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公开(公告)号：US06439450B1
公开(公告)日：2002-08-27
申请号：US09940203
申请日：2001-08-27
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
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公开(公告)号：US6158647A
公开(公告)日：2000-12-12
申请号：US162649
申请日：1998-09-29
IPC分类号： B23K20/00 , H01L21/603 , H01L21/607 , B23K37/00 , B23K31/00
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , H01L24/78 , B23K2201/40 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 用于将导线接合到半导体器件的接合焊盘和引线框的引线上的改进的引线接合毛细管。 具有工作尖端的引线接合毛细管具有工作表面，该工作表面包括围绕毛细管中的送丝孔的平坦环形部分和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点的凹形表面。
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公开(公告)号：US06966480B2
公开(公告)日：2005-11-22
申请号：US10624796
申请日：2003-07-22
IPC分类号： B23K20/00 , H01L21/603 , H01L21/607 , B23K37/00 , B23K31/00
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US20080302862A1
公开(公告)日：2008-12-11
申请号：US12196696
申请日：2008-08-22
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US07416107B2
公开(公告)日：2008-08-26
申请号：US11246353
申请日：2005-10-07
IPC分类号： B23K31/02
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US06595406B2
公开(公告)日：2003-07-22
申请号：US10155317
申请日：2002-05-23
IPC分类号： B23K3102
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US06311890B1
公开(公告)日：2001-11-06
申请号：US09649209
申请日：2000-08-28
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US07677429B2
公开(公告)日：2010-03-16
申请号：US12196696
申请日：2008-08-22
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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