公开(公告)号：US08328940B2

公开(公告)日：2012-12-11

申请号：US13041338

申请日：2011-03-04

申请人： Jae-Wook Choi ,  Young-Rok Kim

发明人： Jae-Wook Choi ,  Young-Rok Kim

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： H01L21/67748 ,  Y10S414/135 ,  Y10S414/139

摘要： In one embodiment, a transfer robot for transferring a substrate includes a supporting means, a transfer robot arm including a first sub-robot arm and a second sub-robot arm arranged over the supporting means, an inner rail and an outer rail adjacent to the inner rail overlying the supporting means. The first sub-robot arm is adapted to move in a straight line motion along the inner rail and the second sub-robot arm is adapted to move in a straight line motion along the outer rail. The second sub-robot arm surrounds the first sub-robot arm.

摘要翻译： 在一个实施例中，用于传送衬底的传送机器人包括支撑装置，包括布置在支撑装置上方的第一副机器人臂和第二副机器人臂的传送机器人手臂，与所述支撑装置相邻的内轨道和外轨道 内轨覆盖支撑装置。 第一子机器人臂适于沿着内轨线以直线运动移动，并且第二副机器人手臂适于沿着外轨道以直线运动运动。 第二子机器人臂围绕第一子机器人臂。

公开(公告)号：US20100006031A1

公开(公告)日：2010-01-14

申请号：US12497697

申请日：2009-07-05

申请人： Jae-Wook CHOI ,  Chan-Ho Park

发明人： Jae-Wook CHOI ,  Chan-Ho Park

IPC分类号： C23C16/54

CPC分类号： C23C16/45565

摘要： A gas distribution plate that is installed in a chamber providing a reaction space and supplies a reaction gas onto a substrate placed on a substrate placing plate, wherein the gas distribution plate includes: first and second surfaces opposing to each other, wherein the second surface faces the substrate placing plate and has a recess shape; and a plurality of injection holes each including: an inflow portion that extends from the first surface toward the second surface; a diffusing portion that extends from the second surface toward the first surface; and an orifice portion between the inflow portion and the diffusing portion, wherein the plurality of inflow portions of the plurality of injection holes decrease in gas path from edge to middle of the gas distribution plate, and wherein the plurality of diffusing portions of the plurality of injection holes have substantially the same gas path.

摘要翻译： 一种气体分配板，其安装在提供反应空间的室中，并将反应气体供应到放置在基板载置板上的基板上，其中所述气体分配板包括：彼此相对的第一和第二表面，其中所述第二表面面 基板放置板，并具有凹部形状; 以及多个喷射孔，每个喷射孔包括：从所述第一表面朝向所述第二表面延伸的流入部分; 扩散部，其从所述第二面向所述第一面延伸; 以及在所述流入部与所述扩散部之间的节流部，所述多个喷射孔的所述多个流入部从所述气体分配板的边缘向中央部的气体路径减少，所述多个喷射孔的所述多个扩散部 注入孔具有基本相同的气体路径。

公开(公告)号：US20120156883A1

公开(公告)日：2012-06-21

申请号：US13325303

申请日：2011-12-14

申请人： Jae Wook CHOI

发明人： Jae Wook CHOI

IPC分类号： H01L21/311

CPC分类号： H01L27/11529 ,  H01L21/0337 ,  H01L21/0338 ,  H01L27/11524 ,  H01L29/40114

摘要： A method of forming patterns of a semiconductor device includes forming partition patterns on a hard mask layer; forming a first auxiliary layer on the entire structure including a surface of the partition patterns; forming auxiliary patterns to cover a portion of the first auxiliary layer formed over sidewalls of the partition pattern formed in second region, where each of the auxiliary patterns in the second region has a width greater than a thickness of the first auxiliary layer; forming spacers on sidewalls of the partition patterns, so that a portion of the partition patterns and a portion of the hard mask layer are exposed; removing the auxiliary patterns; etching the partition patterns exposed between the spacers; and removing remaining regions of the partition patterns and the hard mask layer exposed between the spacers.

