公开(公告)号：US20150108334A1

公开(公告)日：2015-04-23

申请号：US14517942

申请日：2014-10-20

Applicant: Mao-Jen Wu

Inventor： Chia-Chi CHANG ,  Mao-Jen WU ,  Chi-Hsiang LIN ,  Shu-Hsuan LIN

IPC: G01H9/00 ,  G01D5/353

CPC classification number: G01H9/004 ,  G01D5/353 ,  G01H9/00

Abstract: An optical sensor module is proposed. The optical sensor module comprises two parts, including optical module and vibration sensing unit. The vibration sensing unit is disposed on the optical module. The optical module comprises a light source, a photo detector, and a second substrate with optical micro-reflection surface. The vibration sensing unit comprises a first substrate, a membrane, and an optical gate. The membrane is disposed between the first substrate and the optical gate. The light source and the photo detector are disposed on the second substrate

Abstract translation: 提出了一种光学传感器模块。 光传感器模块包括两部分，包括光学模块和振动感测单元。 振动感测单元设置在光学模块上。 光学模块包括光源，光电检测器和具有光学微反射表面的第二基板。 振动检测单元包括第一基板，膜和光栅。 膜设置在第一基板和光栅之间。 光源和光电检测器设置在第二基板上

公开(公告)号：US08666204B2

公开(公告)日：2014-03-04

申请号：US13114323

申请日：2011-05-24

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/43

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract translation: 光传输模块包括半导体衬底，第一膜层，电子元件层和波导结构。 电子部件层用于将第一电信号转换为光信号。 波导结构形成在第一膜层上，并且包括第一反射表面，波导体和第二反射表面。 在光信号通过半导体衬底和第一膜层并且进入波导结构之后，光信号被第一反射表面反射，在波导体内透射并被第二反射表面反射。 在由第二反射表面反射的光信号透过第一膜层和半导体衬底并被电子元件层接收之后，光信号由电子元件层转换成第二电信号。

公开(公告)号：US08644654B2

公开(公告)日：2014-02-04

申请号：US13114330

申请日：2011-05-24

Applicant: Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen Wu ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract translation: 用于转换和发送电/信号信号的光耦合器模块包括半导体衬底，第一膜，第二膜，电传输单元，至少一个信号转换单元和光波导结构。 第一膜和第二膜形成在半导体基板的相对表面上。 信号转换单元和光波导结构设置在半导体衬底的相对侧上。 光波导结构具有反射体和波导体。 从信号转换单元产生的光信号依次通过第一膜，半导体衬底和第二膜并进入光波导结构。 然后，光信号被反射器反射并在波导体中传输以被输出。 或者，光信号从光波导结构向信号转换单元反向传输。

公开(公告)号：US20110286695A1

公开(公告)日：2011-11-24

申请号：US13114330

申请日：2011-05-24

Applicant: Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract translation: 用于转换和发送电/信号信号的光耦合器模块包括半导体衬底，第一膜，第二膜，电传输单元，至少一个信号转换单元和光波导结构。 第一膜和第二膜形成在半导体基板的相对表面上。 信号转换单元和光波导结构设置在半导体衬底的相对侧上。 光波导结构具有反射体和波导体。 从信号转换单元产生的光信号依次通过第一膜，半导体衬底和第二膜并进入光波导结构。 然后，光信号被反射器反射并在波导体中传输以被输出。 或者，光信号从光波导结构向信号转换单元反向传输。

公开(公告)号：US20090009868A1

公开(公告)日：2009-01-08

申请号：US11947792

申请日：2007-11-30

Applicant: Mao-Jen Wu ,  Jian-Shian Lin ,  Chih-Chieh Su ,  Che-Lung Hsu ,  Zong-Ru Tu ,  Jenq-Yang Chang

Inventor： Mao-Jen Wu ,  Jian-Shian Lin ,  Chih-Chieh Su ,  Che-Lung Hsu ,  Zong-Ru Tu ,  Jenq-Yang Chang

