METHOD OF FABRICATING A NONVOLATILE MEMORY DEVICE
    2.
    发明申请
    METHOD OF FABRICATING A NONVOLATILE MEMORY DEVICE 有权
    制造非易失性存储器件的方法

    公开(公告)号:US20120122297A1

    公开(公告)日:2012-05-17

    申请号:US13198157

    申请日:2011-08-04

    IPC分类号: H01L21/762

    摘要: A method of fabricating a nonvolatile memory device includes providing a substrate having active regions defined by a plurality of trenches, forming a first isolation layer on the substrate having the plurality of trenches, forming a sacrificial layer on the first isolation layer to fill the trenches, the sacrificial layer including a first region filling lower portions of the trenches and a second region filling portions other than the lower portions, removing the second region of the sacrificial layer, forming a second isolation layer on the first isolation layer and the first region of the sacrificial layer, forming air gaps in the trenches by removing the first region of the sacrificial layer, and removing a portion of the first isolation layer and a portion of the second isolation layer while maintaining the air gaps.

    摘要翻译: 一种制造非易失性存储器件的方法包括提供具有由多个沟槽限定的有源区的衬底,在具有多个沟槽的衬底上形成第一隔离层,在第一隔离层上形成牺牲层以填充沟槽, 所述牺牲层包括填充所述沟槽的下部的第一区域和除所述下部以外的第二区域填充部分,去除所述牺牲层的所述第二区域,在所述第一隔离层上形成第二隔离层和在所述第一隔离层的所述第一区域 牺牲层,通过去除牺牲层的第一区域在沟槽中形成气隙,以及在保持气隙的同时去除第一隔离层的一部分和第二隔离层的一部分。

    Semiconductor Memory Device and Method for Arranging and Manufacturing the Same
    3.
    发明申请
    Semiconductor Memory Device and Method for Arranging and Manufacturing the Same 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号:US20090224330A1

    公开(公告)日:2009-09-10

    申请号:US12468415

    申请日:2009-05-19

    摘要: A semiconductor memory device and method of manufacturing the same are disclosed. The semiconductor memory device includes a semiconductor substrate having a cell region and a peripheral circuit region, first transistors provided on the semiconductor substrate, a first semiconductor layer provided on the first transistors, and bonded by a bonding technique, and second transistors provided on the first semiconductor layer, wherein the first and second transistors are provided in the peripheral circuit regions of the semiconductor substrate and the first semiconductor layer, respectively, and a metal layer is formed on gates of the first and second transistors respectively provided in the peripheral circuit regions of the semiconductor substrate and the first semiconductor layer. As a result, the transistors in the peripheral circuit region requiring high performance can be formed on an upper layer and a lower layer.

    摘要翻译: 公开了一种半导体存储器件及其制造方法。 半导体存储器件包括具有单元区域和外围电路区域的半导体衬底,设置在半导体衬底上的第一晶体管,设置在第一晶体管上的第一半导体层,并通过接合技术接合,第二晶体管设置在第一晶体管上 半导体层,其中第一和第二晶体管分别设置在半导体衬底和第一半导体层的外围电路区域中,并且在分别设置在半导体衬底的外围电路区域中的第一和第二晶体管的栅极上形成金属层 半导体衬底和第一半导体层。 结果,可以在上层和下层上形成需要高性能的外围电路区域中的晶体管。

    Method of fabricating a nonvolatile memory device
    5.
    发明授权
    Method of fabricating a nonvolatile memory device 有权
    制造非易失性存储器件的方法

    公开(公告)号:US08748286B2

    公开(公告)日:2014-06-10

    申请号:US13198157

    申请日:2011-08-04

    IPC分类号: H01L21/76 H01L29/00

    摘要: A method of fabricating a nonvolatile memory device includes providing a substrate having active regions defined by a plurality of trenches, forming a first isolation layer on the substrate having the plurality of trenches, forming a sacrificial layer on the first isolation layer to fill the trenches, the sacrificial layer including a first region filling lower portions of the trenches and a second region filling portions other than the lower portions, removing the second region of the sacrificial layer, forming a second isolation layer on the first isolation layer and the first region of the sacrificial layer, forming air gaps in the trenches by removing the first region of the sacrificial layer, and removing a portion of the first isolation layer and a portion of the second isolation layer while maintaining the air gaps.

    摘要翻译: 一种制造非易失性存储器件的方法包括提供具有由多个沟槽限定的有源区的衬底,在具有多个沟槽的衬底上形成第一隔离层,在第一隔离层上形成牺牲层以填充沟槽, 所述牺牲层包括填充所述沟槽的下部的第一区域和除所述下部以外的第二区域填充部分,去除所述牺牲层的所述第二区域,在所述第一隔离层上形成第二隔离层和在所述第一隔离层的所述第一区域 牺牲层,通过去除牺牲层的第一区域在沟槽中形成气隙,以及在保持气隙的同时去除第一隔离层的一部分和第二隔离层的一部分。

    NAND FLASH MEMORY DEVICE
    6.
    发明申请
    NAND FLASH MEMORY DEVICE 有权
    NAND闪存存储器件

    公开(公告)号:US20140231953A1

    公开(公告)日:2014-08-21

    申请号:US14248517

    申请日:2014-04-09

    IPC分类号: H01L27/02 H01L27/11

    摘要: A method of fabricating a nonvolatile memory device includes providing a substrate having active regions defined by a plurality of trenches, forming a first isolation layer on the substrate having the plurality of trenches, forming a sacrificial layer on the first isolation layer to fill the trenches, the sacrificial layer including a first region filling lower portions of the trenches and a second region filling portions other than the lower portions, removing the second region of the sacrificial layer, forming a second isolation layer on the first isolation layer and the first region of the sacrificial layer, forming air gaps in the trenches by removing the first region of the sacrificial layer, and removing a portion of the first isolation layer and a portion of the second isolation layer while maintaining the air gaps.

    摘要翻译: 一种制造非易失性存储器件的方法包括提供具有由多个沟槽限定的有源区的衬底,在具有多个沟槽的衬底上形成第一隔离层,在第一隔离层上形成牺牲层以填充沟槽, 所述牺牲层包括填充所述沟槽的下部的第一区域和除所述下部以外的第二区域填充部分,去除所述牺牲层的所述第二区域,在所述第一隔离层上形成第二隔离层和在所述第一隔离层的所述第一区域 牺牲层,通过去除牺牲层的第一区域在沟槽中形成气隙,以及在保持气隙的同时去除第一隔离层的一部分和第二隔离层的一部分。