摘要翻译： 一种形成半导体器件的图案的方法包括在硬掩模层上形成分隔图案; 在包括所述分隔图案的表面的整个结构上形成第一辅助层; 形成辅助图案以覆盖在形成在第二区域中的分隔图案的侧壁上形成的第一辅助层的一部分，其中第二区域中的每个辅助图案的宽度大于第一辅助层的厚度; 在分隔图案的侧壁上形成间隔物，使得分隔图案的一部分和硬掩模层的一部分露出; 去除辅助图案; 蚀刻在间隔件之间暴露的分隔图案; 并且去除分隔图案的剩余区域和暴露在间隔物之间​​的硬掩模层。

公开(公告)号：US07905960B2

公开(公告)日：2011-03-15

申请号：US11083838

申请日：2005-03-16

申请人： Jae-Wook Choi ,  Young-Rok Kim

发明人： Jae-Wook Choi ,  Young-Rok Kim

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： H01L21/67748 ,  Y10S414/135 ,  Y10S414/139

摘要： An apparatus for manufacturing a substrate includes: a transferring chamber extended along a long direction; at least one process chamber connected to the transferring chamber along the long direction; at least one load-lock chamber connected to the transferring chamber at least one side of the transferring chamber; and a transferring chamber robot moving along the long direction in the transferring chamber and transferring a substrate.

摘要翻译： 一种用于制造衬底的装置，包括：沿着长方向延伸的传送室; 至少一个处理室沿着长方向连接到传送室; 至少一个装载锁定室，在传送室的至少一侧连接到传送室; 以及传送室机器人在传送室中沿长度方向移动并传送基板。

公开(公告)号：US20070051314A1

公开(公告)日：2007-03-08

申请号：US11470946

申请日：2006-09-07

申请人： Jae-Wook Choi ,  Young-Rok Kim

发明人： Jae-Wook Choi ,  Young-Rok Kim

IPC分类号： C23F1/00 ,  C23C16/00

CPC分类号： H01L21/67126 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67196

摘要： A substrate-treating apparatus includes: at least one process chamber treating a substrate; a movable transfer chamber movable adjacent to the process chamber; a driving means moving the movable transfer chamber; and a connection means combining and separating the process chamber and the movable transfer chamber.

摘要翻译： 基板处理装置包括：处理基板的至少一个处理室; 可移动传送室，其可移动地邻近所述处理室; 移动可移动传送室的驱动装置; 以及连接装置，其组合和分离处理室和可移动传送室。

公开(公告)号：US09022714B2

公开(公告)日：2015-05-05

申请号：US13141055

申请日：2010-01-12

申请人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

发明人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67742 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S901/14 ,  Y10S901/19 ,  Y10S901/25

摘要： A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring unit transferring the substrate to the processing chamber through a bi-directional sliding movement.

摘要翻译： 一种基板处理系统和基板转印方法，其能够通过使用设置在线性布置的两行处理室之间的基板转印装置双向转印基板，从而提高基板转印效率，所述基板处理系统包括：转印室，具有 至少一个用于双向转印衬底的双向衬底转移装置; 以及多个处理室，用于对基板施加半导体制造工艺，其中所述多个处理室沿着彼此面对的两列线性排列，并且所述传送室插入在所述两行处理室之间，其中， 双向基板转印装置在传送室内具有移动单元，并通过线性电动机水平移动; 以及移动单元中的双向基板传送单元，双向基板传送单元通过双向滑动运动将基板传送到处理室。

公开(公告)号：US08702867B2

公开(公告)日：2014-04-22

申请号：US12497697

申请日：2009-07-05

申请人： Jae-Wook Choi ,  Chan-Ho Park

发明人： Jae-Wook Choi ,  Chan-Ho Park

IPC分类号： C23C16/455 ,  H01L21/306 ,  C23F1/00 ,  C23C16/06 ,  C23C16/22

CPC分类号： C23C16/45565

摘要： A gas distribution plate that is installed in a chamber providing a reaction space and supplies a reaction gas onto a substrate placed on a substrate placing plate, wherein the gas distribution plate includes: first and second surfaces opposing to each other, wherein the second surface faces the substrate placing plate and has a recess shape; and a plurality of injection holes each including: an inflow portion that extends from the first surface toward the second surface; a diffusing portion that extends from the second surface toward the first surface; and an orifice portion between the inflow portion and the diffusing portion, wherein the plurality of inflow portions of the plurality of injection holes decrease in gas path from edge to middle of the gas distribution plate, and wherein the plurality of diffusing portions of the plurality of injection holes have substantially the same gas path.

