公开(公告)号：US07008804B2

公开(公告)日：2006-03-07

申请号：US10366576

申请日：2003-02-14

申请人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Byeng Gi Lee

发明人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Byeng Gi Lee

IPC分类号： H01L21/66 ,  H05K7/20 ,  G01R31/02

CPC分类号： G01R31/2874 ,  G01K15/00 ,  G01R1/44 ,  G01R31/2875

摘要： Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature. The method includes fitting at least one semiconductor device to at least one test socket and starting a test, measuring in real time a temperature of the semiconductor device using a temperature sensor, detecting a measured temperature change rate and comparing the measured temperature change rate to a preset value, spraying cooling fluid onto the semiconductor device by controlling a cooling fluid supplying apparatus if the measured value change rate is higher than a preset value, and stopping spray of the cooling fluid onto the semiconductor device by controlling the cooling fluid supplying apparatus if the measured value change rate is below the preset value, thereby optimizing a test environment and improving yield.

摘要翻译： 提供了用于补偿半导体器件处理器中的测试温度偏差的方法，其中补偿了在半导体器件在预设温度下的测试期间由半导体器件本身产生的热引起的半导体器件的测试温度偏差。 这允许半导体器件的测试在精确的温度下进行。 该方法包括将至少一个半导体器件装配到至少一个测试插座并开始测试，使用温度传感器实时测量半导体器件的温度，检测测量的温度变化率并将测得的温度变化率与 如果测量值变化率高于预设值，则通过控制冷却流体供应装置将冷却流体喷射到半导体器件上，并且通过控制冷却流体供应装置来停止将冷却流体喷射到半导体器件上，如果 测量值变化率低于预设值，从而优化了测试环境，提高了产量。

公开(公告)号：US06861861B2

公开(公告)日：2005-03-01

申请号：US10366368

申请日：2003-02-14

申请人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Eui Sung Hwang ,  Woo Young Lim ,  Jae Bong Seo ,  Eung Yong Lee ,  Byeng Gi Lee

发明人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Eui Sung Hwang ,  Woo Young Lim ,  Jae Bong Seo ,  Eung Yong Lee ,  Byeng Gi Lee

IPC分类号： G01R31/26 ,  G01R1/44 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R31/2877 ,  G01R31/2862 ,  G01R31/2867

摘要： A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range. The semiconductor device handler includes at least one enclosed chamber, a heating/cooling apparatus configured to bring an inside of the at least one chamber to a low or high temperature state, a pushing unit provided within the at least one chamber and configured to push a plurality of semiconductor devices mounted on a test tray into test sockets of a test board located within the at least one chamber for testing, a cooling fluid supplying apparatus configured to supply cooling fluid, a nozzle assembly configured to spray cooling fluid received from the cooling fluid supplying apparatus onto the semiconductor devices fitted to the test sockets, and a control unit configured to control spraying of cooling fluid onto the semiconductor devices during testing to compensate for temperature changes of the semiconductor devices that occur during testing.

摘要翻译： 提供一种半导体器件处理器，其中补偿由半导体器件本身在测试期间产生的热引起的半导体器件的测试温度偏差，允许半导体器件的测试在精确温度或内部进行 精确的温度范围。 所述半导体器件处理器包括至少一个封闭室，被配置为使所述至少一个室的内部达到低温或高温状态的加热/冷却装置;设置在所述至少一个室内的推动单元， 将安装在测试托盘上的多个半导体器件安装在位于至少一个室内的用于测试的测试板的测试插座中;冷却流体供应装置，其构造成供应冷却流体;喷嘴组件，其构造成喷射从冷却流体接收的冷却流体 将供应装置供应到装配到测试插座的半导体器件上;以及控制单元，被配置为在测试期间控制将冷却流体喷射到半导体器件上，以补偿在测试期间发生的半导体器件的温度变化。

公开(公告)号：US07429868B2

公开(公告)日：2008-09-30

申请号：US11196238

申请日：2005-08-04

申请人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/0433

摘要： A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

摘要翻译： 用于测试半导体器件的插座组件包括电连接到外部测试装置的插座板和覆盖插座板的插座引导件。 插座引导件具有开放部分以接收半导体器件，并允许半导体器件上的引脚与插座板上的连接引脚耦合。 间隔件可以插入在插座板和插座引导件之间，以保持半导体器件和插座板之间的预定距离。 以这种方式，即使当半导体器件具有不同的厚度时，也可以将每个半导体器件的球或引线按压到插座的连接销上至预定的深度。

