公开(公告)号：US09993103B2

公开(公告)日：2018-06-12

申请号：US14770839

申请日：2014-02-28

申请人： Bok-Ja Kim ,  Ik Jae Lee

发明人： Bok-Ja Kim ,  Ik Jae Lee

IPC分类号： A47J37/08 ,  A47J27/08 ,  A23C20/00 ,  A23C20/02 ,  A47J27/04 ,  A47J27/086 ,  A23L11/00

CPC分类号： A47J27/0817 ,  A23C20/00 ,  A23C20/025 ,  A23L11/09 ,  A47J27/04 ,  A47J27/0802 ,  A47J27/086 ,  A47J2027/043

摘要： The present invention relates to a whole soybean curd production system having a heating device and a cooling device, and a method for producing whole soybean curd and, more specifically, to a whole soybean curd production system and a method for producing whole soybean curd, the whole soybean curd production system comprising: a heating device having a steam boiler formed to be opened and closed so as to enable inside thereof to be cleaned; and a cooling device having a cooling means formed from a Peltier element.

公开(公告)号：US20160007788A1

公开(公告)日：2016-01-14

申请号：US14770839

申请日：2014-02-28

申请人： Bok-Ja KIM ,  Ik Jae LEE

发明人： Bok-Ja KIM ,  Ik Jae LEE

IPC分类号： A47J27/08 ,  A47J27/04 ,  A23C20/02 ,  A47J27/086

CPC分类号： A47J27/0817 ,  A23C20/00 ,  A23C20/025 ,  A23L11/09 ,  A47J27/04 ,  A47J27/0802 ,  A47J27/086 ,  A47J2027/043

摘要： The present invention relates to a whole soybean curd production system having a heating device and a cooling device, and a method for producing whole soybean curd and, more specifically, to a whole soybean curd production system and a method for producing whole soybean curd, the whole soybean curd production system comprising: a heating device having a steam boiler formed to be opened and closed so as to enable inside thereof to be cleaned; and a cooling device having a cooling means formed from a Peltier element.

摘要翻译： 本发明涉及一种具有加热装置和冷却装置的整个大豆凝乳生产系统，以及制造整个大豆凝乳的方法，更具体地说，涉及一种整个大豆凝乳生产系统和一种生产全豆腐的方法， 全豆腐生产系统包括：加热装置，其具有形成为打开和关闭的蒸汽锅炉，以使其内部能够被清洁; 以及具有由珀耳帖元件形成的冷却装置的冷却装置。

公开(公告)号：US20120118044A1

公开(公告)日：2012-05-17

申请号：US13381376

申请日：2009-12-03

申请人： II Hwan Choi ,  Han Soo Kim ,  Sun Tae Kim ,  Ik Jae Lee

发明人： II Hwan Choi ,  Han Soo Kim ,  Sun Tae Kim ,  Ik Jae Lee

IPC分类号： G01N7/00

CPC分类号： B01D53/30

摘要： There are disclosed a method for managing a pollution prevention facility and a system for effectively managing the pollution prevention facility which can exhaust pollutants, and a system thereof. A method for managing a pollution prevention facility includes a first measuring step of measuring pollutants before a pollution prevention facility treats a pollutant outlet; a second measuring step of measuring the amount of pollutants after the pollution prevention facility treats the pollutant outlet; and a managing step of managing an exchange period of a filling material provided in the pollution prevention facility.

摘要翻译： 公开了一种污染防治设备的管理方法和能够排除污染物的污染防治设备的系统及其系统。 污染防治设备的管理方法包括在污染防治设备对污染物出口进行处理之前测量污染物的第一测量步骤; 第二测量步骤，用于测量污染物排放设施处理污染物出口后的污染物量; 以及管理设置在防污染设施中的填充材料的交换周期的管理步骤。

公开(公告)号：US07397115B2

公开(公告)日：2008-07-08

申请号：US11485107

申请日：2006-07-12

申请人： Ik Jae Lee

发明人： Ik Jae Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49575 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A folding chip planar stack package is realized by employing folding chips. The folding chip planar stack package includes a substrate, first and second semiconductor chips attached to an upper surface of the substrate while being folded and spaced in parallel to each other, a bonding wire for electrically connecting the first and second semiconductor chips with the substrate, a sealing material for sealing the upper surface of the substrate including the first and second semiconductor chips and the bonding wire, and solder balls attached to a lower surface of the substrate.

摘要翻译： 通过采用折叠芯片实现折叠芯片平面堆叠封装。 折叠芯片平面堆叠封装包括基板，第一和第二半导体芯片，其被连接到基板的上表面，同时彼此平行地折叠并间隔开，用于将第一和第二半导体芯片与基板电连接的接合线， 用于密封包括第一和第二半导体芯片和接合线的基板的上表面的密封材料，以及附着到基板的下表面的焊球。