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公开(公告)号：US06990816B1
公开(公告)日：2006-01-31
申请号：US11022391
申请日：2004-12-22
申请人： Jon Zuo , David Sarraf
发明人： Jon Zuo , David Sarraf
IPC分类号： F25B21/02
CPC分类号： B64G1/50 , F25B21/02 , F25B25/00 , F25B39/02 , F25B2339/021 , F28D15/0266 , F28D15/046
摘要： The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump that supplies liquid from the reservoir to the evaporator and the second loop also returns excess liquid not vaporized to the reservoir. An optional reservoir cooler can be used to assure that the reservoir temperature and vapor pressure are always lower that the temperatures and pressures of the evaporator and condenser.
摘要翻译： 该装置是混合式冷却器，其包括一个回路，在该回路中，加热的蒸发器形成蒸气，由于蒸汽压力也会将冷凝物从冷凝器驱动到液体储存器。 第二回路由机械泵提供动力，泵将液体从储存器提供给蒸发器，第二回路还返回多余的液体，而不会蒸发到储存器中。 可以使用可选的储存器冷却器来确保储存器温度和蒸气压力总是低于蒸发器和冷凝器的温度和压力。
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公开(公告)号：US20050139995A1
公开(公告)日：2005-06-30
申请号：US11065465
申请日：2005-02-24
申请人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
发明人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
IPC分类号： F28D15/02 , H01L23/427 , H01L23/10 , H01L23/34
CPC分类号： F28D15/04 , F28D15/02 , F28D15/0275 , F28D15/0283 , F28F1/003 , F28F1/24 , F28F21/02 , F28F21/081 , F28F21/085 , F28F2220/00 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
摘要翻译： 公开了具有与硅的热膨胀系数匹配的安装表面的散热器。 公开了可以直接安装到硅半导体器件的具有分层复合材料或整体复合材料的低膨胀系数散热器的热管。
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公开(公告)号：US20050082043A1
公开(公告)日：2005-04-21
申请号：US10924586
申请日：2004-08-24
申请人： David Sarraf
发明人： David Sarraf
IPC分类号： F28D15/02 , H01L23/427 , F28D15/00
CPC分类号： F28D15/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.
摘要翻译： 公开了具有与硅的热膨胀系数匹配的安装面的热管，该热管包括含有氮化铝的基体，金属体和金属芯。
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公开(公告)号：US06793009B1
公开(公告)日：2004-09-21
申请号：US10458168
申请日：2003-06-10
申请人： David Sarraf
发明人： David Sarraf
IPC分类号： F28D1500
CPC分类号： F28D15/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.
摘要翻译： 公开了具有与硅的热膨胀系数匹配的安装面的热管，该热管包括含有氮化铝的基体，金属体和金属芯。
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公开(公告)号：US20170176112A1
公开(公告)日：2017-06-22
申请号：US15448949
申请日：2017-03-03
申请人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
发明人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
IPC分类号： F28D15/04 , H01L23/427 , F28F21/08 , F28F1/00 , F28F1/24
CPC分类号： F28D15/04 , F28D15/02 , F28D15/0275 , F28D15/0283 , F28F1/003 , F28F1/24 , F28F21/02 , F28F21/081 , F28F21/085 , F28F2220/00 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
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公开(公告)号：US07748436B1
公开(公告)日：2010-07-06
申请号：US11416731
申请日：2006-05-03
CPC分类号： F28D15/0266 , F28D15/046
摘要： The apparatus is a capillary loop evaporator in which the vapor space is the internal volume of a cup shaped evaporator wick with sidewalls in full contact with the outer casing of the evaporator. Liquid is furnished to the wick through thicker wick wall sections, slabs protruding from the liquid-vapor barrier wick, eccentric wick cross sections, or tunnel arteries. The tunnel arteries can also be formed within heat flow reducing ridges protruding into the vapor space. The tunnel arteries can be fed liquid by bayonet tubes or cable arteries, and can be isolated from the heat source with regions of finer wick to impede vapor flow into the liquid. Tunnel arteries also enable separation of the evaporator and the reservoir for thermal isolation and structural flexibility. A wick within the reservoir aids collection of liquid in low gravity applications.
摘要翻译： 该装置是毛细管回路蒸发器，其中蒸气空间是具有与蒸发器的外壳完全接触的侧壁的杯形蒸发器芯的内部容积。 液体通过较厚的芯壁部分，液体蒸汽屏障芯，偏心芯横截面或隧道动脉突出的板坯提供到芯。 隧道动脉也可以形成在突出到蒸气空间中的热流减少脊内。 隧道动脉可以通过卡口管或电缆动脉进行液体输送，并且可以从较热的芯部区域与热源隔离，以阻止蒸气流入液体。 隧道动脉还能够分离蒸发器和储存器以进行热隔离和结构灵活性。 蓄水池内的一个灯芯可帮助低重力应用中的液体收集。
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公开(公告)号：US06712128B1
公开(公告)日：2004-03-30
申请号：US10300094
申请日：2002-11-20
申请人： Peter M. Dussinger , David Sarraf
发明人： Peter M. Dussinger , David Sarraf
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An air flow apparatus including an elongate post and a plurality of fin disks disposed on the elongate post, each fin disk including a centrally disposed opening therein for receiving the elongate post, and a plurality of flow openings disposed around the periphery of the centrally disposed opening. The air flow apparatus is preferably used in conjunction with a circulation device to form a heat exchanger.
摘要翻译： 一种空气流动装置，包括细长柱和设置在细长柱上的多个翅片盘，每个鳍盘包括其中的中心设置的开口，用于接收细长柱;以及多个流动开口，围绕中心设置的开口 。 空气流动装置优选与循环装置一起使用以形成热交换器。
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公开(公告)号：US09953845B2
公开(公告)日：2018-04-24
申请号：US13242240
申请日：2011-09-23
申请人： Charles Randall Malstrom , David Sarraf , Miguel Angel Morales , Leonard Henry Radzilowski , Michael Fredrick Laub
发明人： Charles Randall Malstrom , David Sarraf , Miguel Angel Morales , Leonard Henry Radzilowski , Michael Fredrick Laub
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： H01L21/4846 , H01L23/4985 , H01L2924/0002 , Y10T29/49117 , Y10T29/49156 , H01L2924/00
摘要： A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.
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公开(公告)号：US20110176276A1
公开(公告)日：2011-07-21
申请号：US13074987
申请日：2011-03-29
申请人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
发明人： David Sarraf , John Hartenstine , Jerome Toth , Scott Garner
CPC分类号： F28D15/04 , F28D15/02 , F28D15/0275 , F28D15/0283 , F28F1/003 , F28F1/24 , F28F21/02 , F28F21/081 , F28F21/085 , F28F2220/00 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
摘要翻译： 公开了具有与硅的热膨胀系数匹配的安装表面的散热器。 公开了可以直接安装到硅半导体器件的具有分层复合材料或整体复合材料的低膨胀系数散热器的热管。
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公开(公告)号：US07048039B2
公开(公告)日：2006-05-23
申请号：US10924586
申请日：2004-08-24
申请人： David Sarraf
发明人： David Sarraf
IPC分类号： F28D15/00
CPC分类号： F28D15/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.
摘要翻译： 公开了具有与硅的热膨胀系数匹配的安装面的热管，该热管包括含有氮化铝的基体，金属体和金属芯。
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