HEIGHT-EXTENSIBLE CONTAINER-TYPE WAREHOUSE
    1.
    发明申请
    HEIGHT-EXTENSIBLE CONTAINER-TYPE WAREHOUSE 有权
    高可膨胀集装箱型仓库

    公开(公告)号:US20160332812A1

    公开(公告)日:2016-11-17

    申请号:US15112777

    申请日:2015-01-14

    IPC分类号: B65D90/00 B65D88/00 B65G1/04

    摘要: The present invention relates to a height-extensible container-type warehouse that is manufactured in a container type at a factory, can be transported to a desired place, and can be increased in height at the place by coupling a section, which exceeds a height limit under the Road Traffic Act and is separately manufactured, to an opening of the warehouse in order to increase the height thereof.

    摘要翻译: 本发明涉及一种在出厂时以容器类型制造的高度可伸缩的容器式仓库,可以运送到所需的位置,并且可以通过将一个高度超过高度 道路交通法规限制,并单独制造,以提高仓库的高度。

    Method for manufacturing silicon carbide schottky barrier diode
    2.
    发明授权
    Method for manufacturing silicon carbide schottky barrier diode 有权
    制造碳化硅肖特基势垒二极管的方法

    公开(公告)号:US08980732B2

    公开(公告)日:2015-03-17

    申请号:US13372931

    申请日:2012-02-14

    摘要: The present invention provides a method for manufacturing a silicon carbide Schottky barrier diode. In the method, an n− epitaxial layer is deposited on an n+ substrate. A sacrificial oxide film is formed on the n− epitaxial layer by heat treatment, and then a portion where a composite oxide film is to be formed is exposed by etching. Nitrogen is implanted into the n− epitaxial layer and the sacrificial oxide film using nitrogen plasma. A silicon nitride is deposited on the n− epitaxial layer and the sacrificial oxide film. The silicon nitride is thermally oxidized to form a composite oxide film. An oxide film in a portion where a Schottky metal is to be deposited is etched, and then the Schottky metal is deposited, thereby forming a silicon carbide Schottky barrier diode.

    摘要翻译: 本发明提供一种制造碳化硅肖特基势垒二极管的方法。 在该方法中,在n +衬底上沉积n-外延层。 通过热处理在n外延层上形成牺牲氧化膜,然后通过蚀刻暴露要形成复合氧化物膜的部分。 使用氮等离子体将氮注入到n外延层和牺牲氧化膜中。 氮化硅沉积在n外延层和牺牲氧化膜上。 氮化硅被热氧化以形成复合氧化膜。 对要沉积肖特金属的部分中的氧化膜进行蚀刻,然后沉积肖特基金属,从而形成碳化硅肖特基势垒二极管。

    Silicon carbide Schottky-barrier diode device and method for manufacturing the same
    3.
    发明授权
    Silicon carbide Schottky-barrier diode device and method for manufacturing the same 失效
    碳化硅肖特基势垒二极管器件及其制造方法

    公开(公告)号:US08779439B2

    公开(公告)日:2014-07-15

    申请号:US13371702

    申请日:2012-02-13

    IPC分类号: H01L29/872

    摘要: The present invention provides a silicon carbide Schottky-barrier diode device and a method for manufacturing the same. The silicon carbide Schottky bather diode device includes a primary n− epitaxial layer, an n+ epitaxial region, and a Schottky metal layer. The primary n− epitaxial layer is deposited on an n+ substrate joined with an ohmic metal layer at an undersurface thereof. The n+ epitaxial region is formed by implanting n+ ions into a central region of the primary n− epitaxial layer. The Schottky metal layer is deposited on the n+ epitaxial layer.

