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    Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same
    2.
    发明授权
    Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same 失效
    垂直几何形状的发光二极管封装集合体及使用其的发光装置的制造方法

    公开(公告)号：US08088635B2

    公开(公告)日：2012-01-03

    申请号：US12445717

    申请日：2007-10-16

    申请人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    发明人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    IPC分类号： H01L21/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/00

    摘要： There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light source, the light emitting device satisfying requirements in terms of current capacity flowed for light emission, dissipation of heat generated due to flow of a large current, resistance to thermal stress, strength of device and light emission efficiency, and a method for producing a light emitting device having a vertical geometry light emitting diode as the light source by using the package aggregate. The vertical geometry light emitting diode package comprises a metal sheet having formed thereon a number of vertical geometry light emitting diode package units, each package unit comprising two or more substrate portions as a part of the metal sheet, which are separated by a slit, and a reflector having a penetrating opening and being adhered to the two or more substrate portions to cover parts of the slit such that the vertical geometry light emitting diode-mounting position is exposed in the inner side of the opening and at the same time, the end part of the slit is exposed in the outer side of the reflector.

    摘要翻译： 提供了一种用于生产具有垂直几何形状发光二极管作为光源的发光器件的垂直几何形状的发光二极管封装集合体，该发光器件满足流过用于发光的电流容量的要求， 由于大电流的流动，耐热应力，器件强度和发光效率而产生的热，以及通过使用封装集合体制造具有垂直几何形状发光二极管作为光源的发光器件的方法。 垂直几何形状发光二极管封装包括金属片，其上形成有多个垂直几何形状的发光二极管封装单元，每个封装单元包括由狭缝分隔的作为金属片的一部分的两个或更多个衬底部分，以及 反射器，其具有穿透开口并且粘附到两个或更多个基板部分以覆盖狭缝的部分，使得垂直几何形状的发光二极管安装位置在开口的内侧暴露，同时，端部 狭缝的一部分暴露在反射器的外侧。

    PACKAGE FOR LIGHT EMITTING DIODE, LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
    3.
    发明申请
    PACKAGE FOR LIGHT EMITTING DIODE, LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE MANUFACTURING METHOD 审中-公开
    用于发光二极管，发光装置和发光装置的制造方法

    公开(公告)号：US20110037091A1

    公开(公告)日：2011-02-17

    申请号：US12989301

    申请日：2009-03-09

    申请人： Hiroshi Fushimi

    发明人： Hiroshi Fushimi

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： The present invention relates to a light emitting diode package for mounting a light emitting diode, a light emitting diode device with the light emitting diode package mounting a vertical electrode type light emitting diode thereon and a manufacturing method for manufacturing the light emitting device.The light emitting diode package of the invention comprises at least a molding, and a first clip 122 and a second clip 123 fitted on the molding. The molding has at least a first opening 1212 and a second opening 1213 formed in a bottom portion thereof. The molding also has a reflecting portion 1214 formed around the first opening 1212 and the second opening 1213 for reflecting light. The molding further has a fluorescent film member mounting portion 1113 formed integrally for mounting a fluorescent film member 116 in the opening of the reflecting portion 1214. The first clip 122 has a light emitting diode mounting projection formed substantially at the center portion thereof for mounting the light emitting diode and is made to engage resiliently with the molding at both ends thereof. The first clip 122 engages with the molding at both ends thereof. The second clip 123 has a bonding projection formed to engage resiliently with the molding at both ends thereof.

    摘要翻译： 本发明涉及一种用于安装发光二极管的发光二极管封装，具有在其上安装垂直电极型发光二极管的发光二极管封装的发光二极管器件和用于制造发光器件的制造方法。 本发明的发光二极管封装包括至少一个模制件，以及装配在模制件上的第一夹子122和第二夹子123。 模制品具有形成在其底部的至少第一开口1212和第二开口1213。 该模制品还具有围绕第一开口1212形成的反射部分1214和用于反射光的第二开口1213。 该模制件还具有一体形成的荧光膜构件安装部分1113，用于将荧光膜构件116安装在反射部分1214的开口中。第一夹子122具有大致在其中心部分形成的发光二极管安装突起，用于安装 发光二极管，并使其与模制件的两端弹性地接合。 第一夹子122在其两端处与模制件接合。 第二夹子123具有接合突起，该接合突起形成为与模制件在其两端处弹性地接合。

    LIGHT EMITTING DEVICE AND PRODUCTION METHOD OF SAME
    4.
    发明申请
    LIGHT EMITTING DEVICE AND PRODUCTION METHOD OF SAME 失效
    发光装置及其生产方法

    公开(公告)号：US20100038662A1

    公开(公告)日：2010-02-18

    申请号：US12312341

    申请日：2007-11-07

    申请人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    发明人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device, and a production method thereof, is provided having for a light source thereof a vertical geometry light emitting diode, that allows a large current to flow through the vertical geometry light emitting diode and takes into consideration the dissipation of heat occurring at that time or the expansion and contraction of a metal member due to thermal stress caused by that heat. The light emitting device at least comprises a package having a plurality of mutually separated package electrodes; a vertical geometry light emitting diode having a light emitting layer positioned between a p-type semiconductor layer and an n-type semiconductor layer, an upper partial electrode of the uppermost layer, and a lower electrode of the lowermost layer, wherein the lower electrode is joined onto one of the package electrodes; and, a conductive connecting member that connects the upper electrode of the vertical geometry light emitting diode with another of package electrodes; wherein the junction between said one of the package electrodes and the lower electrode, the junction between the upper electrode and the conductive connecting member, and the junction between the conductive connecting member and said other of package electrodes are made with solder.