IPC: G02B5/18

CPC classification number: G02B6/124 ,  B42D25/328 ,  G02B6/13

Abstract: A diffraction grating recording medium including a waveguide layer and a grating structure layer is provided. The waveguide layer has a reflective surface and a light incident surface, in which a thickness of the waveguide layer is between 100 nanometers and 2 micrometers, and the reflective surface reflects a light that enters the waveguide layer from the light incident layer. The grating structure layer is disposed on the light incident surface of the waveguide layer, in which the grating structure layer has a plurality of diffractive elements, and the arranging period of the diffractive elements is between 50 nanometers and 900 nanometers.

Abstract translation: 提供了包括波导层和光栅结构层的衍射光栅记录介质。 波导层具有反射表面和光入射表面，其中波导层的厚度在100纳米和2微米之间，并且反射表面反射从光入射层进入波导层的光。 光栅结构层设置在波导层的光入射表面上，其中光栅结构层具有多个衍射元件，衍射元件的布置周期在50纳米到900纳米之间。

公开(公告)号：US20060131757A1

公开(公告)日：2006-06-22

申请号：US11095799

申请日：2005-03-31

Applicant: Wen-Hsiung Yu ,  Ming-Che Wu ,  Hsi-Che Huang ,  Cheng-Yi Hsu ,  Mao-Jen Wu

Inventor： Wen-Hsiung Yu ,  Ming-Che Wu ,  Hsi-Che Huang ,  Cheng-Yi Hsu ,  Mao-Jen Wu

IPC: H01L23/48

CPC classification number: B41J2/45 ,  H01L25/167 ,  H01L27/153 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05B33/0803 ,  H05B33/0821 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A light emitting module includes a substrate, a driving circuit chip, a light emitting element and a connector. By providing the connector with conductive bumps and arranging it as a flip chip to contact the conductive bumps with bond pads of the driving circuit chip and the light emitting element, a light emitting module with a reduced bonding pitch but reliable performance can be produced. Alternatively, it can be the driving circuit chip instead of the connector functioning as a flip chip. The driving circuit chip includes conductive bumps in contact with bond pads of the light emitting element and the connector.

Abstract translation: 发光模块包括基板，驱动电路芯片，发光元件和连接器。 通过将连接器设置为导电凸块并将其布置为倒装芯片以使导电凸块与驱动电路芯片和发光元件的接合焊盘接触，可以产生具有降低的键合间距但性能可靠的发光模块。 或者，它可以是代替倒装芯片的连接器的驱动电路芯片。 驱动电路芯片包括与发光元件和连接器的接合焊盘接触的导电凸块。

公开(公告)号：US20110286694A1

公开(公告)日：2011-11-24

申请号：US13114323

申请日：2011-05-24

Applicant: Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

Inventor： Mao-Jen WU ,  Hsiao-Chin Lan ,  Yun-Chih Lee ,  Chia-Chi Chang ,  Hsu-Liang Hsiao ,  Chin-Ta Chen ,  Bo-Kuan Shen ,  Guan-Fu Lu ,  Yan-Chong Chang ,  Jen-Yu Chang

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/43

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract translation: 光传输模块包括半导体衬底，第一膜层，电子元件层和波导结构。 电子部件层用于将第一电信号转换为光信号。 波导结构形成在第一膜层上，并且包括第一反射表面，波导体和第二反射表面。 在光信号通过半导体衬底和第一膜层并且进入波导结构之后，光信号被第一反射表面反射，在波导体内透射并被第二反射表面反射。 在由第二反射表面反射的光信号透过第一膜层和半导体衬底并被电子元件层接收之后，光信号由电子元件层转换成第二电信号。

公开(公告)号：US07129529B2

公开(公告)日：2006-10-31

申请号：US10971554

申请日：2004-10-22

Applicant: Ming-Che Wu ,  Wen-Hsiung Yu ,  Mao-Jen Wu

Inventor： Ming-Che Wu ,  Wen-Hsiung Yu ,  Mao-Jen Wu

IPC: H01L29/22

CPC classification number: B41J2/45 ,  H01L25/167 ,  H01L27/153 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The light emitting module includes a substrate, a light emitting element and a driving circuit chip. The light emitting element is attached to the substrate and has a plurality of first contacts on a top surface thereof. The driving circuit chip is attached onto the substrate and has a plurality of second contacts in direct connection to the first contacts one on one when being placed above the light emitting element.

