开口露出侧壁和开口底面。 与开口中的侧壁相邻的单面硅层。 单面硅层露出开口底面的一部分。 单面硅层注入含氟离子。 衬底和单面硅层被热氧化以在开口中形成热氧化物层。
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公开(公告)号：US06958283B2
公开(公告)日：2005-10-25
申请号：US10690859
申请日：2003-10-22
申请人： Chien-Mao Liao , Tzu-En Ho , Chang-Rong Wu , Chih-How Chang , Sheng-Wei Yang , Sheng-Tsung Chen , Chung-Yuan Lee , Wen-Sheng Liao , Chen-Chou Huang
发明人： Chien-Mao Liao , Tzu-En Ho , Chang-Rong Wu , Chih-How Chang , Sheng-Wei Yang , Sheng-Tsung Chen , Chung-Yuan Lee , Wen-Sheng Liao , Chen-Chou Huang
IPC分类号： H01L21/762 , H01L21/76
CPC分类号： H01L21/76229
摘要： A method for forming a trench isolation. A semiconductor substrate with an opening is provided, on which a mask layer is formed. A first insulating layer is conformably formed on the semiconductor substrate and the trench, and the trench is filled with the first insulating layer. The first insulating layer is anisotropically etched to below the semiconductor substrate. A second insulating layer is formed on the semiconductor substrate and the trench. The second insulating layer is planarized to expose the mask layer.
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7.发明授权公开(公告)号：US06927123B2
公开(公告)日：2005-08-09
申请号：US10846272
申请日：2004-05-14
IPC分类号： H01L21/02 , H01L21/8242 , H01L29/94 , H01L21/20
CPC分类号： H01L28/40 , H01L27/10864 , H01L27/10867 , H01L29/945
摘要： A method for forming a self-aligned buried strap in a vertical memory cell. A semiconductor substrate with a trench is provided, a capacitor wire is formed on the bottom portion of the trench, and a collar dielectric layer is formed between the capacitor wire and the semiconductor substrate to act as an isolation. The capacitor wire and the collar dielectric layer are etched to a predetermined depth, such that a gap is formed between the spacer and the capacitor wire and the collar dielectric layer. Ions are doped into the exposed semiconductor substrate to form an ion doped area acting as a buried strap. The spacer is removed, and an exposed collar dielectric layer is etched below the level of the surface of the capacitor wire, and a groove is formed between the capacitor wire and the trench sidewall to fill with a conducting layer.
摘要翻译： 一种用于在垂直存储单元中形成自对准埋置带的方法。 提供具有沟槽的半导体衬底，在沟槽的底部形成电容器线，并且在电容器布线和半导体衬底之间形成环形电介质层以作为隔离。 电容器线和套环电介质层被蚀刻到预定深度，使得在间隔物和电容器线和套环电介质层之间形成间隙。 将离子掺杂到暴露的半导体衬底中以形成充当掩埋带的离子掺杂区域。 去除间隔物，并且暴露的环形介电层被蚀刻到电容器线的表面的水平面以下，并且在电容器布线和沟槽侧壁之间形成凹槽以填充导电层。
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8.发明申请METHOD FOR FORMING A SELF-ALIGNED BURIED STRAP IN A VERTICAL MEMORY CELL 有权用于在垂直存储器单元中形成自对准的BURIED STRAP的方法公开(公告)号：US20050124110A1
公开(公告)日：2005-06-09
申请号：US10846272
申请日：2004-05-14
IPC分类号： H01L21/02 , H01L21/8242 , H01L29/94 , H01L21/8234 , H01L21/20 , H01L21/8244 , H01L27/108 , H01L29/76 , H01L31/119
CPC分类号： H01L28/40 , H01L27/10864 , H01L27/10867 , H01L29/945
摘要： A method for forming a self-aligned buried strap in a vertical memory cell. A semiconductor substrate with a trench is provided, a capacitor wire is formed on the bottom portion of the trench, and a collar dielectric layer is formed between the capacitor wire and the semiconductor substrate to act as an isolation. The capacitor wire and the collar dielectric layer are etched to a predetermined dept, such that a gap is formed between the spacer and the capacitor wire and the collar dielectric layer. Ions are doped into the exposed semiconductor substrate to form an ion doped area acting as a buried strap. The spacer is removed, and an exposed collar dielectric layer is etched below the level of the surface of the capacitor wire, and a groove is formed between the capacitor wire and the trench sidewall to fill with a conducting layer.
