公开(公告)号：US5570505A

公开(公告)日：1996-11-05

申请号：US455775

申请日：1995-05-31

申请人： Alan P. Downie ,  Peter Gallagher ,  John J. Garrity ,  Brian L. Robertson

发明人： Alan P. Downie ,  Peter Gallagher ,  John J. Garrity ,  Brian L. Robertson

IPC分类号： H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC分类号： H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

摘要： A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly.DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.

摘要翻译： 直接芯片连接模块（DCAM）10由在基板20上电连接到印刷电路40的一个或多个电子部件30组成.DCAM 10通过连接焊盘50结合到电子电路组件上， DCAM基板10的边缘。这使得能够容易地目视检查DCAM和组件之间的焊点。 DCAM基板10最初以面板形式70形成，并且在预定的连接点处钻出并填充有导电介质55的通孔50。 然后将DCAM 10从母板70切除，并且切割通孔沿着基板10的边缘提供连接焊盘55。

公开(公告)号：US5471368A

公开(公告)日：1995-11-28

申请号：US254342

申请日：1994-06-03

申请人： Alan P. Downie ,  Peter Gallagher ,  John J. Garrity ,  Brian L. Robertson

发明人： Alan P. Downie ,  Peter Gallagher ,  John J. Garrity ,  Brian L. Robertson

IPC分类号： H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K7/02

CPC分类号： H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

摘要： A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.

摘要翻译： 直接芯片连接模块（DCAM）10由在基板20上电连接到印刷电路40的一个或多个电子部件30组成.DCAM 10通过连接焊盘50结合到电子电路组件上， DCAM基板10的边缘。这使得能够容易地目视检查DCAM和组件之间的焊点。 DCAM基板10最初以面板形式70形成，并且在预定的连接点处钻出并填充有导电介质55的通孔50。 然后将DCAM 10从母板70切除，并且切割通孔沿着基板10的边缘提供连接焊盘55。

公开(公告)号：US4281813A

公开(公告)日：1981-08-04

申请号：US085249

申请日：1979-10-16

申请人： John J. Garrity

发明人： John J. Garrity

IPC分类号： B65B67/12 ,  A63B55/04

CPC分类号： B65F1/06 ,  B65B67/1205 ,  B65F1/1468 ,  B65F2220/1063 ,  Y10S220/908

摘要： A lightweight bag holder made from at least one section. The section of the bag holder has a first vertical edge, second vertical edge and a bag holding edge. The bag holder has a releasable connecting means which allows the first vertical edge to be moved away from the second vertical edge to form a second mouth. The second mouth allows lateral removal of the bag from the bag holder. The size of the first mouth of the bag holder can be varied to accommodate different sized bags.

摘要翻译： 由至少一个部分制成的轻便袋支架。 袋保持器的部分具有第一垂直边缘，第二垂直边缘和袋保持边缘。 袋保持器具有可释放的连接装置，其允许第一垂直边缘从第二垂直边缘移开以形成第二口。 第二口允许袋从袋保持器侧向移除。 袋保持器的第一口的尺寸可以变化以适应不同尺寸的袋。