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公开(公告)号:US20050221110A1
公开(公告)日:2005-10-06
申请号:US11094352
申请日:2005-03-31
申请人: Masahito Fujita , Eisaku Inoue , Shigeru Inami
发明人: Masahito Fujita , Eisaku Inoue , Shigeru Inami
IPC分类号: C22C13/00 , C22C21/00 , C22C21/06 , C22C21/08 , C22C21/10 , C22C21/12 , C22C21/14 , C22C21/16 , C22C21/18 , C23C24/04 , C23C26/02 , F16C33/12 , F16C33/14
CPC分类号: C22C21/003 , C22C13/00 , C22C21/06 , C22C21/08 , C22C21/10 , C22C21/12 , C22C21/14 , C22C21/16 , C22C21/18 , C23C24/04 , C23C26/02 , F16C33/121 , F16C2204/22 , Y10T428/12757
摘要: A plain bearing is provided which has an Sn-and-Si-rich layer formed of an Al alloy containing Sn and Si, and a base material which does not contain Sn. The Sn-and-Si-rich layer have the sliding surface having an area ratio of Sn phase grains in a range of 6 to 40% and that of Si phase grains in a range of 5 to 25%.
摘要翻译: 提供一种滑动轴承,其具有由含有Sn和Si的Al合金和不含Sn的基材形成的Sn和Si富含层。 Sn和Si富含层的滑动面的Sn相晶粒的面积比在6〜40%的范围内,Si相的面积比在5〜25%的范围内。
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公开(公告)号:US20080206087A1
公开(公告)日:2008-08-28
申请号:US12110003
申请日:2008-04-25
申请人: Masahito FUJITA , Eisaku INOUE , Shigeru INAMI
发明人: Masahito FUJITA , Eisaku INOUE , Shigeru INAMI
IPC分类号: B22F7/04
CPC分类号: C22C21/003 , C22C13/00 , C22C21/06 , C22C21/08 , C22C21/10 , C22C21/12 , C22C21/14 , C22C21/16 , C22C21/18 , C23C24/04 , C23C26/02 , F16C33/121 , F16C2204/22 , Y10T428/12757
摘要: A plain bearing is provided which has an Sn-and-Si-rich layer formed of an Al alloy containing Sn and Si, and a base material which does not contain Sn. The Sn-and-Si-rich layer have the sliding surface having an area ratio of Sn phase grains in a range of 6 to 40% and that of Si phase grains in a range of 5 to 25%.
摘要翻译: 提供一种滑动轴承,其具有由含有Sn和Si的Al合金和不含Sn的基材形成的Sn和Si富含层。 Sn和Si富含层的滑动面的Sn相晶粒的面积比在6〜40%的范围内,Si相的面积比在5〜25%的范围内。
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公开(公告)号:US06767648B2
公开(公告)日:2004-07-27
申请号:US10281298
申请日:2002-10-28
IPC分类号: B32B702
CPC分类号: C22C9/00 , B22F7/04 , B22F2003/248 , B22F2998/10 , B32B15/00 , B32B15/015 , C22C9/02 , C22C9/06 , C22C9/08 , F16C33/121 , F16C2204/12 , Y10S384/912 , Y10T428/12028 , Y10T428/12063 , Y10T428/12139 , Y10T428/12694 , Y10T428/12924 , B22F3/10 , B22F3/18
摘要: There are provided a copper-based sintered sliding material comprising a steel back metal layer, and a sintered layer made of Cu or a Cu-based alloy which is bonded onto the steel back metal layer, the steel back metal layer having a hardness not less than 160 Hv and an elongation not less than 10%, the sintered layer having a hardness not more than 130 Hv and crystal grains each provided with a grain size not more than 45 &mgr;m, a method of producing the sliding material, and a sliding bearing formed of the sliding material.