    摘要翻译: 本发明提供一种碳化硅肖特基势垒二极管器件及其制造方法。 碳化硅肖特基二极体装置包括初级n外延层,n +外延区和肖特基金属层。 主n外延层沉积在与欧姆金属层的下表面连接的n +衬底上。 通过将n +离子注入初级n外延层的中心区域来形成n +外延区域。 肖特基金属层沉积在n +外延层上。

    METHOD FOR MANUFACTURING SILICON CARBIDE SCHOTTKY BARRIER DIODE
    5.
    发明申请
    METHOD FOR MANUFACTURING SILICON CARBIDE SCHOTTKY BARRIER DIODE 有权
    制造碳化硅肖特基二极管的方法

    公开(公告)号:US20130115758A1

    公开(公告)日:2013-05-09

    申请号:US13372931

    申请日:2012-02-14

    IPC分类号: H01L21/20

    摘要: The present invention provides a method for manufacturing a silicon carbide Schottky barrier diode. In the method, an n− epitaxial layer is deposited on an n+ substrate. A sacrificial oxide film is formed on the n− epitaxial layer by heat treatment, and then a portion where a composite oxide film is to be formed is exposed by etching. Nitrogen is implanted into the n− epitaxial layer and the sacrificial oxide film using nitrogen plasma. A silicon nitride is deposited on the n− epitaxial layer and the sacrificial oxide film. The silicon nitride is thermally oxidized to form a composite oxide film. An oxide film in a portion where a Schottky metal is to be deposited is etched, and then the Schottky metal is deposited, thereby forming a silicon carbide Schottky barrier diode.

    摘要翻译: 本发明提供一种制造碳化硅肖特基势垒二极管的方法。 在该方法中,在n +衬底上沉积n-外延层。 通过热处理在n外延层上形成牺牲氧化膜,然后通过蚀刻暴露要形成复合氧化物膜的部分。 使用氮等离子体将氮注入到n外延层和牺牲氧化膜中。 氮化硅沉积在n外延层和牺牲氧化膜上。 氮化硅被热氧化以形成复合氧化膜。 对要沉积肖特金属的部分中的氧化膜进行蚀刻,然后沉积肖特基金属,从而形成碳化硅肖特基势垒二极管。

    Method and system for compressing and decoding mesh data with random accessibility in three-dimensional mesh model
    7.
    发明授权
    Method and system for compressing and decoding mesh data with random accessibility in three-dimensional mesh model 有权
    在三维网格模型中对随机可达性的网格数据进行压缩和解码的方法和系统

    公开(公告)号:US08593455B2

    公开(公告)日:2013-11-26

    申请号:US12345076

    申请日:2008-12-29

    IPC分类号: G06T15/00

    摘要: A method and system to compress and decode mesh data with random accessibility in a three-dimensional mesh model, the system to compress mesh data with random accessibility in a three-dimensional mesh model including: a mesh data acquisition unit to acquire mesh data from a three-dimensional mesh model having a plurality of cells; a wire mesh generation unit to generate a wire mesh including a plurality of wire cells by using the mesh data, each wire cell including at least two cells of the plurality of cells; a data structure generation unit to generate wire mesh information on the wire mesh and wire cell data including mesh data of the respective wire cells; and an encoding unit to compress the generated wire mesh information and the generated wire cell data.

    摘要翻译: 一种用于在三维网格模型中对具有随机可访问性的网格数据进行压缩和解码的方法和系统,所述系统在三维网格模型中压缩具有随机可访问性的网格数据,包括:网格数据获取单元,用于从 具有多个单元的三维网格模型; 线网产生单元,通过使用网格数据生成包括多个有线单元的线网,每个线单元包括所述多个单元中的至少两个单元; 一种数据结构生成单元,用于生成关于所述有线网格的有线网格信息和包括各个线单元的网格数据的有线单元数据; 以及编码单元,用于压缩生成的网格信息和生成的有线单元数据。

    LATERAL DOUBLE DIFFUSION METAL-OXIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LATERAL DOUBLE DIFFUSION METAL-OXIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    横向双重扩散金属氧化物半导体器件及其制造方法

