摘要:
The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of:A. providing a green electronic component;B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component;C. placing the green electronic component in the opening in the stack to form a structure; andD. laminating and firing the structure so as to provide the monolithic electronic structure.
摘要:
The present invention provides a method for making an insulated electrical heating element such as for domestic appliances to heat water, etc. wherein a resistive track is embedded in a dielectric ceramic insulating material. The method includes the steps of providing a rigid base plate; printing a resistive track on one surface of a segment of flexible tape comprising fusible ceramic particles in an organic binder; adhering the other surface of the tape segment to a surface of a base plate; and placing a second segment of flexible tape of the same type on the surface with the resistive track printed thereon. Then the resulting assembly is fired to fuse the ceramic particles of the tape segments and provide a ceramic layer on the base plate with an electrical resistive track insulated therewithin.
摘要:
The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.
摘要:
A dielectric composition comprising a base of non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate, lead zirconate, titanium dioxide and bismuth titanate, together with a further oxide additive, in particular nickel oxide, manganese oxide, cobalt oxide or a rare earth, has a low firing temperature (900.degree.-1000.degree. C.), high dielectric constant (up to 14,750), low tan .delta.(
摘要:
Non-foaming cement compositions comprising a hydraulic cement, a low density filler, water, an organic polyisocyanate and an isocyanate-reactive organic compound, the said composition, containing by weight, 10 to 10,000 parts of filler, 10 to 75 parts of water and 11 to 5,000 parts of an organic polyisocyanate and isocyanate-reactive organic compound taken together per 100 parts of hydraulic cement, the polyisocyanate being used in excess with respect to the isocyanate-reactive compound for reaction with the water and the total amount polyisocyanate and isocyanate-reactive organic compound being greater than the amount of water present. These compositions set rapidly and provide strong, durable flooring surfaces.
摘要:
The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.
摘要翻译:本发明提供一种可用作多芯片模块或多层电路结构中的散热器的导热材料。 该材料通过焙烧包含包含约1重量%至约30重量%玻璃和约70重量%至约98重量%银的固体部分的组合物而形成。 玻璃的重量百分比为约5%至约60%的B2O3,约30%至约90%的SiO2,至多10%的Li2O,至多10%的Na2O,至多10%的K2O和至多10%的Al2O3。 材料可以使用选自以下的第二玻璃来形成:(i)包含重量百分比约10%至约60%的CaO,约5%至约55%的B2O3和约5%至约 55%SiO2; 和(ii)包含重量百分比为约35%至约70%SiO 2,约20%至约45%Al 2 O 3,约0%至约8%BaO和约5%至约30%MgO的玻璃。
摘要:
A dielectric composition including a ternary system comprising non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate and non-stoichiometric lead iron niobate, and a small amount of one or more oxide additives which serves to reduce the tan .delta. value in comparison with the ternary system alone. The one or more additives may be chosen from the group consisting of nickel oxide, stoichiometric lead nickel niobate, ceric oxide, lead oxide, zirconium oxide, silver oxide, manganese dioxide, lanthanum oxide and cobalt oxide. Compositions with firing temperatures in the range 950.degree. to 1100.degree. C. have dielectric constants in the range 10700 to 16600 (at 20.degree. C.) making the composition particularly useful for high silver content multilayer ceramic capacitors.
摘要:
Ceramic capacitors are formed from electrodeposited ceramic dielectric layers that are provided with electrodes, stacked and fired. Contact to the electrodes is provided by each terminations and leads. As the electrodeposition process is self limiting and self heating, uniform pinhole free dielectric layers are obtained.
摘要:
Conductive and porous end terminations for metal-impregnated multilayer ceramic dielectric capacitors are provided by firing a silver, or silver alloy, and glass frit onto respective end regions of a sintered capacitor stack. The exposed silver of the fired terminations is provided with a silver sulphide layer, the latter being a good electrical conductor and acting as a barrier between the silver and the impregnation metal, for example lead, during a subsequent impregnation step, whereby to prevent leaching of the silver. The termination is readily solderable by virtue of the silver sulphide layer being wetted by the lead during the impregnation step and resulting in a lead coating in the termination.