公开(公告)号：US20140187058A1

公开(公告)日：2014-07-03

申请号：US13728735

申请日：2012-12-27

申请人： Hongfei Yan ,  Jeffory L. Smalley

发明人： Hongfei Yan ,  Jeffory L. Smalley

IPC分类号： H01R13/502 ,  H05K7/20 ,  H01R12/51

CPC分类号： H05K7/20436 ,  H01R12/716 ,  H01R12/73

摘要： A modular multiple piece socket and a computing system are described herein. The modular multiple piece socket includes a plurality of socket pieces, wherein at least one corridor separates the socket pieces. The plurality of socket pieces may be configured to secure a processing unit to a printed circuit board. The at least one corridor may be filled with a thermally conductive material.

摘要翻译： 本文描述了模块化多件式插座和计算系统。 模块化多件式插座包括多个插座件，其中至少一个走廊分离插座件。 多个插座件可以被配置为将处理单元固定到印刷电路板。 至少一个走廊可以用导热材料填充。

公开(公告)号：US20160190716A1

公开(公告)日：2016-06-30

申请号：US14583357

申请日：2014-12-26

申请人： Kuang Liu ,  Gregorio Murtagian ,  David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado

发明人： Kuang Liu ,  Gregorio Murtagian ,  David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado

IPC分类号： H01R12/70 ,  H01R43/20

CPC分类号： H01R12/89 ,  H01R12/716 ,  H05K7/1007

摘要： Some forms relate to a socket having a housing. A first receiving pin field is formed as part of the housing. The first pin receiving field includes a first plurality of electrical contacts. A second receiving pin field is formed as part of the housing. The second pin field includes a second plurality of electrical contacts. An actuation mechanism is configured to engage the first plurality electrical contacts with a first set of pins on a first electronic package and the second plurality electrical contacts with a second set of pins on a second electronic package.

摘要翻译： 一些形式涉及具有外壳的插座。 第一接收引脚字段形成为外壳的一部分。 第一引脚接收区域包括第一多个电触点。 第二接收引脚字段形成为外壳的一部分。 第二引脚字段包括第二多个电触点。 致动机构构造成使第一多个电触点与第一电子封装上的第一组引脚接合，而第二多个电触点与第二电子封装上的第二组引脚接合。

公开(公告)号：US20240355702A1

公开(公告)日：2024-10-24

申请号：US18756860

申请日：2024-06-27

申请人： Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

发明人： Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/367 ,  H01L23/49816 ,  H01L23/562

摘要： Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.

公开(公告)号：US20160190717A1

公开(公告)日：2016-06-30

申请号：US14583372

申请日：2014-12-26

申请人： David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado ,  Kuang Liu ,  Gregorio Murtagian

发明人： David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado ,  Kuang Liu ,  Gregorio Murtagian

IPC分类号： H01R12/70 ,  H01R43/20

CPC分类号： H05K7/1084

摘要： Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.

摘要翻译： 一些形式涉及包括多个电子封装的电子组件。 电子组件包括安装在框架上的框架和第一电子封装件。 第一电子封装包括第一引脚格栅阵列。 电子组件还包括安装在框架上的第二电子封装。 第二电子封装包括第二引脚格栅阵列。 电子组件还包括在框架上的致动机构。 致动机构构造成在致动机构的操作期间相对于框架移动第一电子封装和第二电子封装。

公开(公告)号：US20150118870A1

公开(公告)日：2015-04-30

申请号：US14065281

申请日：2013-10-28

申请人： Rajasekaran Swaminathan ,  Ram S. Viswanath ,  Sanka Ganesan ,  Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L. Smalley ,  Vijaykumar Krithivasan ,  David J. Llapitan ,  Neal E. Ulen ,  Donald T. Tran

发明人： Rajasekaran Swaminathan ,  Ram S. Viswanath ,  Sanka Ganesan ,  Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L. Smalley ,  Vijaykumar Krithivasan ,  David J. Llapitan ,  Neal E. Ulen ,  Donald T. Tran

IPC分类号： H01R12/71 ,  H01R43/00

CPC分类号： H05K7/10 ,  H01R12/00 ,  H01R12/716 ,  H01R13/2442 ,  H05K1/00 ,  Y10T29/49169

摘要： Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

摘要翻译： 描述了与集成电路（IC）连接器相关的实施例。 在一些实施例中，IC组件可以包括IC封装衬底，中间构件和阳连接器。 IC封装基板可以在顶表面或底表面上具有第一信号触点，并且底表面可以具有用于与电路板上的插座耦合的第二信号触点。 中间构件可以具有联接到第一信号触头的第一端和延伸超过侧表面的第二端。 阳连接器可以设置在中间构件的第二端处，并且可以具有联接到中间构件的信号触点的信号触点。 当阴连接器沿平行于中间构件的轴线的方向接合时，阳连接器可与母连接器配合。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20120127658A1

