WET ETCHING SOLUTION
    2.
    发明申请
    WET ETCHING SOLUTION 审中-公开
    湿蚀刻解决方案

    公开(公告)号:US20120007019A1

    公开(公告)日:2012-01-12

    申请号:US13236880

    申请日:2011-09-20

    IPC分类号: C09K13/08

    摘要: A wet etching solution includes hydrogen fluoride in an amount of about 0.1% to about 3% by weight of the etching solution, an inorganic acid in an amount of about 10% to about 40% by weight of the etching solution, the inorganic acid being one or more of nitric acid, sulfuric acid, and/or hydrochloric acid, a nonionic surfactant in an amount of about 0.0001% to about 5% by weight of the etching solution, the surfactant including one or ore of alkylphenol ethoxylate and/or ammonium lauryl sulfate, and water.

    摘要翻译: 湿式蚀刻溶液包括以蚀刻溶液重量计约0.1%至约3%的量的氟化氢,蚀刻溶液的约10重量%至约40重量%的无机酸,无机酸为 硝酸,硫酸和/或盐酸中的一种或多种,​​蚀刻溶液重量的约0.0001%至约5%的非离子表面活性剂,表面活性剂包括烷基酚乙氧基化物和/或铵的一种或多种 月桂基硫酸盐和水。

    Nonaqueous Electrolyte for Battery
    3.
    发明申请
    Nonaqueous Electrolyte for Battery 审中-公开
    电池非水电解液

    公开(公告)号:US20090226820A1

    公开(公告)日:2009-09-10

    申请号:US11718031

    申请日:2004-10-27

    IPC分类号: H01M6/16

    摘要: The present invention relates to a nonaqueous electrolyte for a battery, and more particularly to a novel nonaqueous electrolyte for a battery in which a furanone based derivative is added to a conventional nonaqueous electrolyte for the lithium battery to inhibit decomposition of the electrolyte, and thereby the rate of increase of the battery thickness when it is allowed to stand at a high temperature is significantly decreased and capacity storage characteristics at high temperature are improved.

    摘要翻译: 本发明涉及一种电池用非水电解质,更具体地说,涉及一种新型的电池用非水电解质,其中,将呋喃酮系衍生物添加到用于锂电池的常规非水电解质中以抑制电解质的分解,由此, 当高温放置时电池厚度的增加率显着降低,高温下的容量存储特性提高。

    Wet etching solution
    6.
    发明授权
    Wet etching solution 有权
    湿蚀刻溶液

    公开(公告)号:US08043525B2

    公开(公告)日:2011-10-25

    申请号:US11892076

    申请日:2007-08-20

    IPC分类号: C09K13/00

    摘要: A wet etching solution includes hydrogen fluoride in an amount of about 0.1% to about 3% by weight of the etching solution, an inorganic acid in an amount of about 10% to about 40% by weight of the etching solution, the inorganic acid being one or more of nitric acid, sulfuric acid, and/or hydrochloric acid, a surfactant in an amount of about 0.0001% to about 5% by weight of the etching solution, the nonionic surfactant including one or more of alkylphenol ethoxylate and/or ammonium lauryl sulfate, and water.

    摘要翻译: 湿式蚀刻溶液包括以蚀刻溶液重量计约0.1%至约3%的量的氟化氢,蚀刻溶液的约10重量%至约40重量%的无机酸,无机酸为 硝酸,硫酸和/或盐酸中的一种或多种,​​表面活性剂的量为蚀刻溶液重量的约0.0001%至约5%,非离子表面活性剂包括一种或多种烷基酚乙氧基化物和/或铵 月桂基硫酸盐和水。

    Wet etching solution
    9.
    发明申请
    Wet etching solution 有权
    湿蚀刻溶液

    公开(公告)号:US20080041823A1

    公开(公告)日:2008-02-21

    申请号:US11892076

    申请日:2007-08-20

    IPC分类号: C09K13/08 C03C15/00

    摘要: A wet etching solution includes hydrogen fluoride in an amount of about 0.1% to about 3% by weight of the etching solution, an inorganic acid in an amount of about 10% to about 40% by weight of the etching solution, the inorganic acid being one or more of nitric acid, sulfuric acid, and/or hydrochloric acid, a nonionic surfactant in an amount of about 0.0001% to about 5% by weight of the etching solution, the nonionic surfactant including one or ore of alkylphenol ethoxylate and/or ammonium lauryl sulfate, and water.

    摘要翻译: 湿式蚀刻溶液包括以蚀刻溶液重量计约0.1%至约3%的量的氟化氢,蚀刻溶液的约10重量%至约40重量%的无机酸,无机酸为 一种或多种硝酸,硫酸和/或盐酸,非离子表面活性剂,其量为蚀刻溶液重量的约0.0001%至约5%,非离子表面活性剂包括一种或多种烷基酚乙氧基化物和/或 月桂基硫酸铵和水。