Method for laser drilling a counter-tapered through-hole in a material
    9.
    发明授权
    Method for laser drilling a counter-tapered through-hole in a material 失效
    用于在材料中激光钻孔相反锥形通孔的方法

    公开(公告)号:US06642477B1

    公开(公告)日:2003-11-04

    申请号:US10060231

    申请日:2001-10-23

    IPC分类号: B23K2600

    摘要: A method of forming a through-hole which is counter-tapered relative to a drilling laser involves directing, along an incidence axis and onto an impingement location on a first surface of a material, a laser beam of sufficient energy to ablate the material, the incidence axis being offset from a normal to the first surface at the impingement location. The material and the laser beam are then relatively rotated, for at least 360°, such that a through-hole having a larger exit opening than entrance opening is formed.

    摘要翻译: 形成相对于钻孔激光器相对锥度的通孔的方法包括沿着入射轴线和材料的第一表面上的冲击位置引导具有足以消除材料的能量的激光束, 入射轴线从冲击位置处的第一表面的法线偏移。 然后材料和激光束相对旋转至少360°,使得形成具有比入口更大的出口的通孔。