公开(公告)号：US06551449B2

公开(公告)日：2003-04-22

申请号：US09753671

申请日：2001-01-04

申请人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

发明人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC分类号： B32B3120

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T156/1089 ,  H01L2924/00

摘要： Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

摘要翻译： 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。

公开(公告)号：US06203655B1

公开(公告)日：2001-03-20

申请号：US09197464

申请日：1998-11-23

申请人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

发明人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC分类号： B32B3120

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05599

摘要： Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

摘要翻译： 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。

公开(公告)号：US5520733A

公开(公告)日：1996-05-28

申请号：US266672

申请日：1994-06-28

申请人： Hiroyuki Doi ,  Shinichi Kazui ,  Takeji Shiokawa ,  Keiji Fujikawa ,  Yutaka Hashimoto ,  Makoto Matsuoka

发明人： Hiroyuki Doi ,  Shinichi Kazui ,  Takeji Shiokawa ,  Keiji Fujikawa ,  Yutaka Hashimoto ,  Makoto Matsuoka

IPC分类号： B05C5/00 ,  B05C5/02 ,  B23Q35/10 ,  H01L21/52 ,  H05K3/34 ,  H05K13/04 ,  B05C1/06

CPC分类号： B05C5/0216 ,  H01L24/743 ,  H05K13/0469 ,  H01L2224/743 ,  H01L2924/14

摘要： A depositing apparatus includes a profile-following mechanism having a translational displacement mechanism portion and a rotation mechanism portion adapted to allow a head to be swung in the directions of both X and the Y axes so that the head follows a profile of the surface of workpiece smoothly around a first contact point, thereof with the workpiece, serving as a fulcrum point.

摘要翻译： 沉积设备包括具有平移位移机构部分和旋转机构部分的轮廓跟随机构，该旋转机构部分适于允许头沿X轴和Y轴的方向摆动，使得头部遵循工件表面的轮廓 围绕其第一接触点与工件平齐地，作为支点。

公开(公告)号：US5906309A

公开(公告)日：1999-05-25

申请号：US759949

申请日：1996-12-03

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

IPC分类号： G01B11/02 ,  G01B11/06 ,  H01L21/60 ,  H01L21/66 ,  H05K13/08 ,  B23K3/08 ,  G01B11/24

CPC分类号： H05K13/08 ,  G01B11/0608 ,  H01L22/12

摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

公开(公告)号：US06196441B1

公开(公告)日：2001-03-06

申请号：US09289386

申请日：1999-04-12

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

IPC分类号： B23K3102

CPC分类号： H05K13/08 ,  G01B11/0608 ,  H01L22/12

摘要： A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

摘要翻译： 测量在其上安装半导体元件的衬底上形成的焊料凸块的方法包括：将待测量的工件安装在工件位置机构上，并通过光学微头扫描工件以测量工件的安装姿势的误差。 控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。 测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。 从回归平面计算每个凸起的顶点位置的误差，如果误差小于参考值，则判断为满意。

公开(公告)号：US6069701A

公开(公告)日：2000-05-30

申请号：US982509

申请日：1997-12-02

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Shinichi Kazui

IPC分类号： G01B11/02 ,  G01B11/06 ,  G01N21/88 ,  H01L21/60 ,  G01B11/24 ,  G01B11/00 ,  G01N21/00

CPC分类号： G01B11/0608 ,  G01N21/88

摘要： A method and an apparatus for measuring the height of an apex of an object with high accuracy without influence of the surface state of the object are disclosed. Correlation coefficients of respective positions of a waveform formed from digital data indicative of the height of the object detected by a head portion of a detector and a previously prepared standard waveform are calculated while moving the waveforms in the vertical and horizontal directions and the height of an apex position of the standard waveform at a position having a largest correlation coefficient from the calculated result is decided as the height of the apex of the object. Accordingly, the height of the apex can be decided from the whole detected waveforms without influence of local abnormality of the reflected light quantity waveform due to minute ruggedness or discoloration of the surface of the object.

摘要翻译： 公开了一种用于在不影响物体的表面状态的情况下以高精度测量物体顶点的高度的方法和装置。 计算表示由检测器的头部检测到的物体的高度的数字数据和预先准备的标准波形形成的波形的相应位置的相关系数，同时移动垂直和水平方向上的波形以及 在从计算结果具有最大相关系数的位置处的标准波形的顶点位置被确定为对象的顶点的高度。 因此，顶点的高度可以由整个检测波形确定，而不受由于物体表面的微小的凹凸或变色而引起的反射光量波形的局部异常的影响。

公开(公告)号：US06340109B2

公开(公告)日：2002-01-22

申请号：US09755106

申请日：2001-01-08

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

IPC分类号： B23K3112

CPC分类号： H05K13/08 ,  G01B11/0608 ,  H01L22/12

摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

摘要翻译： 在基板上具有多个焊料凸块的工件安装在工件定位机构上，并由光学微头扫描，以测量工件的安装姿势的误差。 控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。 测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。 计算出每个凸起从回归平面的顶点位置的误差，如果误差小于参考值，则判断为良好。

