公开(公告)号：US08666204B2

公开(公告)日：2014-03-04

申请号：US13114323

申请日：2011-05-24

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/43

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract translation: 光传输模块包括半导体衬底，第一膜层，电子元件层和波导结构。 电子部件层用于将第一电信号转换为光信号。 波导结构形成在第一膜层上，并且包括第一反射表面，波导体和第二反射表面。 在光信号通过半导体衬底和第一膜层并且进入波导结构之后，光信号被第一反射表面反射，在波导体内透射并被第二反射表面反射。 在由第二反射表面反射的光信号透过第一膜层和半导体衬底并被电子元件层接收之后，光信号由电子元件层转换成第二电信号。

公开(公告)号：US08644654B2

公开(公告)日：2014-02-04

申请号：US13114330

申请日：2011-05-24

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract translation: 用于转换和发送电/信号信号的光耦合器模块包括半导体衬底，第一膜，第二膜，电传输单元，至少一个信号转换单元和光波导结构。 第一膜和第二膜形成在半导体基板的相对表面上。 信号转换单元和光波导结构设置在半导体衬底的相对侧上。 光波导结构具有反射体和波导体。 从信号转换单元产生的光信号依次通过第一膜，半导体衬底和第二膜并进入光波导结构。 然后，光信号被反射器反射并在波导体中传输以被输出。 或者，光信号从光波导结构向信号转换单元反向传输。

公开(公告)号：US20130309801A1

公开(公告)日：2013-11-21

申请号：US13471460

申请日：2012-05-15

Applicant: Hsu-Liang Hsiao ,  Chun-Chiang Yen ,  Guan-Fu Lu

Inventor： Hsu-Liang Hsiao ,  Chun-Chiang Yen ,  Guan-Fu Lu

IPC: H01L31/18

CPC classification number: H01L24/94 ,  H01L23/544 ,  H01L24/16 ,  H01L24/48 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/16235 ,  H01L2924/1659 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.

Abstract translation: 提供了用于制造多个光电模块的晶片级工艺。 晶片级过程至少包括以下步骤。 首先，提供包括排列成阵列的多个芯片的晶片。 接下来，在芯片上安装多个光电装置。 接下来，提供包括排列成阵列的多个覆盖单元的盖板。 接着，在盖板上形成多个导光介质。 接下来，盖板通过粘合剂与晶片接合，其中每个覆盖单元覆盖并与其中一个芯片接合，并且导光介质夹在盖板和晶片之间。 然后，对晶片和盖板进行切割，得到多个光电模块。

公开(公告)号：US20110286695A1

公开(公告)日：2011-11-24

申请号：US13114330

申请日：2011-05-24

Applicant: Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract translation: 用于转换和发送电/信号信号的光耦合器模块包括半导体衬底，第一膜，第二膜，电传输单元，至少一个信号转换单元和光波导结构。 第一膜和第二膜形成在半导体基板的相对表面上。 信号转换单元和光波导结构设置在半导体衬底的相对侧上。 光波导结构具有反射体和波导体。 从信号转换单元产生的光信号依次通过第一膜，半导体衬底和第二膜并进入光波导结构。 然后，光信号被反射器反射并在波导体中传输以被输出。 或者，光信号从光波导结构向信号转换单元反向传输。

公开(公告)号：US08503835B2

公开(公告)日：2013-08-06

申请号：US13114330

申请日：2011-05-24

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

公开(公告)号：US20120241795A1

公开(公告)日：2012-09-27

申请号：US13426623

申请日：2012-03-22

Applicant: Chia-Chi CHANG ,  Guan-Fu Lu ,  Chun-Chiang Yen

Inventor： Chia-Chi CHANG ,  Guan-Fu Lu ,  Chun-Chiang Yen

IPC: H01L33/58 ,  H01L31/0232

CPC classification number: G02B6/4274 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/4295 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract translation: 本发明提供一种光电子模块，其包括基板，光电子装置和控制单元。 基板包括顶表面，底表面，凹形结构，通孔结构和导电材料。 凹形结构设置在顶面上。 通孔结构从顶表面到底表面通过基底。 将导电材料填充到通孔结构中。 光电子器件设置在衬底上用于提供或接收光信号。 控制单元配置在顶表面上并电连接到导电材料和用于控制光电子器件的光电器件。

