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20 条记录 (耗时 0.03 秒)

    CONNECTOR ASSEMBLY AND METHOD
    7.
    发明申请
    CONNECTOR ASSEMBLY AND METHOD 有权
    连接器总成和方法

    公开(公告)号：US20140162475A1

    公开(公告)日：2014-06-12

    申请号：US13711187

    申请日：2012-12-11

    申请人： Gaurav Chawla ,  Joshua D. Heppner ,  Zhichao Zhang ,  David J. Llapitan ,  Vijaykumar Krithivasan

    发明人： Gaurav Chawla ,  Joshua D. Heppner ,  Zhichao Zhang ,  David J. Llapitan ,  Vijaykumar Krithivasan

    IPC分类号： H01R12/71

    CPC分类号： H01R12/722 ,  H01L23/34 ,  H01L2924/0002 ,  H01R12/7005 ,  H01R12/71 ,  H01R12/724 ,  H01R12/79 ,  H01R13/114 ,  H01L2924/00

    摘要： Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.

    摘要翻译： 显示连接器和耦合封装和管芯的方法。 所选择的实例包括具有两个或更多台阶的插头和插座，其具有沿梯田提供的触点。 连接器和方法的示例包括其中连接器可用于包括沿衬底耦合的裸片的封装的配置。 在所选择的示例中，散热器耦合在管芯上，并且封装包括在散热器和被配置为接收连接器的基板之间的侧入口，例如通过侧面接入端口的一个或多个插头或插座。

    CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN
    8.
    发明申请
    CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN 有权
    芯片插座，包括圆形接触图案

    公开(公告)号：US20140162474A1

    公开(公告)日：2014-06-12

    申请号：US13712166

    申请日：2012-12-12

    申请人： Gaurav Chawla ,  Vijaykumar Krithivasan ,  Joshua D. Heppner

    发明人： Gaurav Chawla ,  Vijaykumar Krithivasan ,  Joshua D. Heppner

    IPC分类号： H01R24/86

    CPC分类号： H01R43/20 ,  H01R24/86 ,  H05K7/1084 ,  Y10T29/4922

    摘要： An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.

    摘要翻译： 用于将集成电路耦合到其它电子设备的装置可以包括具有外部和内部的外壳，外部具有外部底部表面，内部由与外部底部表面相对的内部底部表面限定，并且至少一个侧壁延伸远离 从内部底部表面限定尺寸适于接收集成电路的内部形状，其中集成电路抵靠内部底部表面和至少一个侧壁设置。 该示例可以包括沿着外部底部表面暴露的多个外部接触件，外部接触图案通常为圆形形状。

    SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVERMOLDING AND PLATING
    9.
    发明申请
    SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVERMOLDING AND PLATING 有权
    用于微处理器的屏蔽插座及其通过过度和镀层的制造

    公开(公告)号：US20150004813A1

    公开(公告)日：2015-01-01

    申请号：US13930090

    申请日：2013-06-28

    申请人： Joshua D. Heppner ,  Gaurav Chawla

    发明人： Joshua D. Heppner ,  Gaurav Chawla

    IPC分类号： H01R43/24 ,  H01R43/16 ,  H01R13/6581

    CPC分类号： H01R43/24 ,  H01L21/00 ,  H01L21/50 ,  H01L2021/60 ,  H01R12/716 ,  H01R13/245 ,  H01R13/405 ,  H01R13/6599 ,  H01R43/16 ,  H05K7/10

    摘要： Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

    摘要翻译： 描述了用于微处理器的屏蔽插座和通过包覆成型和电镀技术制造屏蔽插座。 在一个示例中，用于封装半导体器件的插座包括具有围绕空腔的壁的塑料外壳。 多个接触条设置在空腔中并由塑料外壳的一个或多个壁支撑。 多个接触条中的每一个包括多个触点。 多个触点中的每一个包括用塑料，接触部分和J引线部分包覆成型的垂直区域。 塑料涂有金属层。