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公开(公告)号：US4872787A
公开(公告)日：1989-10-10
申请号：US106439
申请日：1987-10-09
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.
摘要翻译： 在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率 在通过印刷电路板钻孔时进给，以提高孔所在的精度。 一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。 这可以防止堆叠的印刷电路板移动并增加孔所在的精度。
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公开(公告)号：US5066171A
公开(公告)日：1991-11-19
申请号：US324769
申请日：1989-03-17
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.
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公开(公告)号：US4997319A
公开(公告)日：1991-03-05
申请号：US394659
申请日：1989-08-16
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.
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4.发明申请Fabrication method of printed circuit board and printed circuit board machining apparatus 有权印刷电路板和印刷电路板加工设备的制造方法公开(公告)号：US20080283491A1
公开(公告)日：2008-11-20
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H01B13/00
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译： 提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。 印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。
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5.发明授权Fabrication method of printed circuit board and printed circuit board machining apparatus 有权印刷电路板和印刷电路板加工设备的制造方法公开(公告)号：US08075788B2
公开(公告)日：2011-12-13
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H05K3/06
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译： 印刷电路板制造方法可以减少制造时间和制造成本。 印刷电路板的制造方法包括以下步骤：在表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。
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公开(公告)号：US5087156A
公开(公告)日：1992-02-11
申请号：US620020
申请日：1990-11-30
申请人： Yasuhiko Kanaya , Tamio Otani , Kunio Arai
发明人： Yasuhiko Kanaya , Tamio Otani , Kunio Arai
CPC分类号： H05K3/0047 , H05K2203/082 , H05K2203/1536 , Y10T408/03 , Y10T408/46 , Y10T408/51 , Y10T408/5623 , Y10T408/56245 , Y10T408/96
摘要： A printed circuit board boring machine bores printed circuit boards stacked on a table, by a drill while pressing the printed circuit boards with a pressure foot. A piece having a hole through which the drill may pass is detachably mounted on a tip end portion of the pressure foot with a center of the hole being aligned with an axis of the drill. The piece may be attached to the pressure foot before the boring work so that the boards and the piece may be simultaneously bored by the drill while the hole in the piece may be used as a guide for the boring work of the boards.
摘要翻译： 印刷电路板镗孔机通过钻孔将堆叠在桌子上的印刷电路板用压脚压入印刷电路板。 具有钻头可以通过的孔的部件可拆卸地安装在压脚的顶端部分上，孔的中心与钻头的轴线对齐。 在钻孔作业之前，该零件可以附接到压脚，使得板和板可以同时由钻头钻孔，同时该零件中的孔可以用作板的钻孔工作的引导件。
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公开(公告)号：US20120031147A1
公开(公告)日：2012-02-09
申请号：US13254155
申请日：2010-02-24
申请人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
发明人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
CPC分类号： B23K37/0408 , B23K26/0006 , B23K26/0853 , B23K26/146 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/16 , B23K2103/172 , B65G49/064 , B65G2249/045 , H01L21/6838 , H01L31/18
摘要： An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.
摘要翻译： 作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括：工件下侧支撑机构，用于将工件沿垂直方向支撑， 空气浮起机构和抽吸机构，用于夹持工件以沿着工件的垂直方向移动的夹紧装置，以及用激光束加工薄膜层的加工头。 加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。 进一步包括喷嘴，在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。
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公开(公告)号：US5332341A
公开(公告)日：1994-07-26
申请号：US966192
申请日：1993-01-29
申请人： Kunio Arai , Yasuhiko Kanaya , Kazunori Hamada
发明人： Kunio Arai , Yasuhiko Kanaya , Kazunori Hamada
CPC分类号： B23Q3/002 , B23Q11/006 , H05K3/0044 , Y02P70/171 , Y10T408/46 , Y10T408/50 , Y10T408/5623
摘要： A pressure foot (7) of a printed circuit board drilling apparatus is supported on a spindle (2) of the printed circuit board drilling apparatus slidably in the axial direction, and includes a pressing face (13) which presses a printed circuit board (5) at the time of drilling operation, a discharge port (11) formed in a side wall (8) so as to discharge chips produced by drilling operation, the discharge port (11) being connected to a suction device, and a compressed air supply conduit (20A) formed in a side wall so as to eject the compressed air toward a drill bit (4) of the printed circuit board drilling apparatus. A cooling fluid supply device (21) is connected to the compressed air supply conduit (20A). In place of the compressed air supply conduit (20A), a fluid supply conduit (14) for ejecting a cooling fluid toward the drill bit (4) of the printed circuit board drilling apparatus may be formed. In this case, at least one groove (18) extending in a tangential direction of the drill bit is formed in the pressing face (13) so as to allow the air to be drawn into an inside (10) of the pressure foot. Thus, cooling efficiency of the drill bit at the time of drilling operation can be enhanced.
