公开(公告)号：US06818981B2

公开(公告)日：2004-11-16

申请号：US10765644

申请日：2004-01-26

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

IPC分类号： H01L2310

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A PBGA package is provided. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A solder bump is further provided over the surface of the copper pad. Thermally conductive solder is deposited over the opening of the heat spreader and over the copper pad. If the heat spreader stand-off is aligned with contact pads, thermally conductive epoxy is deposited over the contact pads.

摘要翻译： 提供PBGA封装。 散热器与散热器的支架与基板相接。 散热器的支架设置有开口，散热器的支架通过设置在基板的第二表面上的铜垫与PBGA封装的基板对准。 在铜焊盘的表面上进一步设置焊料凸块。 导热焊料沉积在散热器的开口上并穿过铜焊盘。 如果散热器对接与接触垫对准，则导热环氧树脂沉积在接触垫上。

公开(公告)号：US06960493B2

公开(公告)日：2005-11-01

申请号：US10914870

申请日：2004-08-09

申请人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

发明人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

IPC分类号： H01L21/56 ,  H01L23/13 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

摘要： An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.

公开(公告)号：US06737298B2

公开(公告)日：2004-05-18

申请号：US10055094

申请日：2002-01-23

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Weddle Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Weddle Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

IPC分类号： H01L2144

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.

摘要翻译： 提供了一种新的方法和组件，用于将PBGA封装的散热器固定到其基板。 锚定功能是PBGA封装的一部分。 这些锚定特征提供在PBGA封装的衬底的表面上。 锚固件特征与在散热器支架中产生的开口对准，从而允许快速且可靠地将散热器定位和锚定在包装的基板的表面上。

公开(公告)号：US06875634B2

公开(公告)日：2005-04-05

申请号：US10804732

申请日：2004-03-18

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Weddie Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Weddie Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

IPC分类号： H01L23/433 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.

摘要翻译： 提供了一种方法和组件，用于将PBGA封装的散热器作为PBGA封装的一部分固定到其衬底上。 这些锚定特征提供在PBGA封装的衬底的表面上。 锚固件特征与在散热器支架中产生的开口对准，从而允许快速且可靠地将散热器定位和锚定在包装的基板的表面上。

公开(公告)号：US06825067B2

公开(公告)日：2004-11-30

申请号：US10315533

申请日：2002-12-10

申请人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

发明人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

IPC分类号： H01L2144

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

摘要： A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.

摘要翻译： 提供了一种创建模具帽的新方法。 本发明的模具帽锚固特征从基板的设计和制造开始就被设计和结合。 可以实现本发明的模具锚的各种设计选择。 本发明的模具允许模制化合物在基底下方流动，在模具化合物将保持原位，直到模具形成过程完成。 包装的模具化合物将穿透周围的模具化合物的所有可用的空腔，并且可以从本发明的模具锚固件进入，其中模具化合物将保持就位并且硬化。 硬化后，模具周围的模具化合物将支撑锚定区域。

公开(公告)号：US06706563B2

公开(公告)日：2004-03-16

申请号：US10119920

申请日：2002-04-10

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

IPC分类号： H01L2144

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate. Under an additional embodiment of the invention, extremities if the heat spreader stand-off are aligned with contact pads provided over the second surface of the substrate of the package, thermally conductive epoxy is deposited over the contact surfaces between the extremities and the contact pads.

摘要翻译： 提供了一种用于散热器和热改进PBGA封装的衬底之间的界面的新方法。 散热器与散热器的支架与基板相接。 散热器的支架设置有开口，散热器的支架通过设置在基板的第二表面上的铜垫与PBGA封装的基板对准。 为了对准目的，在铜垫的表面上进一步设置金柱凸块或焊料凸块。 导热环氧树脂或焊料沉积在散热器的开口上方，并沉积在衬底的第二表面上提供的铜焊盘上。 在本发明的另外的实施例中，如果散热器支座与设置在封装的衬底的第二表面上的接触焊盘对准，则在四肢和接触垫之间的接触表面上沉积导热环氧树脂。