摘要:
The present invention relates to a junction gate photo-diode (JGP) pixel that includes a JGP for accumulating charge in response to impinging photons. The JGP is positioned on a substrate and includes a top n layer, a middle p layer and a bottom n layer forming a n-p-n junction, and a control terminal coupled to the top n layer. Also included is a floating diffusion (FD) positioned on the substrate and coupled to a pixel output line through an amplifier. Also included is a pinned barrier (PB) positioned on the substrate between the JGP and the FD, the PB temporarily blocks charge transfer between the JGP and the FD. The accumulated charge is transferred from the JGP to FD by applying a control voltage to the JGP control terminal.
摘要:
An input signal is input via a first resistor to an inverting input terminal of an operational amplifier. A second resistor is provided on a feedback path between an output terminal and the inverting input terminal of the operational amplifier. A control voltage Vcnt output from the operational amplifier is input to a VCO. A frequency divider frequency-divides an output signal Sout of the VCO. A phase comparator compares an output signal from the frequency divider with a reference clock signal and outputs a voltage according to a phase difference. A loop filter removes a high-frequency component of an output voltage Vcp of the phase comparator and outputs the voltage to a non-inverting input terminal of the operational amplifier.
摘要:
The MOS type solid-state imaging device has plural pixels each of which comprises a photo-diode and a MOS transistor on a substrate. A gate electrode is formed on the channel dope layer formed in the surface of the p-type well layer. By ion implantation of n-type impurity ions via the gate electrode as the mask, the n-type source region and the drain region are formed in the region corresponding to the MOS transistor, and the n-type impurity region is also formed in the region corresponding to the photo-diode. In the well layer, a high impurity density region as a hole pocket is self-aligned to the gate electrode.
摘要:
The objective of this invention is to provide a semiconductor device and its manufacturing method with which the offset can be kept fixed even in high breakdown voltage MOS transistors, and that can accommodate high voltages for high breakdown voltage MOS transistors and miniaturization of MOS transistors for low voltage drive. Its constitution provides for inner side wall insulating films 14 and 24 and outer side wall insulating films 16 and 26 formed at both sides of the gate electrodes 12 and 22 in both high breakdown voltage transistor TR2 and transistor TR1 for low voltage drive, and heavily doped region 27 is formed in breakdown voltage transistor TR2 using both inner side wall insulating film 24 and outer side wall insulating film 26 as masks so that offset d2 is controlled by the combined widths of the two side wall insulating films. In transistor TR1 for low voltage drive, heavily doped region 15 is formed using only inner side wall insulating film 14 as the mask, and offset d1 is controlled.
摘要:
The lateral overflow drain for virtual phase devices includes: a semiconductor region 72 of a first conductivity type; a drain region 24 of the first conductivity type formed in the semiconductor region 72; a threshold adjust region 22 formed in the semiconductor region 72 and surrounding the drain region 24; an electrode 20 overlying and connected to the drain region 24, the electrode 20 overlying and separated from at least a portion of the threshold adjust region 22; and virtual gates 30 and 32 of the second conductivity type in the semiconductor region 72 spaced apart from the drain region 24 and partially surrounding the drain region 24.
摘要:
The invention describes a solid-state CMOS image sensor array and discloses image sensor array pixels with global and rolling shutter capabilities that utilize multiple BCMD transistors for a single photodiode, for charge storage and sensing. Thus, the valuable pixel area saved by employing the BCMD transistor for charge storage and sensing is used by placing several BCMD transistors coupled to one photodiode. This increases the Dynamic Range (DR) of the sensor, since the same photodiode can integrate charge for different integration times, both long and short. This allows sensing of two different image signals from a single pixel without saturation, a low level signal with long integration time followed by a high level signal with short integration time. The signal processing circuits located at the periphery of the array can then process these signals into a single Wide Dynamic Range (WDR) output. Further disclosed is an image sensor array with pixels that use BCMD transistors for charge storage and sensing having multiple concentric gates, which allows changing the conversion gain of the BCMD transistors by applying various biases to the gates. Variable conversion gain is a useful feature when building WDR sensors since low conversion gain and high well capacity allows detection of high level signals and the same structure can be used to detect, at the same time, low level signals with high conversion gain and thus low noise.
摘要:
An image sensor with an image area having a plurality of pixels each having a photodetector of a first conductivity type, the image sensor includes a substrate of the first conductivity type; a first layer of the second conductivity type between the substrate and the photodetectors, spanning the image area and biased at predetermined potential with respect to the substrate for driving excess carriers into the substrate to reduce cross talk; one or more adjacent active electronic components disposed in the first layer within each pixel; and electronic circuitry disposed in the substrate outside of the image area.
摘要:
An image sensor with an image area having a plurality of pixels with each pixel having a photodetector and a substrate of a first conductivity type and a first layer of a second conductivity type formed between the substrate and the photodetectors. The first layer spans the image area and is biased at predetermined potential with respect to the substrate for driving excess carriers into the substrate to reduce cross talk. One or more adjacent active electronic components can be disposed in the first layer within each pixel and electronic circuitry can be disposed in the substrate outside of the image area.
摘要:
The objective of this invention is to provide a semiconductor device and its manufacturing method with which the offset can be kept fixed even in high breakdown voltage MOS transistors, and that can accommodate high voltages for high breakdown voltage MOS transistors and miniaturization of MOS transistors for low voltage drive. Its constitution provides for inner side wall insulating films 14 and 24 and outer side wall insulating films 16 and 26 formed at both sides of the gate electrodes 12 and 22 in both high breakdown voltage transistor TR2 and transistor TR1 for low voltage drive, and heavily doped region 27 is formed in breakdown voltage transistor TR2 using both inner side wall insulating film 24 and outer side wall insulating film 26 as masks so that offset D2 is controlled by the combined widths of the two side wall insulating films. In transistor TR1 for low voltage drive, heavily doped region 15 is formed using only inner side wall insulating film 14 as the mask, and offset d1 is controlled.
摘要:
The objective of this invention is to provide a semiconductor device and its manufacturing method with which the offset can be kept fixed even in high breakdown voltage MOS transistors, and that can accommodate high voltages for high breakdown voltage MOS transistors and miniaturization of MOS transistors for low voltage drive. Its constitution provides for inner side wall insulating films 14 and 24 and outer side wall insulating films 16 and 26 formed at both sides of the gate electrodes 12 and 22 in both high breakdown voltage transistor TR2 and transistor TR1 for low voltage drive, and heavily doped region 27 is formed in breakdown voltage transistor TR2 using both inner side wall insulating film 24 and outer side wall insulating film 26 as masks so that offset D2 is controlled by the combined widths of the two side wall insulating films. In transistor TR1 for low voltage drive, heavily doped region 15 is formed using only inner side wall insulating film 14 as the mask, and offset d1 is controlled.