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    Plated copper alloy material and process for production thereof
    1.
    发明授权
    Plated copper alloy material and process for production thereof 有权
    镀铜合金材料及其生产方法

    公开(公告)号：US06759142B2

    公开(公告)日：2004-07-06

    申请号：US10207027

    申请日：2002-07-30

    Applicant: Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

    Inventor： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

    IPC: B32B1520

    CPC classification number: C23C28/021 ,  C23C26/00 ,  C23C28/023 ,  C25D5/12 ,  H05K3/244 ,  Y10S428/929 ,  Y10S428/935 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

    Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

    Abstract translation: 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。

    Copper foil for printed circuit boards and its surface treatment method
    5.
    发明授权
    Copper foil for printed circuit boards and its surface treatment method 失效

    公开(公告)号：US06524723B2

    公开(公告)日：2003-02-25

    申请号：US09833062

    申请日：2001-04-12

    Applicant: Masaru Hirose ,  Masasto Takami

    Inventor： Masaru Hirose ,  Masasto Takami

    IPC: B32B1520

    CPC classification number: C25D3/565 ,  C25D11/36 ,  C25D11/38 ,  H05K3/244 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12903

    Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus. The process of treating the surface of copper foil for printed circuit boards comprising the steps of forming the first layer composed of a sulfur-contained zinc alloy by electrolysis by dipping at least the surface on one side of the copper foil in a solution containing a zinc compound and a sulfur compound and forming the second layer composed of chromate by electrolysis by dipping said first layer in a solution containing a chromium compound, or a chromium compound and a phosphorus compound.

    Aluminum alloy for a welded construction and welded joint using the same
    6.
    发明授权
    Aluminum alloy for a welded construction and welded joint using the same 失效
    用于焊接结构的铝合金和使用其的焊接接头

    公开(公告)号：US06440583B1

    公开(公告)日：2002-08-27

    申请号：US09699091

    申请日：2000-10-26

    Applicant: Seizo Ueno ,  Yoichiro Bekki ,  Noboru Hayashi

    Inventor： Seizo Ueno ,  Yoichiro Bekki ,  Noboru Hayashi

    IPC: B32B1520

    CPC classification number: B23K35/286 ,  B23K35/288 ,  B23K2103/10 ,  Y10S428/934 ,  Y10T428/12569 ,  Y10T428/12764

    Abstract: Disclosed is an Al alloy for a welded construction having excellent welding characteristics, which Al alloy comprises 1.5 to 5 wt % of Si (hereinafter, wt % is referred to as %), 0.2 to 1.5% of Mg, 0.2 to 1.5% of Zn, 0.2 to 2% of Cu, 0.1 to 1.5% of Fe, and at least one member selected from the group consisting of 0.01 to 1.0% of Mn, 0.01 to 0.2% of Cr, 0.01 to 0.2% of Ti, 0.01 to 0.2% of Zr, and 0.01 to 0.2% of V, with the balance being Al and inevitable impurities. Also disclosed is a welded joint having this Al alloy base metal welded with an Al—Mg- or Al—Si-series filler metal.

    Abstract translation: 公开了一种具有优异焊接特性的焊接结构的Al合金，其中Al合金包含1.5〜5重量％的Si（以下称为％），0.2〜1.5重量％的Mg，0.2〜1.5重量％的Zn ，Cu：0.2〜2％，Fe：0.1〜1.5％，Mn：0.01〜1.0％，Cr：0.01〜0.2％，Ti：0.01〜0.2％，0.01〜0.2 ％的Zr和0.01〜0.2％的V，余量为Al和不可避免的杂质。 还公开了一种焊接接头，其具有焊接有Al-Mg或Al-Si系填料金属的该Al合金基体金属。

    Plated material for connectors
    7.
    发明授权
    Plated material for connectors 有权
    电镀材料用于连接器

    公开(公告)号：US06403234B1

    公开(公告)日：2002-06-11

    申请号：US09593416

    申请日：2000-06-14

    Applicant: Atsushi Kodama ,  Kazuhiko Fukamachi

    Inventor： Atsushi Kodama ,  Kazuhiko Fukamachi

    IPC: B32B1520

    CPC classification number: C25D3/32 ,  B32B15/01 ,  C25D3/562 ,  C25D3/60 ,  C25D5/10 ,  Y10T428/12458 ,  Y10T428/12722 ,  Y10T428/1291

    Abstract: A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.