Abstract translation: 发光模块包括基板，发光元件和驱动电路芯片。 发光元件附接到基板，并且在其顶表面上具有多个第一触点。 驱动电路芯片被附接到基板上，并且当放置在发光元件上方时，具有与第一触点直接连接的多个第二触点。

公开(公告)号：US20160161326A1

公开(公告)日：2016-06-09

申请号：US14555732

申请日：2014-11-28

Applicant: Mao-Jen Wu

Inventor： Chia-Chi CHANG ,  Mao-Jen WU ,  Chi-Hsiang LIN ,  Shu-Hsuan LIN

IPC: G01H9/00 ,  G01D5/353

CPC classification number: G01H9/004 ,  G01D5/35345 ,  G01D5/3538 ,  G01H9/00

Abstract: A flexible optical sensor module is proposed. The flexible optical sensor module comprises a supporting substrate and a flexible waveguide. The supporting substrate has a first trench and a second trench, wherein the first trench has a first optical micro-reflection surface and a second optical micro-reflection surface at two sides of the first trench. The flexible waveguide disposed on the first trench of the supporting substrate. The supporting substrate may include a first substrate with the first trench and a second a second substrate with the second trench, wherein the first substrate is disposed on said second substrate. A membrane is disposed between the first substrate and the second substrate. The light source and the photo detector are disposed on the first substrate.

Abstract translation: 提出了一种灵活的光学传感器模块。 柔性光学传感器模块包括支撑衬底和柔性波导。 支撑衬底具有第一沟槽和第二沟槽，其中第一沟槽在第一沟槽的两侧具有第一光学微反射表面和第二光学微反射表面。 设置在支撑基板的第一沟槽上的柔性波导管。 支撑衬底可以包括具有第一沟槽的第一衬底和具有第二沟槽的第二衬底，其中第一衬底设置在所述第二衬底上。 膜设置在第一基板和第二基板之间。 光源和光电检测器设置在第一基板上。

公开(公告)号：US20150323379A1

公开(公告)日：2015-11-12

申请号：US14272385

申请日：2014-05-07

Applicant: Mao-Jen Wu

Inventor： Mao-Jen Wu ,  Chia-Chi Chang ,  Po-Kuan Shen ,  Chin-Ta Chen ,  Mao-Yuan Zeng ,  Lin-Yu Zhao ,  Chi-Hsiang Lin ,  Shu-Hsuan Lin ,  Chien-Pang Lee ,  Teng-Hsiang Chang

IPC: G01H9/00

CPC classification number: G01H9/00 ,  G01H9/004

Abstract: An optical inertial sensing module is proposed. The optical inertial sensing module includes a substrate, having a concave structure, and a through hole structure. The concave structure is formed on the top surface and has a first reflection surface and a second reflection surface, and the through hole structure passes through from the top surface to the bottom surface of the substrate. A light emitting device is disposed within the through hole structure of the substrate. A light-guiding structure is configured in the concave structure and located between the first reflection surface and the second reflection surface. At least one photo detector is disposed on the top surface of the substrate, and a mother board is used for the substrate configured thereon.

Abstract translation: 提出了一种光学惯性感测模块。 光学惯性感测模块包括具有凹形结构的基底和通孔结构。 凹形结构形成在顶面上，具有第一反射面和第二反射面，通孔结构从基板的顶面到底面贯通。 发光器件设置在衬底的通孔结构内。 导光结构构造在凹形结构中并且位于第一反射表面和第二反射表面之间。 至少一个光检测器设置在基板的顶表面上，并且母板用于构成在其上的基板。