公开(公告)号：US07944402B2

公开(公告)日：2011-05-17

申请号：US12116224

申请日：2008-05-07

Applicant: Shi-Ming Zhao ,  Ding-Bing Lin ,  Chao-Hsiung Tseng ,  Jui-Hsien Chien ,  Shiao-Ting Wu

Inventor： Shi-Ming Zhao ,  Ding-Bing Lin ,  Chao-Hsiung Tseng ,  Jui-Hsien Chien ,  Shiao-Ting Wu

IPC: H01Q9/26

CPC classification number: H01Q9/26 ,  H01Q5/00 ,  H01Q5/321 ,  H01Q5/371

Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.

Abstract translation: 根据本发明的一个实施例，能够支持多频带通信的偶极天线包括折叠结构的天线的第一部分，天线的第二部分包括第一耦合垫和物理上的第二耦合垫 以及沿着天线的第一部分和天线的第二部分的电流路径，其中包括第一耦合焊盘和第二耦合焊盘的电流路径的第一部分被配置为引入慢波 如果电流流过电流路径的第一部分，效应。

公开(公告)号：US20100212949A1

公开(公告)日：2010-08-26

申请号：US12392227

申请日：2009-02-25

Applicant: Jung-Chan Chang ,  Ding-Bing Lin

Inventor： Jung-Chan Chang ,  Ding-Bing Lin

IPC: H01R12/06

CPC classification number: H05K1/025 ,  H01L23/66 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K2201/09236 ,  H01L2924/00

Abstract: A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines are formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.

Abstract translation: 互连结构包括基板，一对互连焊盘，一对传输线。 衬底层叠有至少一层，并且每个层具有第一表面平面和第二表面。 一对互连焊盘形成在基板的第一层的第一表面上。 一对传输线形成在第一层的第一表面上，并且一对传输线具有用于连接到该对互连焊盘的Y型闭合迹线部分。 此外，层的第一表面平面形成有通孔，该通孔形成在由Y型闭合迹线部分限定的腹股沟区域内并延伸到第一层的第二表面平面，其中第一 层是电力平面或接地平面。

公开(公告)号：US20090278758A1

公开(公告)日：2009-11-12

申请号：US12116224

申请日：2008-05-07

Applicant: Shi-Ming Zhao ,  Ding-Bing Lin ,  Chao-Hsiung Tseng ,  Jui-Hsien Chien ,  Shiao-Ting Wu

Inventor： Shi-Ming Zhao ,  Ding-Bing Lin ,  Chao-Hsiung Tseng ,  Jui-Hsien Chien ,  Shiao-Ting Wu

IPC: H01Q9/26

CPC classification number: H01Q9/26 ,  H01Q5/00 ,  H01Q5/321 ,  H01Q5/371

Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.

Abstract translation: 根据本发明的一个实施例，能够支持多频带通信的偶极天线包括折叠结构的天线的第一部分，天线的第二部分包括第一耦合垫和物理上的第二耦合垫 以及沿着天线的第一部分和天线的第二部分的电流路径，其中包括第一耦合焊盘和第二耦合焊盘的电流路径的第一部分被配置为引入慢波 如果电流流过电流路径的第一部分，效应。

公开(公告)号：US20100188168A1

公开(公告)日：2010-07-29

申请号：US12360282

申请日：2009-01-27

Applicant: Ding-Bing LIN ,  Kuo-Chiang HUNG

Inventor： Ding-Bing LIN ,  Kuo-Chiang HUNG

IPC: H03H7/01

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H03H1/0007 ,  H03H7/0115 ,  H05K1/0227 ,  H05K1/165 ,  H05K2201/09263 ,  H01L2924/00

Abstract: Provided is a wide band filter structure including two coupling units and one bridge unit. Each of the coupling units has a joint. The joint is concentrically encircled by a spiral with two ends. One of the ends of the spiral is positioned at the joint. The bridge unit is connected to between the two spirals by the other ends thereof, respectively. The wide band filter structure achieves high impedance, prevents wide band Delta-I noise, improves electromagnetic interference (EMI) and electromagnetic compatibility (EMC), and reduces cost when used in related layout of printed circuit boards and IC package substrates.

Abstract translation: 提供了一种宽带滤波器结构，包括两个耦合单元和一个桥接单元。 每个联接单元具有接头。 接头同心圆化，带有两端螺旋。 螺旋的一个端部位于接头处。 桥单元分别通过其两端连接在两个螺旋之间。 宽带滤波器结构实现高阻抗，防止宽带Delta-I噪声，改善电磁干扰（EMI）和电磁兼容性（EMC），并降低印刷电路板和IC封装基板相关布局时的成本。

公开(公告)号：US08071891B2

公开(公告)日：2011-12-06

申请号：US12392227

申请日：2009-02-25

Applicant: Jung-Chan Chang ,  Ding-Bing Lin

Inventor： Jung-Chan Chang ,  Ding-Bing Lin

IPC: H05K1/11

CPC classification number: H05K1/025 ,  H01L23/66 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K2201/09236 ,  H01L2924/00

Abstract: A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines is formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.

Abstract translation: 互连结构包括基板，一对互连焊盘，一对传输线。 衬底层叠有至少一层，并且每个层具有第一表面平面和第二表面。 一对互连焊盘形成在基板的第一层的第一表面上。 一对传输线形成在第一层的第一表面上，并且一对传输线具有用于连接到该对互连焊盘的Y型闭合迹线部分。 此外，层的第一表面平面形成有通孔，该通孔形成在由Y型闭合迹线部分限定的腹股沟区域内并延伸到第一层的第二表面平面，其中第一 层是电力平面或接地平面。