公开(公告)号：US06593662B1

公开(公告)日：2003-07-15

申请号：US09631343

申请日：2000-08-02

申请人： Han-Ping Pu ,  Randy H. Y. Lo ,  Tzong-Dar Her ,  Chien-Ping Huang ,  Cheng-Shiu Hsiao ,  Chi-Chuan Wu

发明人： Han-Ping Pu ,  Randy H. Y. Lo ,  Tzong-Dar Her ,  Chien-Ping Huang ,  Cheng-Shiu Hsiao ,  Chi-Chuan Wu

IPC分类号： H01L2348

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A stacked-die package structure comprises a carrier, dies, spacers, adhesive layers, conductive lines, a mold compound, and solder balls. The carrier has an upper surface and a back surface opposite to the upper surface. The dies substantially having the same sizes are stacked one by one on the upper surface of the carrier, and a number of bonding pads are located around each die. The spacers are located between two adjacent dies. Adhesive layers located between the spacers, the dies, and the carrier for adhering layers therebetween. The conducting lines are respectively electrically connected between each of the bonding pads of the dies and the carrier. And the mold compound is formed over the upper surface of the carrier, for encapsulating the spacers, the dies and the adhesive layers. A substrate with solder balls or a lead frame having pins is suitable for serving as the carrier.

摘要翻译： 堆叠管芯封装结构包括载体，管芯，间隔物，粘合剂层，导电线，模具化合物和焊球。 载体具有与上表面相对的上表面和后表面。 基本上具有相同尺寸的模具在载体的上表面上一个接一个堆叠，并且多个焊盘位于每个管芯周围。 间隔件位于两个相邻的模具之间。 位于间隔件，模具和载体之间的粘合层，用于在其间粘合层。 导体线分别电连接在管芯和载体的每个接合焊盘之间。 并且模制化合物形成在载体的上表面上，用于封装间隔物，模具和粘合剂层。 具有焊球或具有引脚的引线框架的基板适合用作载体。

公开(公告)号：US06476469B2

公开(公告)日：2002-11-05

申请号：US09842040

申请日：2001-04-25

申请人： Chin-Yuan Hung ,  Lien-Chen Chiang ,  Cheng-Shiu Hsiao

发明人： Chin-Yuan Hung ,  Lien-Chen Chiang ,  Cheng-Shiu Hsiao

IPC分类号： H01L23495

CPC分类号： H01L23/49861 ,  H01L21/565 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/05599

摘要： A quad flat non-leaded package structure for housing a sensor. The package includes a die pad, a plurality of leads, a die, a plurality of bonding wires, a packaging plastic body and a lid cover. A plurality of supporters are formed near the edges on the backside of the die pad. The plurality of leads is positioned at a well-defined distance away from the four sides of the die pad. The packaging plastic body is formed on the upper surface near the peripheral section of the leads. The space between the die pad and the leads is filled by the packaging plastic material but the bottom section of the leads and the bottom section of the supporters on the backside of the die pad are exposed. The die is attached to the upper surface of the die pad and is electrically connected to the leads using the bonding wires. The lid cover is placed over the packaging plastic body.

摘要翻译： 用于容纳传感器的四边形无铅封装结构。 封装包括管芯焊盘，多个引线，管芯，多个接合线，封装塑料体和盖罩。 在芯片的背面的边缘附近形成多个支撑体。 多个引线位于远离模具垫的四个侧面的明确的距离处。 包装塑料体形成在引线的周边部分附近的上表面上。 芯片焊盘和引线之间的空间由包装塑料材料填充，但引线的底部和裸片垫背面的支撑体的底部部分露出。 模具附接到管芯焊盘的上表面，并且使用接合线电连接到引线。 盖盖放置在包装塑料体上。