公开(公告)号：US07327024B2

公开(公告)日：2008-02-05

申请号：US10998798

申请日：2004-11-24

申请人： Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

发明人： Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

IPC分类号： H01L23/52

CPC分类号： H01L24/49 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/361 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/10189 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.

摘要翻译： 功率模块包括包括上层，电绝缘体和热耦合层的衬底。 上层包括导电图案，并且被配置为用于接收功率器件。 电绝缘体设置在上层和热耦合层之间。 热耦合层被配置为热耦合到散热器。 功率模块还包括至少一个层状互连，其包括第一和第二导电层以及设置在第一和第二导电层之间的绝缘层。 层状互连的第一导电层电连接到衬底的上层。 电连接将功率器件的顶侧连接到层状互连的第二导电层。