公开(公告)号：US07723161B2

公开(公告)日：2010-05-25

申请号：US11092892

申请日：2005-03-30

申请人： Takeshi Kobayashi ,  Hisao Sugoh

发明人： Takeshi Kobayashi ,  Hisao Sugoh

IPC分类号： H01L21/44

CPC分类号： H01L21/568 ,  C25D1/003 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/05644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83805 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2924/00012

摘要： There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.

摘要翻译： 提供了一种引线框架，其包括：引线框体，其包括由金属制成的片状主体; 用于形成在所述引线框体的表面上的引线形成区域中由预定深度形成的引线的槽部; 以及引线部分，其形成为使得引线部分可以从槽部分突出到引线框架主体的表面上，引线部分由与引线框架主体的材料不同的材料制成。 提供了一种薄型半导体器件，其中使用上述引线框架，并且在安装芯片之后，通过蚀刻去除引线框架体。

公开(公告)号：US07659634B2

公开(公告)日：2010-02-09

申请号：US10757388

申请日：2004-01-15

申请人： Takeshi Kobayashi ,  Hisao Sugoh

发明人： Takeshi Kobayashi ,  Hisao Sugoh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/568 ,  C25D1/003 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/05644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83805 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2924/00012

摘要： There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.

公开(公告)号：US20050224918A1

公开(公告)日：2005-10-13

申请号：US11092892

申请日：2005-03-30

申请人： Takeshi Kobayashi ,  Hisao Sugoh

发明人： Takeshi Kobayashi ,  Hisao Sugoh

IPC分类号： H01L23/48 ,  C25D1/00 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L21/568 ,  C25D1/003 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/05644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83805 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2924/00012

摘要： There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.

摘要翻译： 提供了一种引线框架，其包括：引线框体，其包括由金属制成的片状主体; 用于形成在所述引线框体的表面上的引线形成区域中由预定深度形成的引线的槽部; 以及引线部分，其形成为使得引线部分可以从槽部分突出到引线框架主体的表面上，引线部分由与引线框架主体的材料不同的材料制成。 提供一种薄型半导体器件，其中使用上述引线框架，并且在安装芯片之后，通过蚀刻去除引线框架体。