公开(公告)号：US08125070B2

公开(公告)日：2012-02-28

申请号：US12336862

申请日：2008-12-17

申请人： Stefan Kredler ,  Reiner Bidenbach ,  Jens Schubert ,  Klaus Heberle

发明人： Stefan Kredler ,  Reiner Bidenbach ,  Jens Schubert ,  Klaus Heberle

IPC分类号： H01L23/02

CPC分类号： H01L23/3107 ,  H01L22/34 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor component has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.

摘要翻译： 半导体部件具有至少一个集成有电路的半导体芯片。 半导体芯片由电绝缘的封装化合物包围，并且在其表面上具有至少一个终端表面用于测试信号，其被封装化合物覆盖。 端接表面以导电的方式连接到分析触点，该分析触点突出在半导体芯片的表面之上，半导体芯片的表面位于封装化合物的内部与其外表面一定距离处，并且可以通过去除 位于外部附近的封装化合物层。

公开(公告)号：US20060284612A1

公开(公告)日：2006-12-21

申请号：US11455912

申请日：2006-06-19

申请人： Reiner Bidenbach ,  Jens Schubert ,  Stefan Kredler ,  Ralf Janke

发明人： Reiner Bidenbach ,  Jens Schubert ,  Stefan Kredler ,  Ralf Janke

IPC分类号： G01R33/07

CPC分类号： G01R31/2829 ,  G01R31/2831

摘要： A method for testing a Hall magnetic field sensor on a wafer includes generating a current flow in a Hall plate of the Hall magnetic field sensor. At least one voltage value across first and second nodes is measured and a measured voltage signal is provided indicative thereof. An electrical resistance based upon the measured voltage and the current is then determined, in the absence of an applied test magnet field.

摘要翻译： 用于在晶片上测试霍尔磁场传感器的方法包括在霍尔磁场传感器的霍尔板中产生电流。 测量第一和第二节点之间的至少一个电压值，并且提供测量的电压信号来指示它们。 然后在没有施加的测试磁体场的情况下，确定基于所测量的电压和电流的电阻。

公开(公告)号：US20090152548A1

公开(公告)日：2009-06-18

申请号：US12336862

申请日：2008-12-17

申请人： Stefan Kredler ,  Reiner Bidenbach ,  Jens Schubert ,  Klaus Heberle

发明人： Stefan Kredler ,  Reiner Bidenbach ,  Jens Schubert ,  Klaus Heberle

IPC分类号： H01L27/00 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L22/34 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor component (has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.

摘要翻译： 半导体元件（具有至少一个半导体芯片，其中电路被集成在一起，半导体芯片由电绝缘封装化合物包围，并且在其表面上具有用于测试信号的至少一个端接表面，其被封装 端接表面以导电方式连接到分析触点，该分析触点突出在半导体芯片的表面之上，半导体芯片的表面位于封装化合物的内部与其外表面一定距离处，并且可以暴露于 去除位于外部附近的封装化合物层。

公开(公告)号：US07492178B2

公开(公告)日：2009-02-17

申请号：US11455912

申请日：2006-06-19

申请人： Reiner Bidenbach ,  Jens Schubert ,  Stefan Kredler ,  Ralf Janke

发明人： Reiner Bidenbach ,  Jens Schubert ,  Stefan Kredler ,  Ralf Janke

IPC分类号： G01R31/02

CPC分类号： G01R31/2829 ,  G01R31/2831

摘要： A method for testing a Hall magnetic field sensor on a wafer includes generating a current flow in a Hall plate of the Hall magnetic field sensor. At least one voltage value across first and second nodes is measured and a measured voltage signal is provided indicative thereof. An electrical resistance based upon the measured voltage and the current is then determined, in the absence of an applied test magnet field.

摘要翻译： 用于在晶片上测试霍尔磁场传感器的方法包括在霍尔磁场传感器的霍尔板中产生电流。 测量第一和第二节点之间的至少一个电压值，并且提供测量的电压信号来指示它们。 然后在没有施加的测试磁体场的情况下，确定基于所测量的电压和电流的电阻。