公开(公告)号：US20110156066A1

公开(公告)日：2011-06-30

申请号：US12982210

申请日：2010-12-30

Applicant: Chin-Lin YAO ,  Chih-Chiang Lu

Inventor： Chin-Lin YAO ,  Chih-Chiang Lu

IPC: H01L33/64 ,  H01L33/10

CPC classification number: H01L27/15 ,  H01L25/075 ,  H01L25/0753 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/6609 ,  H01L29/66969 ,  H01L29/861 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: The present application discloses a semiconductor light-emitting device with a protection layer. The structure includes a heat dispersion substrate, a first connecting layer on the heat dispersion substrate, a protection layer on the first connecting layer, a second connecting layer on the protection layer, and a light-emitting unit on the second connecting layer. The protection layer is highly insulative and can avoid the current leakage forming between the light-emitting unit and the heat dispersion substrate.

Abstract translation: 本申请公开了一种具有保护层的半导体发光器件。 该结构包括散热基板，散热基板上的第一连接层，第一连接层上的保护层，保护层上的第二连接层和第二连接层上的发光单元。 保护层是高度绝缘的，并且可以避免发光单元和散热基板之间的电流泄漏形成。

公开(公告)号：US08779447B2

公开(公告)日：2014-07-15

申请号：US12982210

申请日：2010-12-30

Applicant: Chin-Lin Yao ,  Chih-Chiang Lu

Inventor： Chin-Lin Yao ,  Chih-Chiang Lu

IPC: H01L33/64 ,  H01L33/10

CPC classification number: H01L27/15 ,  H01L25/075 ,  H01L25/0753 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/6609 ,  H01L29/66969 ,  H01L29/861 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: The present application discloses a semiconductor light-emitting device with a protection layer. The structure includes a heat dispersion substrate, a first connecting layer on the heat dispersion substrate, a protection layer on the first connecting layer, a second connecting layer on the protection layer, and a light-emitting unit on the second connecting layer. The protection layer is highly insulative and can avoid the current leakage forming between the light-emitting unit and the heat dispersion substrate.

Abstract translation: 本申请公开了一种具有保护层的半导体发光器件。 该结构包括散热基板，散热基板上的第一连接层，第一连接层上的保护层，保护层上的第二连接层和第二连接层上的发光单元。 保护层是高度绝缘的，并且可以避免发光单元和散热基板之间的电流泄漏形成。