    摘要翻译： 提供一种发光器件及其制造方法，其具有用于其光源的垂直几何形状发光二极管，其允许大电流流过垂直几何形状的发光二极管，并考虑到在 该时间或由于该热引起的热应力引起的金属构件的膨胀和收缩。 发光器件至少包括具有多个相互分离的封装电极的封装; 具有位于p型半导体层和n型半导体层之间的发光层的垂直几何形状的发光二极管，最上层的上部分电极和最下层的下部电极，其中下部电极为 连接到一个封装电极上; 以及将垂直几何形状的发光二极管的上部电极与另一个封装电极连接的导电性连接部件; 其中所述封装电极和所述下电极之间的接合部，所述上电极和所述导电连接部件之间的接合部以及所述导电连接部件和所述另一封装电极之间的接合部由焊料制成。

    Light emitting device and production method of same
    6.
    发明授权
    Light emitting device and production method of same 失效
    发光装置及其制作方法相同

    公开(公告)号：US07999277B2

    公开(公告)日：2011-08-16

    申请号：US12312341

    申请日：2007-11-07

    申请人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    发明人： Hiroshi Fushimi ,  Kengo Nishiyama ,  Kouji Kudou ,  Itsuki Yamamoto ,  Kazuma Mitsuyama

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device, and a production method thereof, is provided having for a light source thereof a vertical geometry light emitting diode, that allows a large current to flow through the vertical geometry light emitting diode and takes into consideration the dissipation of heat occurring at that time or the expansion and contraction of a metal member due to thermal stress caused by that heat. The light emitting device at least comprises a package having a plurality of mutually separated package electrodes; a vertical geometry light emitting diode having a light emitting layer positioned between a p-type semiconductor layer and an n-type semiconductor layer, an upper partial electrode of the uppermost layer, and a lower electrode of the lowermost layer, wherein the lower electrode is joined onto one of the package electrodes; and, a conductive connecting member that connects the upper electrode of the vertical geometry light emitting diode with another of package electrodes; wherein the junction between said one of the package electrodes and the lower electrode, the junction between the upper electrode and the conductive connecting member, and the junction between the conductive connecting member and said other of package electrodes are made with solder.

    摘要翻译： 提供一种发光器件及其制造方法，其具有用于其光源的垂直几何形状发光二极管，其允许大电流流过垂直几何形状的发光二极管，并考虑到在 该时间或由于该热引起的热应力引起的金属构件的膨胀和收缩。 发光器件至少包括具有多个相互分离的封装电极的封装; 具有位于p型半导体层和n型半导体层之间的发光层的垂直几何形状的发光二极管，最上层的上部分电极和最下层的下部电极，其中下部电极为 连接到一个封装电极上; 以及将垂直几何形状的发光二极管的上部电极与另一个封装电极连接的导电性连接部件; 其中所述封装电极和所述下电极之间的接合部，所述上电极和所述导电连接部件之间的接合部以及所述导电连接部件和所述另一封装电极之间的接合部由焊料制成。

    DRINKING WATER DISPENSER
    10.
    发明申请
    DRINKING WATER DISPENSER 有权
    饮用水分配器

    公开(公告)号：US20120248141A1

    公开(公告)日：2012-10-04

    申请号：US13524080

    申请日：2012-06-15

    申请人： Kazutoshi Sano ,  Hiroshi Fushimi

    发明人： Kazutoshi Sano ,  Hiroshi Fushimi

    IPC分类号： B67D1/00

    CPC分类号： B67D3/0022 ,  B67D3/0003 ,  B67D3/0009 ,  B67D3/0032

    摘要： A drinking water dispenser heats and cools drinking water supplied from a water supply bottle, and provides heated and cooled drinking water. The dispenser includes a cold water tank, a hot water tank, a water supply pipe, a valve, a by-pass pipe, a by-pass valve and a control unit. The valve opens and closes a water outlet for taking in the drinking water from the water supply bottle according to a level of the drinking water in the cold water tank, limits supply of the drinking water to the cold water tank, and, while the water outlet is shut, suppresses convection of the drinking water and/or heat of the drinking water between the water supply bottle and the cold water tank.

    摘要翻译： 饮用水分配器加热并冷却从供水瓶供应的饮用水，并提供加热和冷却的饮用水。 分配器包括冷水箱，热水箱，供水管，阀，旁通管，旁通阀和控制单元。 阀门根据冷水箱内饮用水的水平，对供水瓶的饮用水进行打开和关闭，限制饮用水供应到冷水箱，同时水 出口关闭，抑制饮用水的对流和/或供水瓶和冷水箱之间的饮用水的热量。