公开(公告)号：US06737298B2

公开(公告)日：2004-05-18

申请号：US10055094

申请日：2002-01-23

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Weddle Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Weddle Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

IPC分类号： H01L2144

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.

摘要翻译： 提供了一种新的方法和组件，用于将PBGA封装的散热器固定到其基板。 锚定功能是PBGA封装的一部分。 这些锚定特征提供在PBGA封装的衬底的表面上。 锚固件特征与在散热器支架中产生的开口对准，从而允许快速且可靠地将散热器定位和锚定在包装的基板的表面上。

公开(公告)号：US06875634B2

公开(公告)日：2005-04-05

申请号：US10804732

申请日：2004-03-18

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Weddie Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Weddie Aquien ,  Dario Filoteo ,  Virgil Ararao ,  Leo Merilo

IPC分类号： H01L23/433 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.

摘要翻译： 提供了一种方法和组件，用于将PBGA封装的散热器作为PBGA封装的一部分固定到其衬底上。 这些锚定特征提供在PBGA封装的衬底的表面上。 锚固件特征与在散热器支架中产生的开口对准，从而允许快速且可靠地将散热器定位和锚定在包装的基板的表面上。

公开(公告)号：US06818981B2

公开(公告)日：2004-11-16

申请号：US10765644

申请日：2004-01-26

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

IPC分类号： H01L2310

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A PBGA package is provided. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A solder bump is further provided over the surface of the copper pad. Thermally conductive solder is deposited over the opening of the heat spreader and over the copper pad. If the heat spreader stand-off is aligned with contact pads, thermally conductive epoxy is deposited over the contact pads.

摘要翻译： 提供PBGA封装。 散热器与散热器的支架与基板相接。 散热器的支架设置有开口，散热器的支架通过设置在基板的第二表面上的铜垫与PBGA封装的基板对准。 在铜焊盘的表面上进一步设置焊料凸块。 导热焊料沉积在散热器的开口上并穿过铜焊盘。 如果散热器对接与接触垫对准，则导热环氧树脂沉积在接触垫上。

公开(公告)号：US06960493B2

公开(公告)日：2005-11-01

申请号：US10914870

申请日：2004-08-09

申请人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

发明人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

IPC分类号： H01L21/56 ,  H01L23/13 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

摘要： An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.

公开(公告)号：US06825067B2

公开(公告)日：2004-11-30

申请号：US10315533

申请日：2002-12-10

申请人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

发明人： Virgil C. Ararao ,  Hermes T. Apale ,  Il Kwon Shim

IPC分类号： H01L2144

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

摘要： A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.

摘要翻译： 提供了一种创建模具帽的新方法。 本发明的模具帽锚固特征从基板的设计和制造开始就被设计和结合。 可以实现本发明的模具锚的各种设计选择。 本发明的模具允许模制化合物在基底下方流动，在模具化合物将保持原位，直到模具形成过程完成。 包装的模具化合物将穿透周围的模具化合物的所有可用的空腔，并且可以从本发明的模具锚固件进入，其中模具化合物将保持就位并且硬化。 硬化后，模具周围的模具化合物将支撑锚定区域。

公开(公告)号：US06706563B2

公开(公告)日：2004-03-16

申请号：US10119920

申请日：2002-04-10

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

IPC分类号： H01L2144

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate. Under an additional embodiment of the invention, extremities if the heat spreader stand-off are aligned with contact pads provided over the second surface of the substrate of the package, thermally conductive epoxy is deposited over the contact surfaces between the extremities and the contact pads.

摘要翻译： 提供了一种用于散热器和热改进PBGA封装的衬底之间的界面的新方法。 散热器与散热器的支架与基板相接。 散热器的支架设置有开口，散热器的支架通过设置在基板的第二表面上的铜垫与PBGA封装的基板对准。 为了对准目的，在铜垫的表面上进一步设置金柱凸块或焊料凸块。 导热环氧树脂或焊料沉积在散热器的开口上方，并沉积在衬底的第二表面上提供的铜焊盘上。 在本发明的另外的实施例中，如果散热器支座与设置在封装的衬底的第二表面上的接触焊盘对准，则在四肢和接触垫之间的接触表面上沉积导热环氧树脂。

