公开(公告)号：US5066171A

公开(公告)日：1991-11-19

申请号：US324769

申请日：1989-03-17

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

公开(公告)号：US4997319A

公开(公告)日：1991-03-05

申请号：US394659

申请日：1989-08-16

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.

公开(公告)号：US20060211158A1

公开(公告)日：2006-09-21

申请号：US11365657

申请日：2006-03-02

申请人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyama

发明人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyama

IPC分类号： H01L21/00 ,  C23F1/00 ,  H01L21/306 ,  H01L21/302

CPC分类号： H05K3/0038 ,  B23K26/03 ,  B23K26/032 ,  B23K26/06 ,  B23K26/082 ,  C23F4/02 ,  H01L21/31116 ,  H01L21/32131 ,  H05K3/0035 ,  H05K2203/163

摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

摘要翻译： 提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。 在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度被设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。 因此，获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定在足够高的值以处理绝缘层51i，但是足够低以至于不能在绝缘层51 i下处理导体层50i + 1 。 因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4照射所获得的照射脉冲数，绝缘层51i用激光束5照射所获得的照射脉冲数。 因此，在印刷电路板中处理孔。

公开(公告)号：US4872787A

公开(公告)日：1989-10-10

申请号：US106439

申请日：1987-10-09

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.

摘要翻译： 在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率 在通过印刷电路板钻孔时进给，以提高孔所在的精度。 一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。 这可以防止堆叠的印刷电路板移动并增加孔所在的精度。