公开(公告)号：US06551449B2

公开(公告)日：2003-04-22

申请号：US09753671

申请日：2001-01-04

Applicant: Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

Inventor： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC: B32B3120

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T156/1089 ,  H01L2924/00

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Abstract translation: 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。

公开(公告)号：US06203655B1

公开(公告)日：2001-03-20

申请号：US09197464

申请日：1998-11-23

Applicant: Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

Inventor： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC: B32B3120

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Abstract translation: 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。