摘要翻译： PCT No.PCT / JP92 / 00690 Sec。 371日期：1993年1月29日 102（e）日期1993年1月29日PCT提交1992年5月28日PCT公布。 WO92 / 21481 PCT公开号 日本1992年12月10日。印刷电路板钻孔装置的压脚（7）沿轴向方向可滑动地支撑在印刷电路板钻孔装置的主轴（2）上，并包括按压面（13） 在钻孔操作时压印印刷电路板（5），形成在侧壁（8）中的排出口（11）以排出由钻孔操作产生的碎屑，排出口（11）连接到抽吸 装置和形成在侧壁中的压缩空气供应导管（20A），以朝向印刷电路板钻孔装置的钻头（4）喷射压缩空气。 冷却液供给装置（21）与压缩空气供给管道（20A）连接。 可以形成用于朝向印刷电路板钻孔装置的钻头（4）喷射冷却流体的流体供给管道（14）来代替压缩空气供给管道（20A）。 在这种情况下，在按压面（13）上形成沿钻头的切线方向延伸的至少一个凹槽（18），以便将空气拉入压脚的内部（10）。 因此，能够提高钻孔时的钻头的冷却效率。
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公开(公告)号：US5108236A
公开(公告)日：1992-04-28
申请号：US602690
申请日：1990-10-24
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
CPC分类号： B23Q1/4828 , B23B31/207 , B23B31/265 , B23Q1/70 , B23B2260/136 , H05K3/0044 , Y10T408/56253 , Y10T409/305544
摘要： A spindle and Z-axis unit comprises a spindle housing and a hollow rotor shaft rotatable and axially movable with respect to the spindle housing. The rotor shaft carries a collet at its lower end for chucking a machine tool such as a drill bit. The tool is changed in the collet by pneumatic actuation of a diaphragm which actuates a push rod within the rotor shaft to move the collet axially against a spring bias to clamp and unclamp the tool. The shaft is moved in the Z-direction along with a thrust bearing assembly by a screw nut which actuates a road to move the rotor shaft in the Z-direction to drill a workpiece after a pressure foot has first been moved to clamp the workpiece with respect to the spindle. Thus, the moving weight or mass previously attributable to parts such as a spindle saddle and spindle housing can be eliminated without impairing the reliability and chucking force of the collet mechanism.
摘要翻译： 主轴和Z轴单元包括主轴壳体和可相对于主轴壳体可旋转并可轴向移动的中空转子轴。 转子轴在其下端带有夹头，用于夹紧诸如钻头的机床。 该工具通过气动致动隔膜而改变，所述膜片致动转子轴内的推杆，以便使夹头沿轴向抵抗弹簧偏压以夹紧和松开工具。 轴与推力轴承组件一起通过螺母移动，推力轴承组件通过螺杆螺母移动，该螺母在压力脚首先移动以夹紧工件之后致动道路以使转子轴在Z方向上移动以钻出工件， 相对于主轴。 因此，可以消除以前归因于诸如主轴鞍座和主轴壳体的部件的移动重量或质量，而不损害夹头机构的可靠性和夹紧力。
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公开(公告)号：US5888036A
公开(公告)日：1999-03-30
申请号：US899149
申请日：1997-07-23
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
IPC分类号： B23B51/02
CPC分类号： B23B51/02 , B23B2251/04 , B23B2251/14 , B23B2251/245 , B23B2251/426 , Y10S408/704 , Y10T408/9097
摘要： An improved drill bit for high speed, small diameter drilling of printed circuit boards uses flute/land ratio tapering in combination with the appropriate web thickness and point, cutting or flute angles to obtain high quality, accurately positioned holes. In one embodiment, the web thickness at the tip is 15% of the drill diameter, the flute/land ratio is 2.0, the tip angle is 130.degree., the second cutting angle is 20.degree., the third cutting angle is 30.degree., the flute angle is 32.degree., the relief groove depth is 0.001", body length is 0.256" and the distance between the body end and the flute end is 0.01". Such a bit is used in connection with an air jet cooling/cleaning system and a step feed drilling method wherein the first step is between four-six times drill diameter, the second step is between two-three times the drill diameter, and the third step and subsequent steps are between 1.5-2.5 times the drill diameter.
摘要翻译： 用于高速，小直径钻孔的印刷电路板的改进钻头使用槽纹/土地比例锥形结合适当的腹板厚度和点，切割或凹槽角度以获得高质量，准确定位的孔。 在一个实施例中，尖端的腹板厚度为钻头直径的15％，凹槽/底面比为2.0，尖角为130°，第二切割角为20°，第三切割角为30°， 槽角为32°，缓冲槽深度为0.001“，体长0.256”，体端与槽槽端之间的距离为0.01“。 这样的一个用途是与空气喷射冷却/清洁系统和步进进给钻孔方法结合使用，其中第一步骤是钻头直径的4-6倍之间，第二步骤是钻头直径的2-3倍，而第三步骤是钻头直径的2-3倍 步骤和后续步骤在钻头直径的1.5-2.5倍之间。
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