公开(公告)号：US07545039B2

公开(公告)日：2009-06-09

申请号：US11410986

申请日：2006-04-26

Applicant: Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

Inventor： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/09909 ,  H01L2924/00

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract translation: 提供一种用于减小通孔应力的结构及其制造方法。 使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。 因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。

公开(公告)号：US20070108572A1

公开(公告)日：2007-05-17

申请号：US11410986

申请日：2006-04-26

Applicant: Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

Inventor： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

IPC: H01L21/00

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/09909 ,  H01L2924/00

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract translation: 提供一种用于减小通孔应力的结构及其制造方法。 使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。 因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。