    公开(公告)号:US20130126969A1

    公开(公告)日:2013-05-23

    申请号:US13406726

    申请日:2012-02-28

    IPC分类号: H01L29/78

    摘要: Disclosed is an LDMOS device, which is configured to reduce an electric field concentrated to a gate oxide film and lower an ON-resistance produced when the device conducts a forward action, and a method for manufacturing the same. More specifically, when an n-drift region is formed on a P-type substrate, a p-body is formed on the n-drift region through an epitaxial process, and then the p-body region is partially etched to form a plurality of p-epitaxial layers, so that when the device executes an action for blocking a reverse voltage, depletion layers are formed between the junction surfaces of the p-epitaxial layers and the n-drift region including the junction surfaces between the n-drift region and the p-body.

    摘要翻译: 公开了一种LDMOS器件,其被配置为减少集中到栅极氧化物膜的电场并降低当器件进行正向动作时产生的导通电阻及其制造方法。 更具体地,当在P型衬底上形成n漂移区时,通过外延工艺在n漂移区上形成p体,然后部分蚀刻p体区以形成多个 使得当器件执行用于阻止反向电压的动作时,在p-外延层的连接表面和n漂移区之间形成耗尽层,该n-漂移区域包括n-漂移区和 p体。

    SILICON CARBIDE SCHOTTKY-BARRIER DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    SILICON CARBIDE SCHOTTKY-BARRIER DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
    硅碳化硅肖特基二极管器件及其制造方法

    公开(公告)号:US20130112991A1

    公开(公告)日:2013-05-09

    申请号:US13371702

    申请日:2012-02-13

    IPC分类号: H01L29/872 H01L21/329

    摘要: The present invention provides a silicon carbide Schottky-barrier diode device and a method for manufacturing the same. The silicon carbide Schottky bather diode device includes a primary n− epitaxial layer, an n+ epitaxial region, and a Schottky metal layer. The primary n− epitaxial layer is deposited on an n+ substrate joined with an ohmic metal layer at an undersurface thereof. The n+ epitaxial region is formed by implanting n+ ions into a central region of the primary n− epitaxial layer. The Schottky metal layer is deposited on the n+ epitaxial layer.

    摘要翻译: 本发明提供一种碳化硅肖特基势垒二极管器件及其制造方法。 碳化硅肖特基二极体装置包括初级n外延层,n +外延区和肖特基金属层。 主n外延层沉积在与欧姆金属层的下表面连接的n +衬底上。 通过将n +离子注入初级n外延层的中心区域来形成n +外延区域。 肖特基金属层沉积在n +外延层上。

    Lateral double diffusion metal-oxide semiconductor device and method for manufacturing the same
    10.
    发明授权
    Lateral double diffusion metal-oxide semiconductor device and method for manufacturing the same 有权
    横向双扩散金属氧化物半导体器件及其制造方法

    公开(公告)号:US08674436B2

    公开(公告)日:2014-03-18

    申请号:US13406726

    申请日:2012-02-28

    IPC分类号: H01L29/78 H01L29/06

    摘要: Disclosed is an LDMOS device, which is configured to reduce an electric field concentrated to a gate oxide film and lower an ON-resistance produced when the device conducts a forward action, and a method for manufacturing the same. More specifically, when an n-drift region is formed on a P-type substrate, a p-body is formed on the n-drift region through an epitaxial process, and then the p-body region is partially etched to form a plurality of p-epitaxial layers, so that when the device executes an action for blocking a reverse voltage, depletion layers are formed between the junction surfaces of the p-epitaxial layers and the n-drift region including the junction surfaces between the n-drift region and the p-body.

    摘要翻译: 公开了一种LDMOS器件,其被配置为减少集中到栅极氧化物膜的电场并降低当器件进行正向动作时产生的导通电阻及其制造方法。 更具体地,当在P型衬底上形成n漂移区时,通过外延工艺在n漂移区上形成p体,然后部分蚀刻p体区以形成多个 使得当器件执行用于阻止反向电压的动作时,在p-外延层的连接表面和n漂移区之间形成耗尽层,该n-漂移区域包括n-漂移区和 p体。