摘要翻译： 一种气体分配板，其安装在提供反应空间的室中，并将反应气体供应到放置在基板载置板上的基板上，其中所述气体分配板包括：彼此相对的第一和第二表面，其中所述第二表面面 基板放置板，并具有凹部形状; 以及多个喷射孔，每个喷射孔包括：从所述第一表面朝向所述第二表面延伸的流入部分; 扩散部，其从所述第二面向所述第一面延伸; 以及在所述流入部与所述扩散部之间的节流部，所述多个喷射孔的所述多个流入部从所述气体分配板的边缘向中央部的气体路径减少，所述多个喷射孔的所述多个扩散部 注入孔具有基本相同的气体路径。

公开(公告)号：US20110262252A1

公开(公告)日：2011-10-27

申请号：US13141055

申请日：2010-01-12

申请人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

发明人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

IPC分类号： H01L21/677

CPC分类号： H01L21/67742 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S901/14 ,  Y10S901/19 ,  Y10S901/25

摘要： A substrate processing system and substrate transferring method is disclosed, which is capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system comprising a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the at least one bi-directional substrate transferring device comprises a moving unit provided inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit provided in the moving unit, the bi-directional substrate transferring unit for transferring the substrate to the processing chamber through a bi-directional sliding movement.

摘要翻译： 公开了一种基板处理系统和基板转印方法，其能够通过使用设置在线性布置的两行处理室之间的基板转印装置双向转印基板，从而提高基板转印效率，基板处理系统 包括具有用于双向转印衬底的至少一个双向衬底转移装置的传送室; 以及多个处理室，用于对基板施加半导体制造工艺，其中所述多个处理室沿着彼此面对的两列线性排列，并且所述传送室插入在所述两行处理室之间，其中， 至少一个双向基板传送装置包括设置在传送室内部并由线性马达水平移动的移动单元; 以及设置在所述移动单元中的双向基板传送单元，所述双向基板传送单元用于通过双向滑动运动将所述基板传送到所述处理室。

公开(公告)号：US20110150608A1

公开(公告)日：2011-06-23

申请号：US13041338

申请日：2011-03-04

申请人： Jae-Wook CHOI ,  Young-Rok KIM

发明人： Jae-Wook CHOI ,  Young-Rok KIM

IPC分类号： H01L21/677

CPC分类号： H01L21/67748 ,  Y10S414/135 ,  Y10S414/139

摘要： In one embodiment, a transfer robot for transferring a substrate includes a supporting means, a transfer robot arm including a first sub-robot arm and a second sub-robot arm arranged over the supporting means, an inner rail and an outer rail adjacent to the inner rail overlying the supporting means. The first sub-robot arm is adapted to move in a straight line motion along the inner rail and the second sub-robot arm is adapted to move in a straight line motion along the outer rail. The second sub-robot arm surrounds the first sub-robot arm.

摘要翻译： 在一个实施例中，用于传送衬底的传送机器人包括支撑装置，包括布置在支撑装置上方的第一副机器人臂和第二副机器人臂的传送机器人手臂，与所述支撑装置相邻的内轨道和外轨道 内轨覆盖支撑装置。 第一子机器人臂适于沿着内轨线以直线运动移动，并且第二副机器人手臂适于沿着外轨道以直线运动运动。 第二子机器人臂围绕第一子机器人臂。

公开(公告)号：US20050211169A1

公开(公告)日：2005-09-29

申请号：US11083838

申请日：2005-03-16

申请人： Jae-Wook Choi ,  Young-Rok Kim

发明人： Jae-Wook Choi ,  Young-Rok Kim

IPC分类号： C23C16/00 ,  H01L21/00

CPC分类号： H01L21/67748 ,  Y10S414/135 ,  Y10S414/139

摘要： An apparatus for manufacturing a substrate includes: a transferring chamber extended along a long direction; at least one process chamber connected to the transferring chamber along the long direction; at least one load-lock chamber connected to the transferring chamber at least one side of the transferring chamber; and a transferring chamber robot moving along the long direction in the transferring chamber and transferring a substrate.

摘要翻译： 一种用于制造衬底的装置，包括：沿着长方向延伸的传送室; 至少一个处理室沿着长方向连接到传送室; 至少一个装载锁定室，在传送室的至少一侧连接到传送室; 以及传送室机器人在传送室中沿长度方向移动并传送基板。