Method of making insulated electrical heating element using LTCC tape
    2.
    发明授权
    Method of making insulated electrical heating element using LTCC tape 失效
    使用LTCC胶带制作绝缘电加热元件的方法

    公开(公告)号:US5657532A

    公开(公告)日:1997-08-19

    申请号:US587312

    申请日:1996-01-16

    IPC分类号: H05B3/28 H05B3/78 H05B3/00

    摘要: The present invention provides a method for making an insulated electrical heating element such as for domestic appliances to heat water, etc. wherein a resistive track is embedded in a dielectric ceramic insulating material. The method includes the steps of providing a rigid base plate; printing a resistive track on one surface of a segment of flexible tape comprising fusible ceramic particles in an organic binder; adhering the other surface of the tape segment to a surface of a base plate; and placing a second segment of flexible tape of the same type on the surface with the resistive track printed thereon. Then the resulting assembly is fired to fuse the ceramic particles of the tape segments and provide a ceramic layer on the base plate with an electrical resistive track insulated therewithin.

    摘要翻译: 本发明提供一种绝缘电加热元件如家用电器加热水等的方法,其中电阻轨道嵌入电介质陶瓷绝缘材料中。 该方法包括提供刚性基板的步骤; 在包括有机粘合剂中的易熔陶瓷颗粒的柔性带的一个表面上印刷电阻轨迹; 将带段的另一表面粘附到基板的表面; 以及在其上印刷有电阻轨迹的表面上放置相同类型的柔性带的第二段。 然后将所得到的组件烧制以熔化带段的陶瓷颗粒,并在基板上提供陶瓷层,并在其上绝缘电阻轨道。

    Metallic composition and methods for making and using the same
    3.
    发明授权
    Metallic composition and methods for making and using the same 失效
    金属组成及其制造和使用方法

    公开(公告)号:US5271962A

    公开(公告)日:1993-12-21

    申请号:US915895

    申请日:1992-07-17

    申请人: John H. Alexander

    发明人: John H. Alexander

    IPC分类号: H01B1/02 H05K1/09 B05D3/02

    CPC分类号: H05K1/092 H01B1/02

    摘要: The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.

    摘要翻译: 本发明提供一种金属组合物及其制备和使用方法。 在优选的实施方案中,金属组合物形成导体路径并且结合到氮化铝的衬底上。 金属组合物包含Mo,Si,Cu和Mn。 Si可以作为MoSi 2存在于金属组合物中。 金属组合物可以通过烧结已经施加到氮化铝的衬底上的糊料来制备。 糊状物包含有机载体和金属粉末。 金属粉末优选包含约60重量%至约90重量%的Mo,约0.5重量%至约15重量%的MoSi 2,约5重量%至约20重量%的Cu和至多约20重量%的Mn。

    Dielectric compositions
    4.
    发明授权
    Dielectric compositions 失效
    介电组合物

    公开(公告)号:US4724511A

    公开(公告)日:1988-02-09

    申请号:US921162

    申请日:1986-10-20

    摘要: A dielectric composition comprising a base of non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate, lead zirconate, titanium dioxide and bismuth titanate, together with a further oxide additive, in particular nickel oxide, manganese oxide, cobalt oxide or a rare earth, has a low firing temperature (900.degree.-1000.degree. C.), high dielectric constant (up to 14,750), low tan .delta.(

    摘要翻译: 一种介电组合物,其包含非化学计量的铌酸铅镁,非化学计量的铅锌铌酸盐,锆酸铅,二氧化钛和钛酸铋,以及另外的氧化物添加剂,特别是氧化镍,氧化锰,氧化钴或稀有金属 具有低烧结温度(900°-1000℃),高介电常数(高达14,750),低tanδ(20℃时<2.5%)和Z5U电容温度系数。

    Cement compositions
    5.
    发明授权
    Cement compositions 失效
    水泥组合物

    公开(公告)号:US4127548A

    公开(公告)日:1978-11-28

    申请号:US704945

    申请日:1976-07-13

    申请人: John H. Alexander

    发明人: John H. Alexander

    摘要: Non-foaming cement compositions comprising a hydraulic cement, a low density filler, water, an organic polyisocyanate and an isocyanate-reactive organic compound, the said composition, containing by weight, 10 to 10,000 parts of filler, 10 to 75 parts of water and 11 to 5,000 parts of an organic polyisocyanate and isocyanate-reactive organic compound taken together per 100 parts of hydraulic cement, the polyisocyanate being used in excess with respect to the isocyanate-reactive compound for reaction with the water and the total amount polyisocyanate and isocyanate-reactive organic compound being greater than the amount of water present. These compositions set rapidly and provide strong, durable flooring surfaces.

