公开(公告)号：US5296649A

公开(公告)日：1994-03-22

申请号：US852526

申请日：1992-03-17

Applicant: Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

Inventor： Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

IPC: B23K35/02 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K01/00

CPC classification number: H05K3/3484 ,  B23K35/0222 ,  B23K35/34 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0435 ,  H05K3/3421 ,  H05K3/3452 ,  Y02P70/611

Abstract: A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

Abstract translation: 在电路板主体上以0.5mm以下的间距形成多个焊盘。 焊盘形成为使得来自板体表面的焊盘的突出高度H和焊盘的宽度W满足关系2H D。 通过在构成焊料层的金属中的离子化倾向最高的金属粉末或其合金粉末之间的取代反应和通过将焊料层中的其它金属或金属接合而形成的盐而获得的焊料层为 有机酸形成在每个垫上。

公开(公告)号：US4960642A

公开(公告)日：1990-10-02

申请号：US163962

申请日：1987-12-15

Applicant: Izumi Kosuga ,  Kenichi Otani ,  Kazuaki Matsumuto

Inventor： Izumi Kosuga ,  Kenichi Otani ,  Kazuaki Matsumuto

IPC: B29B9/06 ,  B29B9/14

CPC classification number: B29B9/06 ,  B29B9/14 ,  B29K2995/0005 ,  Y10T428/2907 ,  Y10T428/2918 ,  Y10T428/294 ,  Y10T428/2947 ,  Y10T428/2998

Abstract: Pellets for making electromagnetic wave shielding material and a method for manufacturing the same are provided in which a desired number of conductive fibers of a desired length are impregnated with thermoplastic resin oligomer to provide an integral unit and then the thermoplastic resin is coated on the outside of the integral unit. The pellets are excellent in a dispersion of the conductive fibers in the thermoplastic resin, greater in aspect ratio, and excellent for use in making a shielding material against electric and magnetic fields.