摘要:
A method for etching metal deposited on a substrate, the method comprising: depositing a metal layer above a substrate; coating at least a portion of the deposited metal layer with a photo-resist; pattering the photo-resist; etching the deposited metal layer with an inert gas plasma at an energy density of less than 0.5 Watt/cm2, the substrate being maintained at a temperature of less than 50° C.; and ashing a resultant crust with an ashing gas, the ashing gas comprising CF4 and O2.
摘要:
Disclosed are an asymmetric Y-shaped optical waveguide structure and an optical transceiver using the structure. The asymmetric Y-shaped optical waveguide structure includes a main axis optical waveguide extended in a longitudinal direction; and a branch optical waveguide extended from an extension start point in the main axis optical waveguide in a longitudinal direction as much as a predetermined region and then diverged outside. The main axis optical waveguide and the branch optical waveguide have effective refractive indexes, the magnitude relation of which is reversed for optical signals having first and second wavelength range. The optical transceiver includes an asymmetric Y-shaped optical waveguide structure, an optical fiber optically coupled to the structure for transmitting/receiving of the bi-directional optical signal, a laser diode and a photodiode. Accordingly, it is possible to miniaturize the optical transceiver, reduce a packaging cost, and improve reliability of the optical transceiver.
摘要:
A planar lightwave circuit and a method of producing such a planar lightwave circuit, the planar lightwave circuit having an element secured thereon. The planar lightwave circuit comprises: a substrate; a trench cut in the substrate; at least one solder pad deposited on a top surface deposited above the substrate; at least one of a waveguide defined in a layer deposited above the substrate and an optical fiber; and an optical element placed within the trench and in optical communication with the at least one of a waveguide and an optical fiber; at least one metal contact configured on the optical element to be adjacent to the metal pad, the solder pad being connected to the metal contact providing physical support to the optical element and an electrical connection between the metal pad and the metal contact.
摘要:
Coating formulations, unique methods for their production and use, which have high drying capacity, maintain high levels of brightness, even after the application of a wax coating onto the printed substrate. Precipitated amorphous silicates, titanium dioxide, and other fillers are combined and coated onto heavyweight linerboard to facilitate ink drying and minimize brightness loss associated with wax dipped cartons.
摘要:
A composite paper is provided which is comprised of a paper substrate, a continuous thermoplastic film formed on at least one surface of the paper substrate, and a layer of an ink absorbent composite bonded to the outer surface of the thermoplastic film. The composite paper of this invention is especially useful as a printing substrate and in the manufacture of packages requiring printed surfaces.
摘要:
A process of producing high quality extrusion coated paper for high quality printing by extruding polyethylene on a highly smoothed base sheet of paper and passing the coated base sheet through the nip of two cooperating rollers, at least one of which rollers is a low-friction gloss chill roller having a surface finish with a degree of roughness between that of a high gloss roller and a matte finished roller.
摘要:
A planar lightwave circuit and a method of producing such a planar lightwave circuit, the planar lightwave circuit having an element secured thereon. The planar lightwave circuit comprises: a substrate; a trench cut in the substrate; at least one solder pad deposited on a top surface deposited above the substrate; at least one of a waveguide defined in a layer deposited above the substrate and an optical fiber; and an optical element placed within the trench and in optical communication with the at least one of a waveguide and an optical fiber; at least one metal contact configured on the optical element to be adjacent to the metal pad, the solder pad being connected to the metal contact providing physical support to the optical element and an electrical connection between the metal pad and the metal contact.
摘要:
A precision RF passive component comprising: a silicon substrate; a first dielectric layer deposited above the silicon substrate; a first metal layer formed above the first dielectric layer; a second dielectric layer formed above the first metal layer; and a second metal layer formed above the second dielectric layer. In one embodiment a passivation layer is added above the second metal layer. In an exemplary embodiment the first metal layer comprises a first adhesion layer, a metal sub-layer, and a second adhesion layer; and the second dielectric layer comprises a first diffusion barrier layer, a dielectric sub-layer and a second diffusion barrier. In an exemplary embodiment, the metal sub-layer comprises copper. In another exemplary embodiment the dielectric sub-layer comprises SiO2 or Si3N4 between diffusion barrier layers comprising SiN.
摘要翻译:一种精密RF无源元件,包括:硅衬底; 沉积在硅衬底上的第一电介质层; 形成在所述第一介电层上方的第一金属层; 形成在所述第一金属层上方的第二电介质层; 以及形成在所述第二介电层上方的第二金属层。 在一个实施例中,钝化层被添加在第二金属层上。 在示例性实施例中,第一金属层包括第一粘附层,金属子层和第二粘合层; 并且第二介电层包括第一扩散阻挡层,电介质子层和第二扩散阻挡层。 在示例性实施例中,金属子层包括铜。 在另一个示例性实施例中,电介质子层在包括SiN的扩散阻挡层之间包括SiO 2或Si 3 N 4 N 4。
摘要:
Devices and methods for measuring mottle of paper-like materials are provided. the invention includes directing a radiation over a paper-like material and scanning it in a plurality of directions. Radiation scattered by the paper-like material is detected to produce an output. This output is processed to provide a reading proportional to the mottle of the paper-like material. The invention uses electro-optical devices and signal processing to quantify mottle as an appearance property. Gloss measurements of the paper-like material can also be quantified and simultaneously displayed.
摘要:
A method for etching metal deposited on a substrate, the method comprising: depositing a metal layer above a substrate; coating at least a portion of the deposited metal layer with a photo-resist; pattering the photo-resist; etching the deposited metal layer with an inert gas plasma at an energy density of less than 0.5 Watt/cm2, the substrate being maintained at a temperature of less than 50° C.; and ashing a resultant crust with an ashing gas, the ashing gas comprising CF4 and O2.