公开(公告)号：US20050194698A1

公开(公告)日：2005-09-08

申请号：US10794109

申请日：2004-03-03

申请人： Il Kwon Shim ,  Virgil Ararao ,  Hyeong Hur ,  Byung Han

发明人： Il Kwon Shim ,  Virgil Ararao ,  Hyeong Hur ,  Byung Han

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L24/32 ,  H01L2224/16245 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package is provided with a connective structure having a wire bonding zone and a keep-out zone. An integrated circuit die has an undercut defining an undercut zone, which is overlapped by the keep-out zone. A wire is bonded between the integrated circuit die and the connective structure within the wire bonding zone and outside of the keep-out zone.

摘要翻译： 集成电路封装设置有具有引线接合区和保护区的连接结构。 集成电路管芯具有限定了与保护区重叠的底切区的底切。 集成电路管芯和引线接合区域内的结合结构之间的接合线和保护区外部的接合线。

公开(公告)号：US20060055009A1

公开(公告)日：2006-03-16

申请号：US11164329

申请日：2005-11-18

申请人： Il Kwon Shim ,  Kwee Lan Tan ,  Jian Jun Li ,  Dario Filoteo

发明人： Il Kwon Shim ,  Kwee Lan Tan ,  Jian Jun Li ,  Dario Filoteo

IPC分类号： H01L23/495

CPC分类号： H01L25/0657 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10S438/928 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package comprises a substrate including a core layer with a through opening and vias. A first conductive layer is on the core layer covering the through opening and a second conductive layer is on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.

摘要翻译： 集成电路封装包括具有通孔和通孔的芯层的衬底。 第一导电层位于覆盖通孔的芯层上，第二导电层位于与贯通孔中的第一导电层相对的芯层和接触第一导电层的通孔中。 集成电路管芯结合到第二导电层和通孔中。 连接在集成电路管芯和第二导电层之间，并且集成电路管芯和连接被封装。

公开(公告)号：US09059157B2

公开(公告)日：2015-06-16

申请号：US13842582

申请日：2013-03-15

申请人： Yaojian Lin ,  Il Kwon Shim ,  JunMo Koo ,  Jose Alvin Caparas

发明人： Yaojian Lin ,  Il Kwon Shim ,  JunMo Koo ,  Jose Alvin Caparas

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L23/00 ,  H01L23/16

CPC分类号： H01L23/49811 ,  H01L21/76885 ,  H01L23/16 ,  H01L23/49816 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

摘要： An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a top insulation layer and a top conductive layer; an inter-react layer on the substrate; an integrated circuit die on the substrate; a package body on the inter-react layer and the integrated circuit die; and a top solder bump on the top conductive layer, the top solder bump in a 3D via formed through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via.

摘要翻译： 集成电路封装系统及其制造方法包括：具有顶部绝缘层和顶部导电层的衬底; 基板上的反应间层; 集成电路裸片在基板上; 反应层间和集成电路管芯上的封装体; 以及顶部导电层上的顶部焊料凸块，通过封装主体，反应间层和顶部绝缘层形成的3D通孔中的顶部焊料凸块，用于暴露3D通孔中的顶部导电层。

公开(公告)号：US09034693B2

公开(公告)日：2015-05-19

申请号：US13247890

申请日：2011-09-28

申请人： Il Kwon Shim ,  Kwee Lan Tan ,  Jian Jun Li ,  Dario S. Filoteo, Jr.

发明人： Il Kwon Shim ,  Kwee Lan Tan ,  Jian Jun Li ,  Dario S. Filoteo, Jr.

IPC分类号： H01L21/00 ,  H01L25/065 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10S438/928 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing an integrated circuit package includes: forming a substrate including: forming a core layer, and forming vias in the core layer; forming a conductive layer having a predetermined thickness on the core layer and having substantially twice the predetermined thickness in the vias; and forming connections between an integrated circuit die and the conductive layer.

摘要翻译： 制造集成电路封装的方法包括：形成衬底，包括：形成芯层，并在芯层中形成通孔; 在芯层上形成具有预定厚度的导电层，并且在通孔中基本上具有预定厚度的两倍; 以及在集成电路管芯和导电层之间形成连接。