公开(公告)号：US08580589B1

公开(公告)日：2013-11-12

申请号：US13471460

申请日：2012-05-15

Applicant: Hsu-Liang Hsiao ,  Chun-Chiang Yen ,  Guan-Fu Lu

Inventor： Hsu-Liang Hsiao ,  Chun-Chiang Yen ,  Guan-Fu Lu

IPC: H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L24/94 ,  H01L23/544 ,  H01L24/16 ,  H01L24/48 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/16235 ,  H01L2924/1659 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.

Abstract translation: 提供了用于制造多个光电模块的晶片级工艺。 晶片级过程至少包括以下步骤。 首先，提供包括排列成阵列的多个芯片的晶片。 接下来，在芯片上安装多个光电装置。 接下来，提供包括排列成阵列的多个覆盖单元的盖板。 接下来，在盖板上形成多个导光介质。 接下来，盖板通过粘合剂与晶片接合，其中每个覆盖单元覆盖并与其中一个芯片接合，并且导光介质夹在盖板和晶片之间。 然后，对晶片和盖板进行切割，得到多个光电模块。

公开(公告)号：US20110286694A1

公开(公告)日：2011-11-24

申请号：US13114323

申请日：2011-05-24

Applicant: Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/43

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract translation: 光传输模块包括半导体衬底，第一膜层，电子元件层和波导结构。 电子部件层用于将第一电信号转换为光信号。 波导结构形成在第一膜层上，并且包括第一反射表面，波导体和第二反射表面。 在光信号通过半导体衬底和第一膜层并且进入波导结构之后，光信号被第一反射表面反射，在波导体内透射并被第二反射表面反射。 在由第二反射表面反射的光信号透过第一膜层和半导体衬底并被电子元件层接收之后，光信号由电子元件层转换成第二电信号。

公开(公告)号：US09057850B2

公开(公告)日：2015-06-16

申请号：US13426623

申请日：2012-03-22

Applicant: Chia-Chi Chang ,  Guan-Fu Lu ,  Chun-Chiang Yen

Inventor： Chia-Chi Chang ,  Guan-Fu Lu ,  Chun-Chiang Yen

IPC: H01L33/00 ,  G02B6/42

CPC classification number: G02B6/4274 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/4295 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract translation: 本发明提供一种光电子模块，其包括基板，光电子装置和控制单元。 基板包括顶表面，底表面，凹形结构，通孔结构和导电材料。 凹形结构设置在顶面上。 通孔结构从顶表面到底表面通过基底。 将导电材料填充到通孔结构中。 光电子器件设置在衬底上用于提供或接收光信号。 控制单元配置在顶表面上并电连接到导电材料和用于控制光电子器件的光电器件。

公开(公告)号：US08588559B2

公开(公告)日：2013-11-19

申请号：US13225625

申请日：2011-09-06

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12 ,  G02B6/26 ,  G02B6/36 ,  G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/136 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292 ,  G02B6/43

Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.

Abstract translation: 光耦合器模块包括设置在印刷电路板上的半导体衬底; 形成在半导体衬底上的反射沟槽结构; 形成在反射沟槽结构的倾斜表面上的反射器; 形成在所述半导体基板上并与所述反射沟槽结构连接的条状沟槽结构; 设置在上述结构上的薄膜。 光耦合器模块还包括设置在半导体衬底上的信号转换单元，信号转换单元的位置对应于反射器; 以及形成在沟槽结构中的光波导结构。 来自信号转换单元的光信号被反射器反射，然后在光波导结构中或反向传输以到达信号转换单元。