公开(公告)号：US07135703B2

公开(公告)日：2006-11-14

申请号：US10366618

申请日：2003-02-14

申请人： Chul Ho Ham ,  Chan Ho Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Chan Ho Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： B65D73/02

CPC分类号： G01R31/2867 ,  G01R31/2877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

摘要翻译： 一种用于半导体器件处理器的载体模块，其中用于冷却流体流动的沟槽形成在用于半导体器件的载体模块的安置表面中。 凹槽通过将从测试温度偏差补偿系统喷射的冷却流体强制到载体模块上以在半导体器件的基本上整个表面上扩散并且在放电之前保持在载体模块中一段时间​​来提高冷却效率。

公开(公告)号：US20100169058A1

公开(公告)日：2010-07-01

申请号：US12649168

申请日：2009-12-29

申请人： Chan Ho Park ,  Won Young Jung ,  Sung Gon Cho

发明人： Chan Ho Park ,  Won Young Jung ,  Sung Gon Cho

IPC分类号： G06F17/50

CPC分类号： G06F17/5036

摘要： Embodiments relate to a semiconductor technology, and more particularly, to a modeling structure for simulation of a trapezoidal metal line. The modeling structure for simulation of a trapezoidal metal line includes a top step with a width A, a bottom step with a width B, a middle step with a width equal to an average of the width A and the width B, and a total height C, wherein the middle step has a height equal to a value obtainable by subtracting both a height of the top step and a height of the bottom step from the total height C.

摘要翻译： 实施例涉及半导体技术，更具体地，涉及用于模拟梯形金属线的建模结构。 用于模拟梯形金属线的建模结构包括具有宽度A的顶部台阶，具有宽度B的底部台阶，宽度等于宽度A和宽度B的平均宽度的中间台阶，以及总高度 C，其中中间台阶的高度等于从总高度C减去顶部台阶的高度和底部台阶的高度可获得的值。

公开(公告)号：US20070155112A1

公开(公告)日：2007-07-05

申请号：US11615718

申请日：2006-12-22

申请人： Chan Ho Park

发明人： Chan Ho Park

IPC分类号： H01L21/20

CPC分类号： H01L23/5223 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a capacitor, which uses metal as a top electrode and a bottom electrode. A plurality of first electrodes may be formed with a plurality of first conductive lines and a plurality of plugs. A plurality of second electrodes may be formed with a plurality of second conductive lines and a plurality of plugs. Oxide layers may be formed between first electrodes and second electrodes. First and second electrodes may be formed such that they intersect each other on every side.

摘要翻译： 一种制造电容器的方法，其使用金属作为顶部电极和底部电极。 多个第一电极可以形成有多个第一导电线和多个插塞。 多个第二电极可以形成有多个第二导电线和多个插塞。 可以在第一电极和第二电极之间形成氧化物层。 第一和第二电极可以形成为使得它们在每一侧彼此相交。

公开(公告)号：US08914076B2

公开(公告)日：2014-12-16

申请号：US13346698

申请日：2012-01-09

申请人： Chan Ho Park ,  Jae Hun Jeong ,  Hyoung Ju Lee ,  Sung Chel Hwang

发明人： Chan Ho Park ,  Jae Hun Jeong ,  Hyoung Ju Lee ,  Sung Chel Hwang

IPC分类号： H04M1/00 ,  H04M1/60

CPC分类号： H04M1/6041 ,  H04M1/6025

摘要： A device and method process voice communication service. A mobile terminal device of the present disclosure includes a microphone arranged at one end of a body of the device; a speaker arranged close to the microphone; a transceiver arranged at the other end of the body; a codec including a coder connected to the microphone, a decoder connected to the speaker, and a switch of which one node is connected to one of the coder and the decoder selectively and the other node is connected to the transceiver; and a communication controller which controls the switch to establish a path between the coder and the transceiver and enables the speaker in speakerphone mode.

