公开(公告)号：US5869356A

公开(公告)日：1999-02-09

申请号：US42875

申请日：1998-03-17

申请人： James W. Fuller, Jr. ,  Mary Beth Fletcher ,  Joseph Alphonse Kotylo ,  Jeffrey Alan Knight ,  David Michael Passante ,  Allen F. Moring

发明人： James W. Fuller, Jr. ,  Mary Beth Fletcher ,  Joseph Alphonse Kotylo ,  Jeffrey Alan Knight ,  David Michael Passante ,  Allen F. Moring

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/24 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.

摘要翻译： 根据本发明，提供了一种用于控制塑料密封剂的流动的技术，该技术用于结合到形成在芯片载体衬底上的焊盘的集成电路（I / C）芯片引线上。 该技术包括将阻挡材料施加到围绕引线接合焊盘的基板上，该阻挡材料为从其表面向上突出的两个壁的形式，并且在壁之间限定密封材料的流动。 这防止密封剂材料流过所需的限定边界并覆盖不打算被覆盖的电路连接焊盘。

公开(公告)号：US5955782A

公开(公告)日：1999-09-21

申请号：US964037

申请日：1997-11-04

申请人： Stephen John Kosteva ,  David Michael Passante ,  William John Rudik ,  David John Russell ,  Jonathan Craig Whitcomb

发明人： Stephen John Kosteva ,  David Michael Passante ,  William John Rudik ,  David John Russell ,  Jonathan Craig Whitcomb

IPC分类号： H01L21/60 ,  H01L23/34

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15747

摘要： A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.

摘要翻译： 已经开发了半导体封装及其制备方法以获得对有机芯片载体的芯片附着力的改善。 铜芯接合焊盘涂覆有钝化材料并且用相同的钝化材料附着到有机卡上。 半导体管芯可以用相同的钝化材料或普通的管芯接合粘合剂粘附到涂覆的焊料焊盘上。 或者，钝化材料仅涂覆在芯片接合焊盘的附接模具的部分上，并且通常的芯片粘合粘合剂将芯片焊盘附接到有机卡。

公开(公告)号：US5784260A

公开(公告)日：1998-07-21

申请号：US657469

申请日：1996-05-29

申请人： James W. Fuller, Jr. ,  Mary Beth Fletcher ,  Joseph Alphonse Kotylo ,  Jeffrey Alan Knight ,  David Michael Passante ,  Allen F. Moring

发明人： James W. Fuller, Jr. ,  Mary Beth Fletcher ,  Joseph Alphonse Kotylo ,  Jeffrey Alan Knight ,  David Michael Passante ,  Allen F. Moring

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/24 ,  H01L23/31 ,  H05K1/18 ,  H05K7/02

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.

摘要翻译： 根据本发明，提供了一种用于控制塑料密封剂的流动的技术，该技术用于结合到形成在芯片载体衬底上的焊盘的集成电路（I / C）芯片引线上。 该技术包括将阻挡材料施加到围绕引线接合焊盘的基板上，该阻挡材料是从其表面向上突出的两个壁的形式，并且在壁之间限定一个阱以限制密封剂材料的流动。 这防止密封剂材料流过所需的限定边界并覆盖不打算被覆盖的电路连接焊盘。