摘要:
An orthogonal backplane connector systems having midplane footprints that provide for continuity of impedance and signal integrity through the midplane and allow for the same connector to be coupled to either side of the midplane. This design creates an orthogonal interconnect without taking up unnecessary PCB real estate. The midplane circuit board may include a first differential signal pair of electrically conductive vias disposed in a first direction, and a second differential signal pair of electrically conductive vias disposed in a second direction that is generally orthogonal to the first direction. The first and second differential signal pair of electrically conductive vias are electrically connected through the midplane circuit board. Each pair may be associated with and be located in between ground vias. A ground via that is large relative to the signal vias may be provided. The second signal vias may comprise a shared signal via, receiving a contact from respective connectors connected to each side of the midplane circuit board. The second signal vias may comprise partial signal vias, extending from one or more sides partially into the midplane circuit board. The signal pairs may be offset from a via array centerline formed by the ground vias to correspond with mating ends of signal contacts of an electrical connector that likewise jog away from a centerline of a respective contact column of the connector.
摘要:
A connector assembly for printed circuit boards comprises a first and a second connector part. The first connector part has a first housing of insulating material and having a bottom and two opposite side walls and with male contact elements mounted in the bottom of the housing and arranged in rows and columns and having portions projecting from the bottom of the housing adapted to be inserted into holes of the corresponding printed circuit board. The second connector part has a second housing of insulating material adapted to be inserted into the first housing with an insertion side and with female contact elements mounted in the housing and arranged in a corresponding manner in rows and columns and having portions projecting from a lower side of the housing and adapted to be inserted into openings of the corresponding printed circuit board. A third housing is provided substantially corresponding with the first housing and adapted to be fixed with its bottom on the male contact elements of teh first connector part after mounting said first connector part on the corresponding printed circuit board. In the second housing at least one ground contact plate unit with a cross-shaped cross section is provided, dividing said housing in quadrants with a mutually equal plurality, preferably four, of female contact elements, wherein the ground contact plate unit at the insertion side of the second housing projects from this housing along a distance substantially corresponding with the thickness of the bottom of the first and third housings, respectively. A cross-shaped slot is provided in the bottom of the first and third housings for receiving the ground contact plate unit, said slot dividing the bottom of the housing in quadrants with said plurality of male contact elements.
摘要:
A connector assembly for interconnecting optical and/or electrical conductors comprises a first connector part with a first guiding plate with one or more guiding channels for first conductors each terminated by a contact pad and a second connector part to be coupled with the first connector part and having a second guiding plate with one or more guiding channels provided in a corresponding manner for second conductors to be connected with the first conductors and each terminated by a contact pad. The guiding plates comprise positioning means for mutually positioning the guiding plates in the coupled position of the connector parts in such a manner that corresponding contact pads of the first and second conductors are interconnected optically and electrically, respectively. These positioning means comprise cooperating straight reference surfaces extending in x-direction and cooperating straight reference surfaces extending in y-direction, all said reference surfaces being located at a predetermined location with respect to the guiding channels, wherein the second guiding plate is mounted moveably in x-, y- and z-directions in a housing and wherein means are provided for exerting forces for pressing the cooperating reference surfaces and the contact pads towards each other in the x-, y- and z-directions during coupling the connector parts. One connector part can be inserted into the other in the longitudinal direction of the guiding channels, wherein distance elements are adapted to keep the contact pads of the conductors at a distance from each other in z-direction during inserting of the connector part and to enable the movement of the contact pads towards each other in z-direction as soon as the cooperating reference surfaces are substantially abutting.