公开(公告)号：US09123879B2

公开(公告)日：2015-09-01

申请号：US14202802

申请日：2014-03-10

申请人： Masahiko Nakayama ,  Masatoshi Yoshikawa ,  Tadashi Kai ,  Yutaka Hashimoto ,  Masaru Toko ,  Hiroaki Yoda ,  Jae Geun Oh ,  Keum Bum Lee ,  Choon Kun Ryu ,  Hyung Suk Lee ,  Sook Joo Kim

发明人： Masahiko Nakayama ,  Masatoshi Yoshikawa ,  Tadashi Kai ,  Yutaka Hashimoto ,  Masaru Toko ,  Hiroaki Yoda ,  Jae Geun Oh ,  Keum Bum Lee ,  Choon Kun Ryu ,  Hyung Suk Lee ,  Sook Joo Kim

IPC分类号： H01L27/00 ,  H01L43/02 ,  H01L27/22 ,  H01L43/08 ,  H01L43/12

CPC分类号： H01L43/02 ,  H01L27/222 ,  H01L27/224 ,  H01L27/226 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12

摘要： According to one embodiment, a magnetoresistive element is disclosed. The magnetoresistive element includes a reference layer, a tunnel barrier layer, a storage layer. The storage layer includes a first region and a second region provided outside the first region to surround the first region, the second region including element included in the first region and another element being different from the element. The magnetoresistive element further includes a cap layer including a third region and a fourth region provided outside the third region to surround the third region, the fourth region including an element included in the third region and the another element.

摘要翻译： 根据一个实施例，公开了一种磁阻元件。 磁阻元件包括参考层，隧道势垒层，存储层。 存储层包括第一区域和设置在第一区域外部以围绕第一区域的第二区域，第二区域包括包含在第一区域中的元素，而另一个元素不同于元件。 磁阻元件进一步包括盖层，该盖层包括第三区域和设置在第三区域外部以包围第三区域的第四区域，第四区域包括包括在第三区域中的元件和另一元件。

公开(公告)号：US08393765B2

公开(公告)日：2013-03-12

申请号：US12630414

申请日：2009-12-03

申请人： Naoki Sugishita ,  Homare Takai ,  Takafumi Oishi ,  Yasuhiko Ishii ,  Masanao Hieda ,  Yutaka Hashimoto

发明人： Naoki Sugishita ,  Homare Takai ,  Takafumi Oishi ,  Yasuhiko Ishii ,  Masanao Hieda ,  Yutaka Hashimoto

IPC分类号： F21V17/00

CPC分类号： F21V7/0083 ,  F21S8/026 ,  F21V17/107 ,  F21V21/049 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A luminaire includes a light-emitting unit, a main body frame, a support frame, and a lighting unit. The light-emitting unit mounts light-emitting elements. The main body frame supports the light-emitting unit, and is formed rectangular having a hook-shaped engaging piece on one side. The support frame is formed rectangular surrounding the outer periphery of the main body frame, and has a groove-shaped receiving place to engage with the engaging piece of the main body frame, on one internal side. The lighting unit turns on the light-emitting elements.

摘要翻译： 照明装置包括发光单元，主体框架，支撑框架和照明单元。 发光单元安装发光元件。 主体框架支撑发光单元，并且在一侧形成具有钩形接合件的矩形。 支撑框架围绕主体框架的外周形成为矩形，并且在一个内侧具有与主体框架的接合件接合的槽形接收位置。 照明单元打开发光元件。

公开(公告)号：US06875810B2

公开(公告)日：2005-04-05

申请号：US09983351

申请日：2001-10-24

申请人： Mitsuru Kitada ,  Kazuo Kuba ,  Yutaka Hashimoto

发明人： Mitsuru Kitada ,  Kazuo Kuba ,  Yutaka Hashimoto

IPC分类号： C08G18/28 ,  C08G18/08 ,  C08G18/12 ,  C08G18/42 ,  C08G18/46 ,  C08G18/70 ,  C09J175/06 ,  C08J3/00 ,  C08K3/20 ,  C08L75/00

CPC分类号： C09J175/06 ,  C08G18/0828 ,  C08G18/12 ,  C08G18/4202 ,  C08G18/4676 ,  C08G18/706 ,  C08G2170/80 ,  C08G18/3246

摘要： An aqueous dispersion of a polyurethane resin obtainable from compounds including: (A) an organic polyisocyanate; (B) a polyester polyol containing an aromatic metal sulfonate group; (C) an aliphatic polyol being free from aromatic metal sulfonate and having a hydroxyl value of from 10 to 350; and (D) at least one of a polyamine and a polyol each having a molecular weight of 300 or lower, wherein the content of said aliphatic polyol unit (C) amounts to at least 55% by weight based on the solid content of said polyurethane resin. Also disclosed is an aqueous adhesive comprising the polyurethane resin aqueous dispersion.

摘要翻译： 一种聚氨酯树脂的水分散体，其可由以下化合物获得，所述化合物包括：（A）有机多异氰酸酯; （B）含有芳族金属磺酸盐基团的聚酯多元醇; （C）不含芳香族金属磺酸盐且羟基值为10〜350的脂族多元醇; 和（D）分子量为300以下的多胺和多元醇中的至少一种，其中所述脂肪族多元醇单元（C）的含量相对于所述聚氨酯的固体成分为至少55重量％ 树脂。 还公开了包含聚氨酯树脂水分散体的水性粘合剂。