Abstract:
A manufacturing method for sputtering an anti-refection layer onto a board at low temperature has the merits of easily being implemented and easily mass-produced. The manufacturing method is used for sputtering multiple anti-refection layers onto a board. The method can be used for mass-producing anti-reflection panels as the raw material for the photo industry. The method is superior to the manufacturing method for producing nebulization anti-reflection panels. This invention utilizes the anti-reflection characteristics of the board structure that is sputtered and stacked alternatively with high index refraction layers and low index refraction layers. A continuous manufacturing process is adopted. The present invention uses plasma to clean the surface of the boards and adopts a traditional sputtering machine. Therefore, it is convenient for installing and mass-producing high quality material.
Abstract:
A method for sputtering a multilayer film on a sheet workpiece at a low temperature of the present invention has the following steps: employing plasma to clean a surface of a sheet workpiece, sputtering at least one metal oxide or semiconductor oxide on the sheet workpiece, and sputtering at least one ITO transparent electric layer on the sheet workpiece. The film sputtering process of the sheet workpiece employs continuously connecting work stations, thereby controlling delay time between the work stations of the sheet workpiece within a given range. The sheet workpiece is made from a macromolecular material.
Abstract:
An anti-reflection screen filter is provided that includes four consecutively applied layers to a substrate. A first layer, furthest from the substrate, is arranged on an underlying second layer and comprises an oxide material having a refractive index within the approximating range of 1.46 to 1.50 at a wavelength of 520 nm. The second layer is arranged on an underlying third layer and is formed by a metal having a refractive index within the approximating range of 1.5 to 4.0 at a wavelength of 520 nm. The third layer is arranged on an underlying fourth layer and is formed by a metal having a refractive index within the approximating range of 0.2 to 1.4 at a wavelength of 520 nm. The fourth layer is disposed on the front surface of a substrate and is formed by a metal having a refractive index within the approximating range of 1.5 to 4.0 at a wavelength of 520 nm.
Abstract:
A method of strengthening glass plate is provided. A plasma treating process is performed on a glass plate so that a surface pore variation of the glass plate after the plasma treating process is reduced relative to the surface pore variation of the glass plate before the plasma treating process, wherein the surface pore variation is a variation degree of surface pores in different unit areas of the glass plate. In the mean time, a melted network crosslinking structure is formed on the surface of the glass plate. Based on the above-mentioned mechanisms, the glass plate is strengthened. The plasma treating process is conducive to strengthen the glass plate whether the plasma treating process is performed before or after the conventional chemical strengthening process.
Abstract:
A touch panel includes a transparent substrate, an electrically conductive icon or artwork layer, a first icon or artwork layer, a sensing layer, a metal layout and an electrode pattern. The electrically conductive icon or artwork layer is disposed between the transparent substrate and the first icon or artwork layer. The first icon or artwork layer is so coated as to extend over the periphery of the electrically conductive icon or artwork layer. The electrically conductive icon or artwork layer is electrically connected to a grounding trace to impart the touch panel an improved anti-electromagnetic interference capability, thereby ameliorating the problem of false actuation that frequently occurs between the icon or artwork layer and the sensing layer in the conventional devices.
Abstract:
A method of strengthening glass plate is provided. A plasma treating process is performed on a glass plate so that a surface pore variation of the glass plate after the plasma treating process is reduced relative to the surface pore variation of the glass plate before the plasma treating process, wherein the surface pore variation is a variation degree of surface pores in different unit areas of the glass plate. In the mean time, a melted network crosslinking structure is formed on the surface of the glass plate. Based on the above-mentioned mechanisms, the glass plate is strengthened. The plasma treating process is conducive to strengthen the glass plate whether the plasma treating process is performed before or after the conventional chemical strengthening process.
Abstract:
A ITO layer structure, which is composed of the ITO as the outermost layer and the first anti-reflected layer on the specific side of the transparent substrate, furthermore, the second anti-reflected layer is formed on the opposite side of substrate, can improve the total transmittance.
Abstract:
A ITO layer structure, which is composed of the ITO as the outermost layer and the first anti-reflected layer on the specific side of the transparent substrate, furthermore, the second anti-reflected layer is formed on the opposite side of substrate, can improve the total transmittance.
Abstract:
The present invention proposes a surface capacitive integrated touch panel and manufacturing method thereof. The touch panel comprises a transparent substrate, an icon or artwork layer coated on the periphery of one side face of the transparent substrate, and the inner periphery of the icon layer is not perpendicular to the adjacent line of the transparent substrate. It also comprises a sensing layer which is stacked on icon layer or artwork layer and the areas on the transparent substrate uncovered with the icon layer or artwork layer. Other than that, it comprises a metal layout and an electrode pattern which are formed from the outer of the icon layer to its inner side. The electrode pattern is formed via coating, printing or spraying. This unconventional way of laminating the electrode pattern structures can effectively lower the overall thickness of the panel and increase yield rate.
Abstract:
The substrate according to the invention includes at least one surface coated with an organic buffer layer and the organic buffer layer is provided with a coating layer on a surface thereof opposite to its surface attached to the substrate. The provision of the organic buffer layer diminishes the effect of the coating layer on the strength of the substrate, thereby maintaining the strength of the substrate.