    Abstract translation: 用于连接器的电镀材料具有优异的插拔性能，包括由Cu或Cu合金构成的基体金属上提供的维氏硬度为450-750Hv的Ni合金镀层和0.3-2μm的厚度的中间层 ，设置在其上的回流的Sn或Sn合金表面层，以及主要由Sn-Ni构成的厚度为0.05〜2μm的合金层，其中间层和表面层之间的平均粒径 所述Sn-Ni化合物为0.05〜1um。

    High-strength aluminum alloy clad material for heat exchangers exhibiting excellent corrosion resistance
    8.
    发明授权
    High-strength aluminum alloy clad material for heat exchangers exhibiting excellent corrosion resistance 有权
    具有优异耐腐蚀性的用于热交换器的高强度铝合金包覆材料

    公开(公告)号：US06361882B1

    公开(公告)日：2002-03-26

    申请号：US09703224

    申请日：2000-10-31

    Applicant: Yoshifusa Shoji ,  Kohichi Maeda ,  Toshihiko Fukuda

    Inventor： Yoshifusa Shoji ,  Kohichi Maeda ,  Toshihiko Fukuda

    IPC: B32B1520

    CPC classification number: F28F21/089 ,  B23K1/0012 ,  B23K2101/14 ,  B23K2103/10 ,  B32B15/20 ,  F28D1/0333 ,  F28F21/084 ,  Y10S428/933 ,  Y10T428/12764 ,  Y10T428/12986

    Abstract: A high-strength aluminum alloy clad material for heat exchangers which excels in corrosion resistance and formability before brazing and has improved strength after brazing. The aluminum alloy clad material is made up of a core material and a brazing material, with one or both sides of the core material clad with the brazing material. The core material is made up of an aluminum alloy containing from 0.3% to less than 0.6% of Mn, from more than 0.6% to 1.0% of Cu, less than 0.1% of Si, 0.3% or less of Fe, and from 0.06% to 0.35% of Ti, with the remainder being Al and impurities; and the brazing material used to clad the core material is made up of an Al—Si aluminum alloy in which the Ca content is limited to 0.006% or less.

    Abstract translation: 一种用于热交换器的高强度铝合金包覆材料，其在钎焊之前具有优异的耐腐蚀性和成形性，并且在钎焊之后具有改善的强度。 铝合金包覆材料由芯材料和钎焊材料构成，芯材的一侧或两侧用钎焊材料包覆。 芯材由含有0.3〜0.6重量％的Mn，0.6〜1.0％的Cu，0.1个以下的Si，0.3个以下的Fe，0.06以上的铝合金构成 ％至0.35％的Ti，其余为Al和杂质; 用于包覆芯材的钎焊材料由Ca含量限制在0.006％以下的Al-Si铝合金构成。

    Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
    9.
    发明授权
    Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof 有权
    其表面电沉积铜箔，其制备方法及其用途

    公开(公告)号：US06291081B1

    公开(公告)日：2001-09-18

    申请号：US09652642

    申请日：2000-08-31

    Applicant: Hitoshi Kurabe ,  Mitsuhito Shibata ,  Masakazu Mitsuhashi

    Inventor： Hitoshi Kurabe ,  Mitsuhito Shibata ,  Masakazu Mitsuhashi

    IPC: B32B1520

    CPC classification number: C25D5/48 ,  C25D1/04 ,  H05K3/382 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/12993

    Abstract: A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to the first mechanical polishing so that the average surface roughness (Rz) of the matte side becomes 1.5 to 6 &mgr;m; and subjecting the matte side having undergone the first mechanical polishing to at least one further mechanical polishing so that the average surface roughness (Rz) of the matte side becomes 1.0 to 3.0 &mgr;m. The protrudent parts of the matte side are selectively polished by the first mechanical polishing, and the surface having undergone the first mechanical polishing is further subjected to the second and any ensuing mechanical polishings under milder conditions. Thus, a highly planar polished face with excellent surface properties can be obtained. Moreover, depressed parts are not polished, so that the amount of copper lost by the polishings is extremely minute. The use of the electrodeposited copper foil with its surface prepared according to the present invention enables forming a wiring pattern of extremely fine pitch.

    Abstract translation: 一种制备其表面的电沉积铜箔的方法，包括以下步骤：使平均表面粗糙度（Rz）在2.5-10μm范围内的具有光泽面和无光泽面的电沉积铜箔与第一 机械抛光使得无光面的平均表面粗糙度（Rz）为1.5〜6μm; 并对已进行第一次机械研磨的磨砂面进行至少一次进一步的机械研磨，使得无光面的平均表面粗糙度（Rz）为1.0〜3.0μm。 通过第一机械抛光来选择性地抛光无光泽面的突出部分，并且经历了第一次机械抛光的表面在更温和的条件下进一步受到第二次和随后的机械抛光。 因此，可以获得具有优异表面性能的高度平面的抛光面。 此外，凹陷部件不被抛光，使得由抛光损失的铜的量非常小。 使用根据本发明制备的表面的电沉积铜箔能够形成极细间距的布线图案。

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