公开(公告)号：US06972383B2

公开(公告)日：2005-12-06

申请号：US10671517

申请日：2003-09-29

申请人： Fumio Akama

发明人： Fumio Akama

IPC分类号： B32B15/08 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  H05K3/46 ,  H01R12/04

CPC分类号： H05K3/4652 ,  H05K3/386 ,  H05K3/4614 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2203/1189

摘要： A multilayered circuit board has good imbedding properties for circuit patterns, and an interlayer insulating material having superior adhesive force and interlayer insulating properties. In a multilayered circuit board wherein interlayer connection is achieved by the contact of minute pointed protrusions, provided on a first conductive circuit layer, with a second conductive circuit layer, interlayer insulation is achieved by a film having a three-layer structure, comprising a thermoplastic film inserted between a pair of thermosetting adhesive layers.

摘要翻译： 多层电路板对于电路图案具有良好的嵌入性能，以及具有优异的粘合力和层间绝缘性能的层间绝缘材料。 在多层电路板中，其中层间连接是通过设置在第一导电电路层上的微小尖突起与第二导电电路层的接触来实现的，层间绝缘是通过具有三层结构的膜来实现的， 胶片插入一对热固性粘合剂层之间。

公开(公告)号：US5595858A

公开(公告)日：1997-01-21

申请号：US387291

申请日：1995-02-10

申请人： Fumio Akama ,  Yasuyuki Tanaka

发明人： Fumio Akama ,  Yasuyuki Tanaka

IPC分类号： H05K3/06 ,  G03F7/09 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  G03C5/00

CPC分类号： H05K1/112 ,  G03F7/092 ,  H05K3/0023 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472

摘要： A photosensitive insulation bonding layer is formed on a conducting layer. The photosensitive insulation bonding layer is subjected to exposure treatment to produce an exposed area and an unexposed area. Another conducting layer is formed on the outer surface of the photosensitive insulation bonding layer which has undergone the exposure treatment, then both conducting layers are photoetched to produce desired wiring patterns. In the next step, the unexposed area is removed from the photosensitive insulation bonding layer by development so as to form an access opening for connecting a circuit component to the wiring patterns. Then, the exposed area of the photosensitive insulation bonding layer is turned into an insulating layer by curing.

摘要翻译： 在导电层上形成感光绝缘接合层。 对感光绝缘接合层进行曝光处理以产生曝光区域和未曝光区域。 在经过曝光处理的感光绝缘接合层的外表面上形成另一导电层，然后对两个导电层进行光刻以产生所需的布线图案。 在下一步骤中，通过显影将未曝光区域从感光绝缘接合层移除，以形成用于将电路部件连接到布线图案的进入开口。 然后，通过固化将感光绝缘接合层的曝光区域变成绝缘层。

公开(公告)号：US08004851B2

公开(公告)日：2011-08-23

申请号：US11064458

申请日：2005-02-24

申请人： Fumio Akama ,  Ryoichi Yoshimura ,  Hideaki Tanaka ,  Hitoshi Uchida ,  Koji Okano

发明人： Fumio Akama ,  Ryoichi Yoshimura ,  Hideaki Tanaka ,  Hitoshi Uchida ,  Koji Okano

IPC分类号： H05K7/00

CPC分类号： H05K3/4691 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2203/0384

摘要： A method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board including a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.

摘要翻译： 一种用于防止在使用用于连接层的凸块的带电缆的多层FPC中的层间绝缘树脂溢出的屏障的方法，以及具有可以容易地制成的结构的屏障。 在制造包括电路部分的多层柔性印刷电路板的方法中，连接到电路部分的电缆部分，具有布置在多层金属箔之间的绝缘树脂的多层结构的电路部分， 阻止绝缘树脂溢出的阻挡层具有双列构造，并且形成在多层柔性印刷电路板中构成最外层导电层的金属箔上，金属箔和绝缘树脂被层压到 形成多层柔性印刷电路板。

公开(公告)号：US20050186713A1

公开(公告)日：2005-08-25

申请号：US11064458

申请日：2005-02-24

申请人： Fumio Akama ,  Ryoichi Yoshimura ,  Hideaki Tanaka ,  Hitoshi Uchida ,  Koji Okano

发明人： Fumio Akama ,  Ryoichi Yoshimura ,  Hideaki Tanaka ,  Hitoshi Uchida ,  Koji Okano

IPC分类号： H05K3/46 ,  H01L29/40 ,  H05K3/00

CPC分类号： H05K3/4691 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2203/0384

摘要： This invention provides a method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board comprising a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.

摘要翻译： 本发明提供了一种容易制造阻挡层的方法，该方法用于防止层叠绝缘树脂在使用用于连接层的凸块的带电缆的多层FPC中的溢出，以及具有易于制造的结构的阻挡层。 在制造包括电路部分的多层柔性印刷电路板的方法中，连接到电路部分的电缆部分，具有布置在多层金属箔之间的绝缘树脂的多层结构的电路部分， 阻止绝缘树脂溢出的阻挡层具有双列构造，并且形成在多层柔性印刷电路板中构成最外层导电层的金属箔上，金属箔和绝缘树脂被层压到 形成多层柔性印刷电路板。