公开(公告)日：2012-05-24

申请号：US12953035

申请日：2010-11-23

申请人： Corey D. Hartman ,  Brian T. Whitman ,  Glen Patrick Gordon ,  Jeffory L. Smalley ,  Michael Schrempp ,  Pete Ross ,  Russell Smith

发明人： Corey D. Hartman ,  Brian T. Whitman ,  Glen Patrick Gordon ,  Jeffory L. Smalley ,  Michael Schrempp ,  Pete Ross ,  Russell Smith

IPC分类号： G06F1/16 ,  B23P11/00

CPC分类号： G06F1/186 ,  G06F1/187 ,  Y10T29/49826

摘要： A memory carrier system includes a carrier chassis that includes a board having a board connector. The board is operable to couple to a plurality of memory modules. A pair of pinion cams are rotatably mounted to the carrier chassis. A handle is moveably coupled to the carrier chassis and includes a pair of rack arms. Each rack arm engages a respective pinion cam. The carrier chassis is operable to be positioned in an information handling system (IHS) chassis that includes an IHS connector, and the handle is operable to be moved relative to the carrier chassis in order to rotate the pinion cams into an engagement with the IHS chassis that provides a cam force that mates the board connector to the IHS connector.

摘要翻译： 存储器载体系统包括载体底架，其包括具有板连接器的板。 板可操作以耦合到多个存储器模块。 一对小齿轮凸轮可旋转地安装在承载架上。 手柄可移动地联接到承载架，并且包括一对齿条臂。 每个齿条臂与相应的小齿轮凸轮接合。 载体底盘可操作地定位在包括IHS连接器的信息处理系统（IHS）底盘中，并且手柄可操作以相对于承载底盘移动，以便将小齿轮凸轮旋转成与IHS底盘接合 它提供了将板连接器与IHS连接器相配合的凸轮力。

公开(公告)号：US20240349457A1

公开(公告)日：2024-10-17

申请号：US18754759

申请日：2024-06-26

申请人： Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

发明人： Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  H05K7/20709

摘要： Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

公开(公告)号：US09681556B2

公开(公告)日：2017-06-13

申请号：US13631806

申请日：2012-09-28

申请人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

发明人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

IPC分类号： H05K3/30 ,  H05K7/10

CPC分类号： H05K3/301 ,  H05K7/1007 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018 ,  H05K2203/167

摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

公开(公告)号：US20150184053A1

公开(公告)日：2015-07-02

申请号：US14142704

申请日：2013-12-27

申请人： SHANKAR KRISHNAN ,  Susan F. Smith ,  CHRISTIAN AK AMOAH-KUSI ,  Jeffory L. Smalley ,  Barrett M. Faneuf ,  Jeremy Young ,  Tao Liu ,  loan Sauciuc

发明人： SHANKAR KRISHNAN ,  Susan F. Smith ,  CHRISTIAN AK AMOAH-KUSI ,  Jeffory L. Smalley ,  Barrett M. Faneuf ,  Jeremy Young ,  Tao Liu ,  loan Sauciuc

IPC分类号： C09K5/06 ,  B23P15/26 ,  H05K7/20 ,  F28F23/00

CPC分类号： C09K5/06 ,  F28D20/02 ,  F28F2013/006 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10T29/4935 ,  H01L2924/00

摘要： A gasketted thermal interface material (TIM) is described herein. The gasketted TIM includes a phase change thermal interface material and a curable thermal interface material. The curable thermal interface material surrounds the phase change thermal interface material. The gasketted TIM also includes a gasketted chamber, and the phase change thermal interface material is located within the gasketted chamber.

摘要翻译： 本文描述了垫圈热界面材料（TIM）。 垫圈TIM包括相变热界面材料和可固化的热界面材料。 可固化热界面材料围绕相变热界面材料。 垫圈TIM还包括一个垫圈腔，相变热界面材料位于垫圈腔内。

公开(公告)号：US08279596B2

公开(公告)日：2012-10-02

申请号：US12846286

申请日：2010-07-29

申请人： Alejandro Z. Rodriguez ,  Brian T. Whitman ,  Char Damneun ,  Corey D. Hartman ,  Glen P. Gordon ,  Jeffory L. Smalley

发明人： Alejandro Z. Rodriguez ,  Brian T. Whitman ,  Char Damneun ,  Corey D. Hartman ,  Glen P. Gordon ,  Jeffory L. Smalley

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  Y10T29/49817 ,  Y10T29/49826

摘要： A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.

摘要翻译： 风扇安装系统包括限定多个风扇壳体的风扇底盘。 导向件位于风扇底盘上。 至少一个板支撑构件从风扇框架延伸，并且当风扇机架位于IHS机箱中时，可操作以延伸穿过板以接合信息处理系统（IHS）机箱。 IHS机箱盖锚固件位于风扇机架上，可用于与IHS机箱盖接合，并将风扇机箱连接到IHS机箱时将IHS机箱盖固定到IHS机箱。