摘要翻译： 一种用于在垂直存储单元中形成自对准埋置带的方法。 提供具有沟槽的半导体衬底，在沟槽的底部形成电容器线，并且在电容器布线和半导体衬底之间形成环形电介质层以作为隔离。 电容器线和套环电介质层被蚀刻到预定的部分，使得在间隔件和电容器线和套环电介质层之间形成间隙。 将离子掺杂到暴露的半导体衬底中以形成充当掩埋带的离子掺杂区域。 去除间隔物，并且暴露的环形介电层被蚀刻到电容器线的表面的水平面以下，并且在电容器布线和沟槽侧壁之间形成凹槽以填充导电层。
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公开(公告)号：US20120132790A1
公开(公告)日：2012-05-31
申请号：US13095893
申请日：2011-04-28
申请人： CHEN-CHOU HUANG , CHUN-YU LEE
发明人： CHEN-CHOU HUANG , CHUN-YU LEE
IPC分类号： G01J1/44
CPC分类号： G01J5/0265 , G01J5/0025 , G01J5/041 , G01J5/0896 , G01S7/4813 , G01S17/026
摘要： An electronic device having proximity detection function includes a front cover, a frame arranged under the front cover, a light emitter and a photo sensor received in the frame. A spacer is arranged between the front cover and the frame to prevent a portion of light from the light emitter from travelling to the photo sensor, when the front cover and the frame are not parallel.
摘要翻译： 具有接近检测功能的电子设备包括前盖，布置在前盖下方的框架，发射器和接收在框架中的光传感器。 当前盖和框架不平行时，间隔件布置在前盖和框架之间以防止来自发光体的一部分光传播到光传感器。
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10.发明授权公开(公告)号：US06962847B2
公开(公告)日：2005-11-08
申请号：US10846321
申请日：2004-05-14
IPC分类号： H01L21/02 , H01L21/8242 , H01L21/20
CPC分类号： H01L28/40 , H01L27/10864 , H01L27/10867
摘要： A method for forming a self-aligned buried strap in a vertical memory cell. A semiconductor substrate with a trench is provided. A collar dielectric layer is conformally formed on the trench bottom portion, and the trench is filled with a conducting layer. The collar dielectric layer is etched below the level of the surface of the conducting layer to form a groove between the conducting layer and the trench. The groove is filled with a doped conducting layer. The dopant in the doped conducting layer is diffused to the semiconductor substrate in an ion diffusion area as a buried strap. The conducting layer and the doped conducting layer are etched below the ion diffusion area. A top trench insulating layer is formed on the bottom of the trench, wherein the top trench insulating layer is lower than the ion diffusion area.
摘要翻译： 一种用于在垂直存储单元中形成自对准埋置带的方法。 提供具有沟槽的半导体衬底。 轴环电介质层共形地形成在沟槽底部上，并且沟槽填充有导电层。 在导电层的表面的水平面下蚀刻套环电介质层，以在导电层和沟槽之间形成凹槽。 凹槽填充有掺杂的导电层。 掺杂导电层中的掺杂剂作为掩埋带扩散到离子扩散区域中的半导体衬底。 导电层和掺杂导电层被蚀刻在离子扩散区下面。 在沟槽的底部形成顶部沟槽绝缘层，其中顶部沟槽绝缘层低于离子扩散区域。
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