摘要翻译: 提供了一种铜基烧结滑动材料,其包括钢背金属层,和由Cu或Cu基合金制成的烧结层,该烧结层与钢背金属层接合,钢背金属层的硬度不低于 烧结层的硬度不高于130Hv,晶粒尺寸不大于45μm,制造滑动材料的方法和滑动轴承 由滑动材料形成。
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公开(公告)号:US07862768B2
公开(公告)日:2011-01-04
申请号:US12110003
申请日:2008-04-25
申请人: Masahito Fujita , Eisaku Inoue , Shigeru Inami
发明人: Masahito Fujita , Eisaku Inoue , Shigeru Inami
CPC分类号: C22C21/003 , C22C13/00 , C22C21/06 , C22C21/08 , C22C21/10 , C22C21/12 , C22C21/14 , C22C21/16 , C22C21/18 , C23C24/04 , C23C26/02 , F16C33/121 , F16C2204/22 , Y10T428/12757
摘要: A plain bearing is provided which has an Sn-and-Si-rich layer formed of an Al alloy containing Sn and Si, and a base material which does not contain Sn. The Sn-and-Si-rich layer have the sliding surface having an area ratio of Sn phase grains in a range of 6 to 40% and that of Si phase grains in a range of 5 to 25%.
摘要翻译: 提供一种滑动轴承,其具有由含有Sn和Si的Al合金和不含Sn的基材形成的Sn和Si富含层。 Sn和Si富含层的滑动面的Sn相晶粒的面积比在6〜40%的范围内,Si相的面积比在5〜25%的范围内。
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公开(公告)号:US07067021B2
公开(公告)日:2006-06-27
申请号:US10436145
申请日:2003-05-13
CPC分类号: C22F1/00 , F16C33/125 , F16C33/14
摘要: A method of manufacturing a multilayer material including a back metal and a metal plate made from a metal differing from the back metal is disclosed. The method includes heating powder of the metal formed into the metal plate in a reducing atmosphere so that an oxide on a surface of the metal powder is deoxidized, and spreading the deoxidized metal powder onto the back metal and irradiating laser beam having an energy density of 10 to 100 kW/cm2 onto the metal powder spread on the back metal so that the metal powder is partially heated to be melted, while the laser beam is moved relative to the spread metal powder, and quenching the melted part of the metal powder at an underside of the back metal so that the melted part is rapidly solidified, whereupon the multilayer material has a dendritic structure in which the metal plate extends substantially vertically from a surface of the back metal, and the dendritic structure has a crystal grain size equal to or smaller than 0.02 mm at a cut surface thereof parallel to a surface of the back metal and/or a dendritic arm spacing equal to or smaller than 0.02 mm at a cut surface thereof vertical to the surface of the back metal.
摘要翻译: 公开了一种制造包括背金属和金属板的多层材料的方法,该金属板由与背面金属不同的金属制成。 该方法包括在还原气氛中加热形成金属板的金属粉末,使金属粉末表面上的氧化物脱氧,并将脱氧金属粉末扩散到背面金属上,并照射能量密度为 将10至100kW / cm 2的金属粉末分散在背面金属上的金属粉末上,使得金属粉末被部分地加热熔化,同时激光束相对于铺展金属粉末移动,并且淬火 金属粉末的熔融部分在背面金属的下侧,使得熔融部分快速凝固,于是多层材料具有树枝状结构,其中金属板从背面金属的表面基本垂直地延伸,并且树枝状 结构在平行于背面金属的表面的切割面上和/或在切割面t处等于或小于0.02mm的树突臂间距的晶粒尺寸等于或小于0.02mm 这垂直于背面金属的表面。
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公开(公告)号:US06753092B2
公开(公告)日:2004-06-22
申请号:US10285481
申请日:2002-11-01
IPC分类号: B32B310
CPC分类号: C22C9/00 , B22F7/04 , B22F2003/248 , B22F2999/00 , B32B15/015 , C22C9/02 , C22C9/04 , C23C24/10 , C23C30/00 , F16C33/121 , F16C33/14 , F16C33/24 , Y02P10/295 , Y10S384/912 , Y10T428/12063 , Y10T428/12486 , Y10T428/12903 , Y10T428/12924 , B22F3/1055
摘要: A multilayer material comprising a backing material (10) and a obverse material (12) made of a metal different from the backing material, said obverse material being bonded to the backing material, said obverse material having a rapidly cooled dendrite structure extended substantially vertically to the backing material, said dendrite structure having a grain size not more than 0.02 mm in a cutting plane in parallel to the backing material and/or a dendrite arm spacing not more than 0.02 mm in a cutting plane vertical to the backing material.