摘要:
The invention relates to an optical connector assembly for optically connecting to a waveguide structure in a x-y plane of a layer stack, wherein the connector assembly comprises a coupling device providing a first optical path, and the waveguide structure provides a second optical path, deflecting from said first optical path. The coupling device comprises first reference means adapted to co-operate with second reference means in the layer stack, wherein the second reference means are adapted for aligning the coupling device to the waveguide structure in both the x- and y-direction of the x-y plane as to optically couple the first and second optical path. As a result an optical connector assembly is provided that improves the optical coupling between the optical path in a waveguide structure and in a coupling device and/or a mating optical device. The coupling device may comprise third reference means to couple an optical connector to the waveguide structure. The invention also relates to a method for aligning the coupling device and the waveguide structure.
摘要:
A backpanel connector system comprises a backpanel connector, a board connector and a plurality of connector plugs for optical fibers. The backpanel connector comprises a first and a second housing, said first housing having a bottom with an opening. The second housing is slidably mounted in said first housing in a z-direction extending perpendicular to the bottom of the first housing. The second housing has a receiving space for a connector plug. The second housing is also movable in x- and y-directions with respect to the first housing. The second housing and the board connector are provided with co-operating positioning means for positioning the second housing in x- and y-directions with respect to the board connector during insertion of the board connector into the first housing.
摘要:
An alignment piece (1, 13) for a connector for optical conductors (10) comprises a support plate (2, 14), a guiding plate (3, 15) manufactured with very high accuracy and one or more alignment channels (4) for the conductors. At least the ends (11) of the alignment channels are formed in the guiding plate. The guiding plate (3, 15) is further provided with an inclining guiding plate part (5) in which the alignment channels (4) are formed. The support plate (2, 14) has a recess (6) in which the free end of the inclining guiding plate part (5) is received. The support plate includes a guiding surface (7) for the conductors (10), the guiding surface with its side directed towards the inclining guiding plate part lying above the free end of the guiding plate part.
摘要:
For manufacturing a connector for optical conductors on a printed circuit board a first printed circuit board part is made and an alignment piece with one or more reference faces and with one or more alignment channels for the conductors is fixed on the first printed circuit board part. The optical conductors are put in the alignment channels and are attached in the alignment piece, whereafter the parts of the optical conductors projecting out of the alignment piece and superfluous attachment material are removed by polishing and optical contact pads are formed in the upper surface of the alignment piece. A protection cover is put on the alignment piece, which protection cover seals the reference faces and the optical contact pads from the environment, whereafter the printed circuit board is completed and finally the protection cover is removed. The protection cover comprises an upper wall adapted to cover at least the surface of the alignment piece, and edges projecting downwardly from the upper wall and determining together with the upper wall a receiving space for at least a part of the alignment piece, which edges join the sides of the alignment piece when the protection cover is placed on the alignment piece.
摘要:
A connector for shielded cables comprises a housing of insulating material and signal and ground contacts accommodated in said housing and to which corresponding conductors of the cables are connectable, said contacts being arranged in rows and columns. The housing is assembled of one or more modules and at least one module cap, wherein each module can be detachably mounted in the module cap in a predetermined position with respect to the module cap, and wherein each module is provided with at least one column of contacts.
摘要:
A connector assembly for printed circuit boards comprises a first and a second connector part. The first connector part has a first housing of insulating material and having a bottom and two opposite side walls and with male contact elements mounted in the bottom of the housing and arranged in rows and columns and having portions projecting from the bottom of the housing adapted to be inserted into holes of the corresponding printed circuit board. The second connector part has a second housing of insulating material adapted to be inserted into the first housing with an insertion side and with female contact elements mounted in the housing and arranged in a corresponding manner in rows and columns and having portions projecting from a lower side of the housing, which projecting portions can be inserted into holes of the corresponding printed circuit board. The second connector part comprises at least one ground contact plate projecting out of said housing at the insertion side along a distance substantially corresponding with the thickness of the bottom of the first housing. At least one slot is provided in the bottom of the first housing for receiving the ground contact plates. The first housing comprises shielding plates provided on the side walls and having contact means for connection with a corresponding conductor of the corresponding printed circuit board and wherein ground contact means each project in a slot in the bottom of the housing for contacting a ground contact plate of the second housing.
摘要:
Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.