    摘要翻译: 包含水硬性水泥,低密度填料,水,有机多异氰酸酯和异氰酸酯反应性有机化合物的非发泡水泥组合物,所述组合物含有10至10,000份填料,10至75份水和 相对于100份水硬性水泥将11〜5,000份有机多异氰酸酯和异氰酸酯反应性有机化合物合并在一起,相对于异氰酸酯反应性化合物使用的多异氰酸酯与水反应,总量多异氰酸酯和异氰酸酯 - 反应性有机化合物大于存在的水量。 这些组合物迅速组合并提供坚固耐用的地板表面。

    Conductive silver low temperature cofired metallic green tape
    6.
    发明授权
    Conductive silver low temperature cofired metallic green tape 失效
    导电银低温共烧金属绿带

    公开(公告)号:US5714246A

    公开(公告)日:1998-02-03

    申请号:US579076

    申请日:1995-12-22

    摘要: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

    摘要翻译: 本发明提供一种可用作多芯片模块或多层电路结构中的散热器的导热材料。 该材料通过焙烧包含包含约1重量%至约30重量%玻璃和约70重量%至约98重量%银的固体部分的组合物而形成。 玻璃的重量百分比为约5%至约60%的B2O3,约30%至约90%的SiO2,至多10%的Li2O,至多10%的Na2O,至多10%的K2O和至多10%的Al2O3。 材料可以使用选自以下的第二玻璃来形成:(i)包含重量百分比约10%至约60%的CaO,约5%至约55%的B2O3和约5%至约 55%SiO2; 和(ii)包含重量百分比为约35%至约70%SiO 2,约20%至约45%Al 2 O 3,约0%至约8%BaO和约5%至约30%MgO的玻璃。

    Dielectric composition
    7.
    发明授权
    Dielectric composition 失效
    介电组成

    公开(公告)号:US4670815A

    公开(公告)日:1987-06-02

    申请号:US892801

    申请日:1986-08-01

    CPC分类号: C04B35/497 H01G4/1254

    摘要: A dielectric composition including a ternary system comprising non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate and non-stoichiometric lead iron niobate, and a small amount of one or more oxide additives which serves to reduce the tan .delta. value in comparison with the ternary system alone. The one or more additives may be chosen from the group consisting of nickel oxide, stoichiometric lead nickel niobate, ceric oxide, lead oxide, zirconium oxide, silver oxide, manganese dioxide, lanthanum oxide and cobalt oxide. Compositions with firing temperatures in the range 950.degree. to 1100.degree. C. have dielectric constants in the range 10700 to 16600 (at 20.degree. C.) making the composition particularly useful for high silver content multilayer ceramic capacitors.

    摘要翻译: 包含非化学计量的铌酸铅镁,非化学计量的铅锌铌酸盐和非化学计量的铅铌酸铅的三元体系的电介质组合物和少量一种或多种氧化物添加剂,其用于将tanδ值与 三元系统单独。 一种或多种添加剂可以选自氧化镍,化学计量的铌酸铅,氧化铈,氧化铅,氧化锆,氧化银,二氧化锰,氧化镧和氧化钴。 烧成温度在950℃至1100℃范围内的组成物的介电常数范围为10700至16600(在20℃),使组合物对于高含量的多层陶瓷电容器尤其有用。

    Multilayer ceramic dielectric capacitors
    9.
    发明授权
    Multilayer ceramic dielectric capacitors 失效
    多层陶瓷介质电容器

    公开(公告)号:US4450502A

    公开(公告)日:1984-05-22

    申请号:US470760

    申请日:1983-02-28

    申请人: John H. Alexander

    发明人: John H. Alexander

    CPC分类号: H01G4/2325 Y10T29/435

    摘要: Conductive and porous end terminations for metal-impregnated multilayer ceramic dielectric capacitors are provided by firing a silver, or silver alloy, and glass frit onto respective end regions of a sintered capacitor stack. The exposed silver of the fired terminations is provided with a silver sulphide layer, the latter being a good electrical conductor and acting as a barrier between the silver and the impregnation metal, for example lead, during a subsequent impregnation step, whereby to prevent leaching of the silver. The termination is readily solderable by virtue of the silver sulphide layer being wetted by the lead during the impregnation step and resulting in a lead coating in the termination.

    摘要翻译: 金属浸渍的多层陶瓷介质电容器的导电和多孔端接通过将银或银合金和玻璃料烧成烧结的电容器叠层的各个端部区域来提供。 烧制终端的暴露的银提供有硫化银层,后者是良好的电导体,并且在随后的浸渍步骤期间用作银和浸渍金属(例如铅)之间的屏障,由此防止浸出 银色 由于在浸渍步骤期间由铅被硫化的硫化银层而导致终止物易于焊接,并导致终止时的铅涂层。