公开(公告)号：US08324511B1

公开(公告)日：2012-12-04

申请号：US12754837

申请日：2010-04-06

申请人： Ronald Patrick Huemoeller ,  Frederick Evans Reed ,  David Jon Hiner ,  Kiwook Lee

发明人： Ronald Patrick Huemoeller ,  Frederick Evans Reed ,  David Jon Hiner ,  Kiwook Lee

IPC分类号： H05K1/11

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05027 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2924/00014 ,  H05K3/4038 ,  H05K3/42 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.

摘要翻译： 一种方法包括将背面钝化层施加到电子部件的非活性表面并且包围从非活性表面突出的通孔。 该方法还包括激光烧蚀背面钝化层以露出通孔的一部分。 背面钝化层由低成本的有机材料形成。 此外，通过使用激光烧蚀工艺，以受控的方式去除背面钝化层以露出通孔的部分。 此外，通过使用激光烧蚀工艺，将所得到的背面钝化层的厚度以受控的方式设定为期望值。 此外，通过使用激光烧蚀工艺，与使用化学机械抛光相比，制造成本降低。