公开(公告)号：US07327024B2

公开(公告)日：2008-02-05

申请号：US10998798

申请日：2004-11-24

申请人： Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

发明人： Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

IPC分类号： H01L23/52

CPC分类号： H01L24/49 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/361 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/10189 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.

摘要翻译： 功率模块包括包括上层，电绝缘体和热耦合层的衬底。 上层包括导电图案，并且被配置为用于接收功率器件。 电绝缘体设置在上层和热耦合层之间。 热耦合层被配置为热耦合到散热器。 功率模块还包括至少一个层状互连，其包括第一和第二导电层以及设置在第一和第二导电层之间的绝缘层。 层状互连的第一导电层电连接到衬底的上层。 电连接将功率器件的顶侧连接到层状互连的第二导电层。

公开(公告)号：US20130075878A1

公开(公告)日：2013-03-28

申请号：US13247216

申请日：2011-09-28

申请人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

发明人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

摘要翻译： 电源模块包括至少一个半导体管芯保持结构。 每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。 每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。 多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

公开(公告)号：US07817422B2

公开(公告)日：2010-10-19

申请号：US12193441

申请日：2008-08-18

申请人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

发明人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

IPC分类号： H05K7/20

CPC分类号： F28F3/12 ,  H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

公开(公告)号：US08929071B2

公开(公告)日：2015-01-06

申请号：US12317361

申请日：2008-12-22

申请人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic ,  Daniel Jason Erno ,  Charles Gerard Woychik

发明人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic ,  Daniel Jason Erno ,  Charles Gerard Woychik

IPC分类号： H02B1/00 ,  H05K7/20 ,  H01L23/34 ,  H01L23/473

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L2224/48091 ,  H01L2924/09701 ,  Y10T29/4935 ,  H01L2924/00014

摘要： A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.

摘要翻译： 冷却装置包括具有结合到外平面的金属层的陶瓷基板。 冷却装置还包括结合到陶瓷基板的相对侧的通道层和结合到通道层的外表面的歧管层。 使用诸如钎焊的高温工艺将衬底层结合在一起以形成单个衬底组件。 通过诸如胶粘剂的低温粘合工艺将增压室结合到单个基板组件，并且被配置为提供延伸的歧管层入口和出口。

公开(公告)号：US08487416B2

公开(公告)日：2013-07-16

申请号：US13247216

申请日：2011-09-28

申请人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

发明人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

IPC分类号： H01L23/552 ,  H01L23/34 ,  H01L23/04 ,  H01L23/12 ,  H05K7/20 ,  H05K9/00

CPC分类号： H01L23/552 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

摘要翻译： 电源模块包括至少一个半导体管芯保持结构。 每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。 每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。 多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

公开(公告)号：US20100038774A1

公开(公告)日：2010-02-18

申请号：US12193429

申请日：2008-08-18

申请人： Richard S. Zhang ,  Richard Alfred Beaupre ,  Ramakrishna Venkata Mallina ,  Arun Virupaksha Gowda ,  Le Yan ,  Ljubisa Dragoljub Stevanovic ,  Peter Morley ,  Stephen Adam Solovitz

发明人： Richard S. Zhang ,  Richard Alfred Beaupre ,  Ramakrishna Venkata Mallina ,  Arun Virupaksha Gowda ,  Le Yan ,  Ljubisa Dragoljub Stevanovic ,  Peter Morley ,  Stephen Adam Solovitz

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L24/72 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.

摘要翻译： 提供了用于冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括至少一个导热材料并且限定被配置为接收冷却剂的多个入口歧管，被配置为排出冷却剂的多个出口歧管以及被配置成从进气歧管接收冷却剂并将冷却剂输送到出口的多个通路 歧管。 歧管和毫通道靠近电子装置包装的上接触表面和下接触表面中的相应一个设置，用于用冷却剂冷却相应的表面。

公开(公告)号：US08076696B2

公开(公告)日：2011-12-13

申请号：US12609400

申请日：2009-10-30

申请人： Richard Alfred Beaupre ,  Eladio Clemente Delgado ,  Ljubisa Dragoljub Stevanovic

发明人： Richard Alfred Beaupre ,  Eladio Clemente Delgado ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H01L31/111

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.

摘要翻译： 提供了一种包括第一导电衬底和第二导电衬底的器件。 具有第一厚度的第一功率半导体部件可以电耦合到第一导电基板。 具有第二厚度的第二功率半导体部件可以电耦合到第二导电基板。 正端子也可以电耦合到第一导电衬底，而负端子可以电耦合到第二功率半导体部件，并且输出端子可以电耦合到第一功率半导体部件和第二导电衬底。 因此，端子，功率半导体部件和导电基板可以并入到公共电路回路中，并且可以一起构造成使得至少一个方向上的电路回路的宽度由第一厚度 或第二厚度。

公开(公告)号：US07898807B2

公开(公告)日：2011-03-01

申请号：US12400067

申请日：2009-03-09

申请人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

发明人： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  C04B2237/407 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0355 ,  H05K2201/09745 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/494 ,  Y10T428/2457 ,  H01L2924/00

摘要： A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

摘要翻译： 安装在其上的用于电力电子的基板包括具有下表面和上表面的中间陶瓷层，附着到中间陶瓷层的上表面的上金属层和附接到中间陶瓷层的下表面的下金属层 陶瓷层。 下金属层具有多个毫通道，其构造成输送用于冷却电力电子设备的冷却剂，其中在连接到中间陶瓷层的下表面之前，在下金属层上形成毫通道。 还提出了制造冷却装置和装置的方法。

公开(公告)号：US20100038058A1

公开(公告)日：2010-02-18

申请号：US12193441

申请日：2008-08-18

申请人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

发明人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

IPC分类号： F28F7/00

CPC分类号： F28F3/12 ,  H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

公开(公告)号：US20110101515A1

公开(公告)日：2011-05-05

申请号：US12609400

申请日：2009-10-30

申请人： Richard Alfred Beaupre ,  Eladio Clemente Delgado ,  Ljubisa Dragoljub Stevanovic

发明人： Richard Alfred Beaupre ,  Eladio Clemente Delgado ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H01L23/538

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.

摘要翻译： 提供了一种包括第一导电衬底和第二导电衬底的器件。 具有第一厚度的第一功率半导体部件可以电耦合到第一导电基板。 具有第二厚度的第二功率半导体部件可以电耦合到第二导电基板。 正端子也可以电耦合到第一导电衬底，而负端子可以电耦合到第二功率半导体部件，并且输出端子可以电耦合到第一功率半导体部件和第二导电衬底。 因此，端子，功率半导体部件和导电基板可以并入到公共电路回路中，并且可以一起构造成使得至少一个方向上的电路回路的宽度由第一厚度 或第二厚度。