公开(公告)号：US20150056383A1

公开(公告)日：2015-02-26

申请号：US14238262

申请日：2012-08-13

Applicant: Intrinsiq Materials Ltd.

Inventor： Jose Pedrosa ,  Daniel Johnson ,  Richard Dixon

IPC: H05K3/02 ,  H05K3/00

CPC classification number: H05K3/027 ,  H05K1/097 ,  H05K3/0091 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/1283 ,  H05K2203/107 ,  H05K2203/108

Abstract: Method for printing high resolution features on a substrate, the method comprising: depositing a nanoparticle ink, comprising metal/semi-metal nanoparticles and an adhesive compound, having a binder on a substrate; and applying a laser beam, directly on some or all of the deposited nanoparticle ink to define the print feature, wherein the laser beam is configured to remove the nanoparticle coating or binder thereby allowing the adhesive compound to bond to the nanoparticles and the laser beam is further configured to transform the ink to form a metal/semi-metal structure. The remaining uncured structure can be easily washed away using standard developer solutions such as sodium or potassium hydroxide.

Abstract translation: 用于在基板上印刷高分辨率特征的方法，所述方法包括：在基底上沉积包含金属/半金属纳米颗粒和粘合剂的纳米颗粒油墨，所述粘合剂具有粘合剂; 以及直接在一些或所有沉积的纳米颗粒油墨上施加激光束以限定印刷特征，其中激光束被配置为去除纳米颗粒涂层或粘合剂，从而允许粘合剂化合物结合到纳米颗粒上，激光束是 进一步构造成转换油墨以形成金属/半金属结构。 剩余的未固化结构可以容易地用标准的显影剂溶液如氢氧化钠或氢氧化钾洗去。

公开(公告)号：US20190088617A1

公开(公告)日：2019-03-21

申请号：US16193709

申请日：2018-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  Intrinsiq Materials Ltd. ,  Technische Universitaet Chemnitz ,  SINTEF

Inventor： Thomas J. Brunschwiler ,  Richard Dixon ,  Maaike M. Visser Taklo ,  Bernhard Wunderle ,  Kerry Yu ,  Jonas Zuercher

IPC: H01L23/00

Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

公开(公告)号：US20160126202A1

公开(公告)日：2016-05-05

申请号：US14880648

申请日：2015-10-12

Applicant: International Business Machines Corporation ,  Conpart AS ,  Intrinsiq Materials Ltd. ,  Jerzy Haber Institute of Catalysis and Surface Chemistry

Inventor： Thomas J. Brunschwiler ,  Brian Burg ,  Richard Dixon ,  Helge Kristiansen ,  Piotr Warszynski ,  Jonas Zuercher

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11524 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/818 ,  H01L2224/92125 ,  H01L2924/00012

Abstract: A bridging arrangement includes a first and a second surface defining a gap therebetween. At least one surface of the first and second surface has an anisotropic energy landscape. A plurality of particles defines a path between the first and second surface bridging the gap.

Abstract translation: 桥接装置包括限定其间的间隙的第一表面和第二表面。 第一和第二表面的至少一个表面具有各向异性能量景观。 多个颗粒限定桥接间隙的第一和第二表面之间的路径。

公开(公告)号：US10030158B2

公开(公告)日：2018-07-24

申请号：US14441025

申请日：2013-11-06

Applicant: Intrinsiq Materials Ltd

Inventor： Richard Dixon ,  Jose Pedrosa ,  Kai Man Kerry Yu ,  Chih-Hao Yu

IPC: C09D11/00 ,  C09D11/322 ,  C09D11/52 ,  C09D5/00 ,  C08K3/34 ,  B22F1/00 ,  B22F7/08 ,  B22F9/04 ,  H01L31/0224

Abstract: The invention relates to an ink composition suitable for applications onto solar cells. Specifically, the invention describes several compositions, using nickel/silicon alloys which have been found to be particularly effective contact metallization of emitter layers. The ratio of nickel to silicon in claimed invention is in the range of 0.1:1 to 1:0.1.

公开(公告)号：US20160351529A1

公开(公告)日：2016-12-01

申请号：US14933951

申请日：2015-11-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  Intrinsiq Materials Ltd. ,  Technische Universitaet Chemnitz ,  SINTEF

Inventor： Thomas J. Brunschwiler ,  Richard Dixon ,  Maaike M. Visser Taklo ,  Bernhard Wunderle ,  Kerry Yu ,  Jonas Zuercher

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/03 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/05647 ,  H01L2224/08238 ,  H01L2224/11822 ,  H01L2224/13005 ,  H01L2224/13019 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13347 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/1607 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2957 ,  H01L2224/29647 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/8184 ,  H01L2224/8384 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Abstract translation: 一种用于电耦合支柱的垫和前表面的方法，包括使所述前表面柱成形，所述前表面至少部分地具有凸表面，向所述前表面或所述垫施加悬架，其中所述悬架包括 载体流体，导电微粒和导电纳米颗粒，将衬垫的与衬垫相对的前表面布置在一定距离处，使得载体流体至少部分地桥接柱的前表面和衬垫之间的间隙，蒸发载体 流体，从而限制微粒和纳米颗粒，从而将纳米颗粒和微粒作为柱的前表面和垫之间的渗透路径布置，并且至少在纳米颗粒之间和/或之间烧结布置的纳米颗粒以形成金属键 纳米颗粒和柱或垫的前面。

公开(公告)号：US20150274994A1

公开(公告)日：2015-10-01

申请号：US14441025

申请日：2013-06-11

Applicant: INTRINSIQ MATERIALS LTD.

Inventor： Richard Dixon ,  Jose Pedrosa ,  Kai Man Kerry Yu ,  Eric Yu

IPC: C09D11/00 ,  C08K3/34 ,  C09D5/00

Abstract: The invention relates to an ink composition suitable for applications onto solar cells. Specifically, the invention describes several compositions, using nickel/silicon alloys which have been found to be particularly effective contact metallisation of emitter layers. The ratio of nickel to silicon in claimed invention is in the range of 0.1:1 to 1:0.1.

Abstract translation: 本发明涉及一种适用于太阳能电池的油墨组合物。 具体地，本发明描述了使用已经被发现是特别有效的发射极层的接触金属化的镍/硅合金的几种组合物。 所要求保护的发明中镍与硅的比例在0.1:1至1:0.1的范围内。

公开(公告)号：US10170445B2

公开(公告)日：2019-01-01

申请号：US14933951

申请日：2015-11-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  Intrinsiq Materials Ltd. ,  Technische Universitaet Chemnitz ,  SINTEF

Inventor： Thomas J. Brunschwiler ,  Richard Dixon ,  Maaike M. Visser Taklo ,  Bernhard Wunderle ,  Kerry Yu ,  Jonas Zuercher

IPC: H01L23/48 ,  H01L23/00

Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.