Manufacture of devices including solder bumps
    4.
    发明授权
    Manufacture of devices including solder bumps 有权
    制造包括焊料凸点的器件

    公开(公告)号:US07727781B2

    公开(公告)日:2010-06-01

    申请号:US12220182

    申请日:2008-07-22

    IPC分类号: G01L31/26 H01L21/66

    摘要: Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.

    摘要翻译: 焊接接头(例如印刷电路板焊盘处的接头)的典型测试尚未被证明完全可以预测这种接头的最终性能。 已经发现,这种缺乏可靠性至少部分地是由于这些焊盘在测试期间失去与下面的衬底的粘附或分层的倾向。 相比之下,这种情况并不是典型的设备使用期间引起的现象。 为了消除这种不可靠性的原因,测试结构与制造设备批次一起进行。 使用相同的焊盘处理,并且焊盘尺寸在测试结构中大大扩大。 测试结构用于预测批次中的设备的性能,然后相应地处理批次。