摘要翻译: 一种多层材料,包括背衬材料(10)和由不同于所述背衬材料的金属制成的正面材料(12),所述正面材料与所述背衬材料结合,所述正面材料具有快速冷却的枝晶结构,其基本垂直延伸至 背衬材料,所述枝晶结构在平行于背衬材料的切割平面中具有不大于0.02mm的粒度,和/或垂直于背衬材料的切割平面中的枝晶臂间距不大于0.02mm。
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公开(公告)号:US06602615B2
公开(公告)日:2003-08-05
申请号:US10103764
申请日:2002-03-25
IPC分类号: B32B1520
CPC分类号: B22F7/008 , B22F2998/00 , B32B15/013 , C22C9/00 , C22C9/02 , F16C33/121 , F16C2204/12 , F16C2204/18 , Y10S428/926 , Y10T428/12014 , Y10T428/12917 , Y10T428/12924 , B22F7/04
摘要: Disclosed is a composite sliding material having a steel plate and a sintered copper alloy layer which is bonded to the steel plate. The copper alloy contains, 1.5 to 15 mass % Sn, 1.5 to 15 mass % Bi, 1.5 to 20 volume % of a solid lubricant, and balance of Cu and incidental impurities. The volume ratio of Bi to the solid lubricant is in a range of 0.5 to 2.0. Bi and the solid lubricant improves the copper alloy in sintering property, since Bi melts when sintering because of a low melting point resulting in improved sintering property, and the solid lubricant ensures good anti-seizure property, and deterioration of mechanical strength is prevented by virtue of a phenomenon that the solid lubricant is entrained in Bi.
摘要翻译: 公开了一种复合滑动材料,其具有与钢板接合的钢板和烧结铜合金层。 铜合金含有1.5〜15质量%的Sn,1.5〜15质量%的Bi,1.5〜20体积%的固体润滑剂,余量的Cu和附带的杂质。 Bi与固体润滑剂的体积比在0.5至2.0的范围内。 Bi和固体润滑剂改善了铜合金的烧结性能,因为Bi由于熔点低而烧结而熔化,从而提高了烧结性能,固体润滑剂确保了良好的抗咬合性能,并且凭借其防止机械强度的劣化 固体润滑剂夹带在Bi中的现象。
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公开(公告)号:US06964713B2
公开(公告)日:2005-11-15
申请号:US10684801
申请日:2003-10-15
CPC分类号: C22C9/04 , F16C2360/24
摘要: A copper base alloy suitable for use as a material for a sliding member used under severe sliding conditions such as a floating bush bearing of a turbocharger used in automobiles is disclosed. The alloy comprises, by mass %, 15 to 25% Zn, 4.2 to 10% Di, 2 to 7% Mn, 1 to 3% Si and balance of Cu and unavoidable impurities, the alloy having a structure of which matrix is composed of α-single phase, wherein a eutectic structure of the α-phase and an Mn—Si compound and Bi particle are distributed throughout the matrix.
摘要翻译: 本发明公开了一种适用于汽车用涡轮增压器浮动衬套轴承等严酷滑动条件下滑动构件的材料的铜基合金。 该合金以质量%计含有15〜25%的Zn,4.2〜10%的Di,2〜7%的Mn,1〜3%的Si,余量的Cu和不可避免的杂质,该合金的结构为: α-单相,其中α相的共晶结构和Mn-Si化合物和Bi颗粒分布在整个基体中。
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