公开(公告)号：US20120119385A1

公开(公告)日：2012-05-17

申请号：US13109996

申请日：2011-05-17

申请人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Elleen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

发明人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Elleen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

IPC分类号： H01L23/52 ,  H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

摘要： Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

摘要翻译： 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。

公开(公告)号：US09153517B2

公开(公告)日：2015-10-06

申请号：US13109996

申请日：2011-05-17

申请人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

发明人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

摘要： Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

摘要翻译： 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。