摘要翻译： 一种设备和方法处理语音通信服务。 本公开的移动终端装置包括布置在设备的主体的一端的麦克风; 靠近麦克风布置的扬声器; 布置在身体另一端的收发器; 编解码器，包括连接到麦克风的编码器，连接到扬声器的解码器，以及一个节点选择性地连接到编码器和解码器之一的开关，另一个节点连接到收发器; 以及通信控制器，其控制开关以在编码器和收发器之间建立路径，并使扬声器处于扬声器模式。

公开(公告)号：US20120178385A1

公开(公告)日：2012-07-12

申请号：US13346698

申请日：2012-01-09

申请人： Chan Ho Park ,  Jae Hun Jeong ,  Hyoung Ju Lee ,  Sung Chel Hwang

发明人： Chan Ho Park ,  Jae Hun Jeong ,  Hyoung Ju Lee ,  Sung Chel Hwang

IPC分类号： H04W88/02 ,  H04B1/44

CPC分类号： H04M1/6041 ,  H04M1/6025

摘要： A device and method process voice communication service. A mobile terminal device of the present disclosure includes a microphone arranged at one end of a body of the device; a speaker arranged close to the microphone; a transceiver arranged at the other end of the body; a codec including a coder connected to the microphone, a decoder connected to the speaker, and a switch of which one node is connected to one of the coder and the decoder selectively and the other node is connected to the transceiver; and a communication controller which controls the switch to establish a path between the coder and the transceiver and enables the speaker in speakerphone mode.

摘要翻译： 一种设备和方法处理语音通信服务。 本公开的移动终端装置包括布置在设备的主体的一端的麦克风; 靠近麦克风布置的扬声器; 布置在身体另一端的收发器; 编解码器，包括连接到麦克风的编码器，连接到扬声器的解码器，以及一个节点选择性地连接到编码器和解码器之一的开关，另一个节点连接到收发器; 以及通信控制器，其控制开关以在编码器和收发器之间建立路径，并使扬声器处于扬声器模式。

公开(公告)号：US07849214B2

公开(公告)日：2010-12-07

申请号：US11949738

申请日：2007-12-03

申请人： Chan Ho Park ,  Seong Woon Kim ,  Myung Joon Kim

发明人： Chan Ho Park ,  Seong Woon Kim ,  Myung Joon Kim

IPC分类号： G06F15/16

CPC分类号： H04L69/16 ,  H04L47/193 ,  H04L47/2441 ,  H04L49/90 ,  H04L49/901 ,  H04L49/9073 ,  H04L69/161 ,  H04L69/163 ,  H04L69/22

摘要： A hardware apparatus for receiving a packet for a TCP offload engine (TOE), and receiving system and method using the same are provided. Specifically, information required to protocol processing by a processor is stored in the internal queue included in the packet receiving hardware. Data to be stored in a host memory is transmitted to the host memory after the data is stored in an external memory and protocol processing is performed by the processor. With these techniques, it is possible that a processor can operate asynchronously with a receiving time of a practical packet and it is possible to reduce an overhead that processor deals with unnecessary information.

摘要翻译： 提供了一种用于接收用于TCP卸载引擎（TOE）的分组的硬件装置，以及使用其的接收系统和方法。 具体地，由处理器进行协议处理所需的信息被存储在分组接收硬件中包括的内部队列中。 在将数据存储在外部存储器中并且由处理器执行协议处理之后，要存储在主机存储器中的数据被发送到主机存储器。 利用这些技术，处理器可以与实际分组的接收时间异步地操作，并且可以减少处理器处理不必要的信息的开销。

公开(公告)号：US20090168294A1

公开(公告)日：2009-07-02

申请号：US12269115

申请日：2008-11-12

申请人： Chan Ho Park

发明人： Chan Ho Park

IPC分类号： H01G4/30

CPC分类号： H01G4/30

摘要： A capacitor according to an embodiment can include a first dielectric layer; a first metal layer disposed below the first dielectric layer; a second dielectric layer disposed below the first metal layer; a second metal layer disposed below the second dielectric layer; a third dielectric layer disposed below the second metal layer; and a third metal layer disposed below the third dielectric layer and electrically connected to the first metal layer.

摘要翻译： 根据实施例的电容器可以包括第一介电层; 设置在所述第一介电层下方的第一金属层; 设置在所述第一金属层下方的第二电介质层; 设置在所述第二介电层下方的第二金属层; 设置在所述第二金属层下方的第三电介质层; 以及第三金属层，其设置在所述第三电介质层的下方并电连接到所述第一金属层。